CODEBOOK SUBSET RESTRICTION DESIGN FOR MIMO

    公开(公告)号:US20210159953A1

    公开(公告)日:2021-05-27

    申请号:US16640150

    申请日:2018-09-11

    Abstract: Aspects of the present disclosure relate to techniques for codebook subset restriction (CSR). In some cases, a user equipment (UE) receives, from a network entity, codebook subset restriction (CSR) information. The UE determines, based on the CSR information, a restricted beam set for a plurality of antenna panels, determines precoding matrix indicator (PMI) feedback for the antenna panels subject to restricted beam set, and provides the PMI feedback to the network entity.

    PARTIAL BAND CONFIGURATION FOR CHANNEL STATE INFORMATION

    公开(公告)号:US20200084787A1

    公开(公告)日:2020-03-12

    申请号:US16610989

    申请日:2018-08-11

    Inventor: Chenxi HAO Yu ZHANG

    Abstract: Methods, systems, and devices for wireless communication are described that provide for the utilization of multiple partial bands used in the transmission of one or more channel state information (CSI) reference signals (CSI-RSs). The partial bands may be non-consecutive in the frequency domain, time domain, or a combination thereof and each of which may be precoder using a different precoder configuration. The time intervals, cycling granularity, and number of ports may vary between partial bands. Using RSs transmitted via the multiple partial bands, a user equipment (UE) may determine a channel state parameter for each partial band, which may be used for channel feedback.

    PRINTED CIRCUIT BOARD (PCB) WITH STUBS COUPLED TO ELECTROMAGNETIC ABSORBING MATERIAL

    公开(公告)号:US20190208619A1

    公开(公告)日:2019-07-04

    申请号:US16214745

    申请日:2018-12-10

    Abstract: Disclosed is a printed circuit board (PCB) including a set of stacked metallization layers separated by a set of stacked electrical-insulating layers, respectively, wherein the set of stacked metallization layers includes top metallization layer, bottom metallization layer, and intermediate metallization layer; a via electrically coupled to the top metallization layer, the intermediate metallization layer, and the bottom metallization layer, wherein the top metallization layer, a portion of the via between the top metallization layer and the intermediate metallization layer, and the intermediate metallization layer are configured to route a data signal between a signal-in and a signal-out; and an electromagnetic absorbing material configured to reduce an intensity of a reflected signal resulting from the data signal propagating downward along a stub of the via and reflecting off the bottom metallization layer. The electromagnetic absorbing material may be attached to a bottom of the PCB and/or coaxially attached to the stub.

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