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    Fuel vaporization using data center waste heat
    61.
    发明授权
    Fuel vaporization using data center waste heat 有权
    燃料蒸发利用数据中心废热

    公开(公告)号：US09546576B2

    公开(公告)日：2017-01-17

    申请号：US14829869

    申请日：2015-08-19

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20 ,  F01K25/08 ,  H02P9/04

    CPC classification number: F01K25/08 ,  F01K5/00 ,  F25B15/00 ,  F25B19/00 ,  F25B27/02 ,  F25B49/00 ,  H02P9/04 ,  H05K7/20709 ,  H05K7/20818 ,  H05K7/20836

    Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

    Abstract translation: 通过使用数据中心废热汽化燃料，为数据中心冷却提供了系统和方法。 该系统包括例如发电组件，液体燃料储存器和传热系统。 发电组件从燃料蒸汽发电，供给数据中心。 液体燃料储存器连接以供应燃料蒸汽，并且传热系统与数据中心和液体燃料储存器相关联。 在操作模式中，传热系统将数据中心废热转移到液体燃料储存器，以便于液化燃料的蒸发，以产生供给发电组件的燃料蒸气。 该系统可以以液体燃料储存和传热系统为主要燃料蒸气源或备用燃料蒸气源来实施。

    Coolant-cooled heat sink configured for accelerating coolant flow
    62.
    发明授权
    Coolant-cooled heat sink configured for accelerating coolant flow 有权

    公开(公告)号：US09439325B2

    公开(公告)日：2016-09-06

    申请号：US14058562

    申请日：2013-10-21

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H01L23/473 ,  H05K7/20

    CPC classification number: H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

    Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

    Coolant-cooled heat sink configured for accelerating coolant flow
    63.
    发明授权
    Coolant-cooled heat sink configured for accelerating coolant flow 有权
    冷却液冷却的散热器，用于加速冷却剂流

    公开(公告)号：US09414525B2

    公开(公告)日：2016-08-09

    申请号：US14827588

    申请日：2015-08-17

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H01L23/473 ,  H05K7/20

    CPC classification number: H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

    Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

    Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。 该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面 电子组件。 冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过 冷气携带舱。 减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。

    Ground-based heat sink facilitating electronic system cooling
    65.
    发明授权
    Ground-based heat sink facilitating electronic system cooling 有权
    地面散热器，便于电子系统冷却

    公开(公告)号：US09363924B2

    公开(公告)日：2016-06-07

    申请号：US13780538

    申请日：2013-02-28

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: F28D15/06 ,  H05K7/20 ,  F24J3/08 ,  F28D15/02

    CPC classification number: H05K7/2039 ,  F24T10/30 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/20827 ,  Y02E10/10 ,  Y02E10/16

    Abstract: Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.

    Abstract translation: 提供了冷却方法，其包括提供散热器，该散热器具有带有隔室的壳体，冷却剂入口和冷却剂出口。 壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。 散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。 热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。 壳体外部的第二部分设置成便于将提取的热量导入地面。

    Cooling system with automated seasonal freeze protection
    66.
    发明授权
    Cooling system with automated seasonal freeze protection 有权
    具有自动季节性冻结保护的冷却系统

    公开(公告)号：US09351431B2

    公开(公告)日：2016-05-24

    申请号：US13649334

    申请日：2012-10-11

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh ,  Jing Zhang

    IPC: F28F13/00 ,  H05K7/20

    CPC classification number: H05K7/20836 ,  F28F2265/14

    Abstract: An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

    Abstract translation: 提供了一种用于冷却电子部件的自动多流体冷却系统和方法。 冷却系统包括冷却剂回路，冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

    Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)
    67.
    发明授权
    Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) 有权
    制造冷却电子卡的热转印和冷却剂冷却结构

    公开(公告)号：US09253923B2

    公开(公告)日：2016-02-02

    申请号：US14528075

    申请日：2014-10-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Amilcar R. Arvelo ,  Levi A. Campbell ,  Michael J. Ellsworth, Jr. ,  Eric J. McKeever ,  Richard P. Snider

    IPC: H05K7/20

    CPC classification number: H05K7/2039 ,  H05K7/20636 ,  H05K7/20772 ,  Y10T29/4935

    Abstract: Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

    Abstract translation: 提供了制造冷却装置和冷却剂冷却的电子组件的方法，其包括：将构造成具有一个或多个要冷却的电子部件的电子卡的一侧或多侧的热传递结构联接在一起，所述热传递结构包括耦合 到电子卡的一边; 并且将冷却剂冷却结构设置在电子系统的插座附近，冷却剂冷却结构包括一个或多个低剖面冷轨，其大小和构造成沿着热扩散器的底部边缘热耦合到散热器，其操作 电子卡在插座内的对接，以及与低剖面冷轨相关联的一个或多个冷却剂传送通道，用于将热量从低剖面冷轨移除到流过冷却剂承载通道的冷却剂 （s）。

    Coolant-conditioning unit with automated control of coolant flow valves
    68.
    发明授权
    Coolant-conditioning unit with automated control of coolant flow valves 有权
    具有自动控制冷却剂流量阀的冷却液调节装置

    公开(公告)号：US09253921B2

    公开(公告)日：2016-02-02

    申请号：US13782003

    申请日：2013-03-01

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G05D23/00 ,  H05K7/20

    CPC classification number: H05K7/20281 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

    Abstract: A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.

    Abstract translation: 提供一种方法，其包括提供冷却剂调节单元，该冷却剂调节单元包括具有设备冷却剂流量控制阀的设备冷却剂通道和容纳系统冷却剂的系统冷却剂通道，并且具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。

    Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly
    69.
    发明授权
    Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly 有权
    可分离和集成的散热器有助于冷却多组件电子组件

    公开(公告)号：US09210831B2

    公开(公告)日：2015-12-08

    申请号：US13862710

    申请日：2013-04-15

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Amilcar R. Arvelo ,  Levi A. Campbell ,  Michael J. Ellsworth, Jr. ,  Eric J. McKeever

    IPC: H05K7/20 ,  H01L23/473 ,  B21D53/04 ,  F28D15/00

    CPC classification number: H05K7/20281 ,  B21D53/04 ,  F28D15/00 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  Y10T29/49359 ,  H01L2924/00

    Abstract: Cooling apparatuses are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

    Abstract translation: 提供了冷却装置，其有助于冷却诸如轮毂模块组件的多部件组件。 冷却装置包括：第一液冷式散热器，其构造成便于去除由多组分组件的一个或多个第一电子部件产生的热;以及第二液冷散热器，其被配置为便于去除由一个或多个 多组件组件的更多第二电子部件。 第一液冷散热器可分离地联接到多组件组件，并且第二液冷散热器固定地固定到多组件组件。 流体耦合器流体耦合第一和第二液冷散热器，以便于液体冷却剂从可分离耦合的第一液冷散热器流过固定固定的第二液冷散热器。

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