公开(公告)号：US11825630B2

公开(公告)日：2023-11-21

申请号：US17624910

申请日：2019-07-09

申请人： NEC Corporation

发明人： Takafumi Natsumeda ,  Minoru Yoshikawa ,  Masaki Chiba

IPC分类号： H05K7/20

CPC分类号： H05K7/20327 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20827

摘要： A cooling system includes: a local cooler that is positioned near a heat source and evaporates a liquid-phase refrigerant by receiving heat from the heat source; a turbo compressor that compresses a gas-phase refrigerant that absorbed the heat in the local cooler; an outdoor unit that condenses the gas-phase refrigerant supplied from the turbo compressor by heat dissipation; and an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler. The refrigerant is a low-pressure refrigerant having a condensing pressure lower than a predetermined value.

公开(公告)号：US11428442B2

公开(公告)日：2022-08-30

申请号：US16975918

申请日：2019-03-19

申请人： NEC Corporation

发明人： Hisato Sakuma ,  Koichi Todoroki ,  Masaki Chiba ,  Takafumi Natsumeda ,  Minoru Yoshikawa

IPC分类号： F25B5/02 ,  F25B6/02 ,  F25B25/00 ,  F25B49/02 ,  H05K7/20

摘要： A cooling device includes a first evaporation unit, a second evaporation unit, a first condensation unit, a second condensation unit, common piping, a compressor, an expansion valve, a first valve, and a second valve. The common piping combines liquid-phase refrigerant flowing from the first condensation unit and liquid-phase refrigerant flowing from the second condensation unit. The first valve adjusts the liquid-phase refrigerant amount flowing into the first evaporation unit. The second valve adjusts the liquid-phase refrigerant amount flowing into the second evaporation unit. In addition, the pressure inside the common pipe is greater than the respective pressures inside the first evaporation unit and the second evaporation unit.