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61.
公开(公告)号:US20180035032A1
公开(公告)日:2018-02-01
申请号:US15679153
申请日:2017-08-17
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Zhenyu CHEN , Nan GUO , Takehiko TANAKA , Bojie ZHAO , Zilong DENG
CPC classification number: H04N5/2257 , B29C33/44 , B29C43/18 , B29C43/36 , B29C43/52 , B29C45/0025 , B29C45/14336 , B29C45/14467 , B29C45/14655 , B29C45/14819 , B29C45/40 , B29C70/72 , B29C70/88 , B29D11/00807 , B29K2101/12 , B29K2995/0003 , B29K2995/0018 , B29L2031/3425 , B29L2031/3437 , B29L2031/764 , G02B7/022 , G02B7/10 , G02B13/0085 , H04N5/2253 , H04N5/2254 , H05K1/0274 , H05K1/181 , H05K1/185 , H05K3/284 , H05K2201/10121 , H05K2203/0195 , H05K2203/1316 , H05K2203/1327
Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号:US20170353646A1
公开(公告)日:2017-12-07
申请号:US15627408
申请日:2017-06-19
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Nan GUO , Takehiko TANAKA
IPC: H04N5/225 , H05K1/18 , H01L27/146
CPC classification number: H04N5/2254 , G02B5/208 , G02B7/006 , G02B7/02 , G02B7/09 , G03B13/36 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/14645 , H02K41/0354 , H02N2/026 , H04N5/2253 , H04N5/2257 , H04N5/2258 , H04N5/247 , H05K1/0274 , H05K1/181 , H05K1/182 , H05K2201/10083 , H05K2201/10121 , H05K2201/10151 , H05K2201/10522
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
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公开(公告)号:US20170353644A1
公开(公告)日:2017-12-07
申请号:US15627425
申请日:2017-06-19
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Nan GUO , Takehiko TANAKA
CPC classification number: H04N5/2254 , G02B5/208 , G02B7/006 , G02B7/02 , G02B7/09 , G03B13/36 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/14645 , H02K41/0354 , H02N2/026 , H04N5/2253 , H04N5/2257 , H04N5/2258 , H04N5/247 , H05K1/0274 , H05K1/181 , H05K1/182 , H05K2201/10083 , H05K2201/10121 , H05K2201/10151 , H05K2201/10522
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
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公开(公告)号:US20170353640A1
公开(公告)日:2017-12-07
申请号:US15627418
申请日:2017-06-19
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Nan GUO , Takehiko TANAKA
IPC: H04N5/225 , H01L27/146 , H02N2/02 , G02B7/09 , H02K41/035 , G02B5/20
CPC classification number: H04N5/2254 , G02B5/208 , G02B7/006 , G02B7/02 , G02B7/09 , G03B13/36 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/14645 , H02K41/0354 , H02N2/026 , H04N5/2253 , H04N5/2257 , H04N5/2258 , H04N5/247 , H05K1/0274 , H05K1/181 , H05K1/182 , H05K2201/10083 , H05K2201/10121 , H05K2201/10151 , H05K2201/10522
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
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公开(公告)号:US20170310860A1
公开(公告)日:2017-10-26
申请号:US15627437
申请日:2017-06-19
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Nan GUO , Takehiko TANAKA
IPC: H04N5/225 , H01L27/146 , G02B13/00 , H04N9/04
CPC classification number: H04N5/2254 , G02B13/006 , G02B13/0085 , H01L27/14618 , H04N5/2253 , H04N5/2257 , H04N5/247 , H04N9/04
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
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公开(公告)号:US20170244878A1
公开(公告)日:2017-08-24
申请号:US15460216
申请日:2017-03-15
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Takehiko TANAKA , Nan GUO , Zhen HUANG , Duanliang CHENG , Liang DING , Feifan CHEN , Heng JIANG
CPC classification number: H04N5/2257 , G02B7/021 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0274 , H05K2201/10121
Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
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公开(公告)号:US20240295714A1
公开(公告)日:2024-09-05
申请号:US18661078
申请日:2024-05-10
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Yinli FANG , Heng JIANG , Takehiko TANAKA , Lin LIU , Shuijia CHU
Abstract: An optical lens is provided, including one first lens sheet having a first optical zone and a first structural zone; a second lens component, including a second lens barrel and at least one second lens sheet mounted in the second lens barrel, the second lens sheet has a second optical zone and a second structural zone, the second structural zone and the second lens barrel constitute a structural zone of the second lens component, and there is a first gap between a top surface of the structural zone and a bottom surface of the first structural zone; and a first glue material, located in the first gap. The first glue material extends outwardly along the top surface of the structural zone of the second lens component and covers at least a part of an outer lateral side surface of the first structural zone.
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68.
公开(公告)号:US20230207588A1
公开(公告)日:2023-06-29
申请号:US18118264
申请日:2023-03-07
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor: Mingzhu WANG , Takehiko TANAKA , Lifeng YAO , Zhen HUANG , Nan GUO , Xiaodi LIU , Zhenyu CHEN
IPC: H01L27/146
CPC classification number: H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L27/14687
Abstract: Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.
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公开(公告)号:US20220334342A1
公开(公告)日:2022-10-20
申请号:US17640526
申请日:2020-08-28
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Zhewen MEI , Haipeng PEI , Takehiko TANAKA , Renkang LIN , Hui LI , Lei WANG
Abstract: An optical lens (1), comprising a first lens (100) and a lens assembly (110). The first lens (100) includes a first optical area (101) and a first structural area (102) surrounding the first optical area (101), and the first structure area (102) includes a height measurement area (103) not coated with an anti-reflective coating. The lens assembly (110) includes a lens barrel (104) and at least one second lens (105) disposed in the lens barrel (104). The at least one second lens (105) includes a second optical area (106) and a second structural area (107) surrounding the second optical area (106). The first structural area (102) is connected to an end face (109) of the lens barrel (104) near the first lens (100) or the second structural area (107) of the second lens (105) closest to the first lens (100). A manufacturing method of optical lens (1) and a camera module are also disclosed.
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公开(公告)号:US20220303441A1
公开(公告)日:2022-09-22
申请号:US17833025
申请日:2022-06-06
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor: Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Nan GUO , Takehiko TANAKA
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
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