公开(公告)号：US12133363B1

公开(公告)日：2024-10-29

申请号：US18210626

申请日：2023-06-15

申请人： HAMFOP Technologies LLC

发明人： Mudasir Ahmad

IPC分类号： H05K7/20 ,  F04B19/24 ,  F04F1/04 ,  F28D15/02 ,  H01L23/427

CPC分类号： H05K7/20327 ,  F04B19/24 ,  F04F1/04 ,  F28D15/0266 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20827 ,  H05K7/20818

摘要： A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.

公开(公告)号：US11974416B2

公开(公告)日：2024-04-30

申请号：US17238362

申请日：2021-04-23

申请人： Nvidia Corporation

发明人： Ali Heydari

IPC分类号： H05K7/20 ,  G06N3/04 ,  G06N3/08

CPC分类号： H05K7/20836 ,  G06N3/04 ,  G06N3/08 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20827

摘要： Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.

公开(公告)号：US20240125555A1

公开(公告)日：2024-04-18

申请号：US18487982

申请日：2023-10-16

申请人： Hebei Qinhuai Data Co., Limited.

发明人： Binghua ZHANG ,  Mingjiang LI ,  Xiaogang SUN

IPC分类号： F28C1/14 ,  H05K7/20

CPC分类号： F28C1/14 ,  H05K7/20309 ,  H05K7/20327 ,  H05K7/20345 ,  H05K7/20827 ,  F28C2001/006

摘要： An embodiment of the present disclosure provides a compound evaporative cooling tower and a data center, relating to the field of cooling tower technology. The compound evaporative cooling tower includes an air-inlet grille, a precooling module, a first spray module, a cooling module, a direct evaporative heat exchanger, a second spray module, a water collector, and an outdoor fan. The precooling module is arranged on an inner side of the air-inlet grille. The first spray module is arranged above the precooling module, and the second spray module is arranged above the direct evaporative heat exchanger. The cooling module is arranged below the direct evaporative heat exchanger and includes a plurality of cooling sub-modules.

公开(公告)号：US11917788B1

公开(公告)日：2024-02-27

申请号：US18128728

申请日：2023-03-30

申请人： Worldwide Environmental Services, LLC

发明人： Mark Welsko

IPC分类号： H05K7/14 ,  H05K5/02 ,  H05K7/20

CPC分类号： H05K7/1497 ,  H05K5/0256 ,  H05K7/1492 ,  H05K7/1495 ,  H05K7/2029 ,  H05K7/20136 ,  H05K7/20745 ,  H05K7/20827

摘要： A modular data center and a method of building a modular data center. The modular data center includes a site microgrid including at least one power converter connected to a direct current (DC) bus and a digital power system. The digital power system includes at least one digital power transmitter, a set of transmission lines, and at least one digital power receiver. The modular data center design uses an adiabatic cooling system to cool the modular data center.

公开(公告)号：US20230403824A1

公开(公告)日：2023-12-14

申请号：US18208904

申请日：2023-06-13

申请人： Hebei Qinhuai Data Co., Limited.

发明人： Binghua ZHANG ,  Mingjiang LI ,  Zhenghua WANG ,  Tao LU

IPC分类号： H05K7/20

CPC分类号： H05K7/20354 ,  H05K7/20327 ,  H05K7/20827

摘要： The present disclosure discloses a cooling system, a control method and a data center computer room. The cooling system includes an evaporative cooling module, an oilless centrifugal compressor, a condensing module, a circulating pump module, and a throttling module. A first output end of the evaporative cooling module is connected to an input end of the oilless centrifugal compressor, an output end of the oilless centrifugal compressor is connected to an input end of the condensing module; an output end of the condensing module is connected to an input end of the circulating pump module, an output end of the circulating pump module is connected to an input end of the throttling module; and an output end of the throttling module is connected to an input end of the evaporative cooling module, and a second output end of the evaporative cooling module leads to an air supply channel.

公开(公告)号：US11839063B2

公开(公告)日：2023-12-05

申请号：US17570955

申请日：2022-01-07

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： Qi Xuan

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327

摘要： A refrigeration device includes an indoor unit and an outdoor unit. The indoor unit is used for heat exchange with air inside an equipment room. To adapt to different cabinets, one or more ventilation ducts of the indoor unit include a plurality of channels, and a baffle assembly is disposed in the indoor unit. An air flow direction in the ventilation duct is changed using the baffle assembly, and the baffle assembly is adjusted to block different positions to apply the refrigeration device to different types of cabinets.

公开(公告)号：US11825630B2

公开(公告)日：2023-11-21

申请号：US17624910

申请日：2019-07-09

申请人： NEC Corporation

发明人： Takafumi Natsumeda ,  Minoru Yoshikawa ,  Masaki Chiba

IPC分类号： H05K7/20

CPC分类号： H05K7/20327 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20827

摘要： A cooling system includes: a local cooler that is positioned near a heat source and evaporates a liquid-phase refrigerant by receiving heat from the heat source; a turbo compressor that compresses a gas-phase refrigerant that absorbed the heat in the local cooler; an outdoor unit that condenses the gas-phase refrigerant supplied from the turbo compressor by heat dissipation; and an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler. The refrigerant is a low-pressure refrigerant having a condensing pressure lower than a predetermined value.

公开(公告)号：US20230309272A1

公开(公告)日：2023-09-28

申请号：US17704678

申请日：2022-03-25

申请人： Nvidia Corporation

发明人： Susheela Nanjunda Rao Narasimhan ,  Mohammad Amin Nabian ,  Oliver Hennigh ,  Sanjay Choudhry ,  Kaustubh Mahesh Tangsali

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  H05K7/20836 ,  H05K7/20409

摘要： Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.

公开(公告)号：US20230247803A1

公开(公告)日：2023-08-03

申请号：US18193704

申请日：2023-03-31

申请人： Green Revolution Cooling, Inc.

发明人： Christiaan Scott Best ,  Mark Garnett

IPC分类号： H05K7/20 ,  G06F1/20 ,  F28D15/00

CPC分类号： H05K7/20772 ,  H05K7/20836 ,  H05K7/20236 ,  H05K7/20763 ,  G06F1/20 ,  H05K7/20281 ,  G06F1/206 ,  H05K7/203 ,  H05K7/20327 ,  H05K7/20381 ,  F28D15/00 ,  H05K7/20 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20827 ,  H01L2924/0002 ,  Y10T29/4973 ,  G06F2200/201

摘要： An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

公开(公告)号：US20180295751A1

公开(公告)日：2018-10-11

申请号：US15479740

申请日：2017-04-05

申请人： Google Inc.

发明人： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC分类号： H05K7/20 ,  H05K7/14

CPC分类号： H05K7/20745 ,  H05K7/1489 ,  H05K7/20736 ,  H05K7/20827 ,  H05K7/20836

摘要： A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.