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公开(公告)号：US20250048607A1
公开(公告)日：2025-02-06
申请号：US18819465
申请日：2024-08-29
Applicant: Switch, Ltd.
Inventor： Rob ROY
Abstract: Described herein is an integrated data center that provides for efficient powering and cooling, as well as efficient wire routing.
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公开(公告)号：US20240418418A1
公开(公告)日：2024-12-19
申请号：US18699858
申请日：2022-10-26
Applicant: Massachusetts Institute of Technology
Inventor： Zhengmao LU , Arny LEROY , Evelyn N. WANG , Jeffrey C. GROSSMAN
Abstract: Hybrid evaporative and radiative cooling panel systems having increased cooling efficiency while minimizing water consumption are provided. The disclosed hybrid systems include a cooling panel that enables the improved cooling and water consumption via a reflector layer which reflects solar radiation, an evaporative and infrared-emitting layer that is solar-transparent and water-rich, and an insulation layer that is vapor-permeable. infrared-transparent. and solar-reflecting. The cooling panel is configured to be in fluid communication with a heat exchanger. The cooling panel is further configured to cool a heat transfer fluid by way of both evaporative cooling and radiative cooling. The cooling panel is also configured such that the heat transfer fluid passes at least one of through or across the cooling panel and flows to the heat exchanger. Various configurations of such panels and panel systems. and methods of implementing the principles associated with the same. are also disclosed.
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公开(公告)号：US20240384916A1
公开(公告)日：2024-11-21
申请号：US18616139
申请日：2024-03-25
Applicant: INERTECH IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
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公开(公告)号：US20240353156A1
公开(公告)日：2024-10-24
申请号：US18639416
申请日：2024-04-18
Applicant: Effusio, LLC
Inventor： Igor Vaisman
IPC: F25B25/00 , F25B41/28 , F25B41/325
CPC classification number: F25B25/005 , F25B41/28 , F25B41/325 , F25B2400/16
Abstract: A thermal system may include a vapor compression refrigeration circuit conducting a first refrigerant, an absorption refrigeration circuit conducting a second refrigerant and an absorbent, and a heat exchanger unit. The vapor compression refrigeration circuit may include a first heat rejection heat exchanger, a first heat absorption heat exchanger, a compressor disposed between the first heat absorption heat exchanger and the first heat rejection heat exchanger, and an expansion valve disposed between and connected to the first heat rejection heat exchanger and the first heat absorption heat exchanger. The absorption refrigeration circuit may include a generator, an absorber, a pump disposed between and connected to the absorber and the generator, a throttling valve disposed between and connected to the generator and the absorber, a second heat rejection heat exchanger connected to the generator, and a second heat absorption heat exchanger connected to the absorber. The generator and the first heat rejection heat exchanger may be integrated with one another within the heat exchanger unit such that heat emitted by the first heat rejection heat exchanger is transferred to the generator.
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公开(公告)号：US12127380B2
公开(公告)日：2024-10-22
申请号：US18511206
申请日：2023-11-16
Applicant: Munters Corporation
Inventor： Michael Boucher , Rafael Neuwald , Bryan Keith Dunnavant , John Roberts , Paul A. Dinnage , Wei Fang
CPC classification number: H05K7/208 , F25B25/005 , F25B41/31 , F25B41/40 , F28D15/0266 , F28D15/0275 , F28D15/06 , H05K7/20309 , H05K7/20318
Abstract: A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, and a heat exchanger. When a secondary cooling medium is provided to the heat exchanger, the primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves located between the evaporator and the passive condenser and between the evaporator and the heat exchanger. The primary cooling medium circulates between the evaporator and the passive condenser and between the evaporator and the heat exchanger by natural circulation and gravity without a pump in the flow path of the primary cooling medium between the heat exchanger and the evaporator and between the passive condenser and the evaporator to circulate the primary cooling medium.
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公开(公告)号：US20240302085A1
公开(公告)日：2024-09-12
申请号：US18549006
申请日：2021-04-20
Applicant: Mitsubishi Electric Corporation
Inventor： Ryosuke MATSUI
CPC classification number: F25B41/42 , F25B25/005
Abstract: An air-conditioning apparatus according to the present disclosure includes: a refrigerant cycle circuit in which a compressor, a heat-source-side heat exchanger, an expansion device, and a refrigerant-side flow passage of an inter-heat-medium heat exchanger are connected by refrigerant pipes, and refrigerant is circulated; and a heat-medium cycle circuit in which a pump, a use-side heat exchanger, and a heat-medium-side flow passage of the inter-heat-medium heat exchanger are connected by heat-medium conveying pipes, and the heat medium is circulated. An inside diameter D of each of the heat-medium conveying pipes is determined based on a capacity Q of the use-side heat exchanger connected to the heat-medium conveying pipes and a length L of at least part of each of the heat-medium conveying pipes included in the heat-medium cycle circuit, and is set to satisfy the following formula (1):
3
(
LQ
2
)
0.2
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公开(公告)号：US20240295347A1
公开(公告)日：2024-09-05
申请号：US18435459
申请日：2024-02-07
Applicant: Maybell Quantum Industries, Inc.
Inventor： Corban I. Tillemann-Dick , Kyle J. Thompson , Bryan J. Choo , Johanna Zultak , Tyler James Plant
CPC classification number: F25B9/12 , F25B9/10 , F25B9/145 , F25B25/005 , F25D19/006 , H05K7/208 , B33Y80/00 , F25B2500/13 , H05K7/20827
Abstract: A dilution refrigerator is provided. The dilution refrigerator includes a plurality of thermalization plates configured to be cooled to a plurality of temperatures, and a first thermalization plate of the plurality of thermalization plates includes an integrated heat exchanger. The integrated heat exchanger includes channels formed in the first thermalization plate, and the channels are configured to allow helium to flow through the first thermalization plate during operation of the dilution refrigerator to improve heat exchange and cooling power of the dilution refrigerator.
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公开(公告)号：US12065019B2
公开(公告)日：2024-08-20
申请号：US17948999
申请日：2022-09-20
Applicant: Bergstrom, Inc.
Inventor： Terry Zeigler , Brett S. Connell
CPC classification number: B60H1/3213 , B60H1/00985 , F25B25/005 , F25B49/02 , H05K7/20881 , F25B2600/0253 , F25B2600/111 , F25B2600/13 , F25B2700/15 , F25B2700/195 , F25B2700/21163 , F25B2700/21171
Abstract: The various implementations described herein include methods, devices, and systems for cooling a vehicular electronics system. In one aspect, a vehicular refrigerant system includes: (1) a refrigerant loop having a compressor configured to compress a refrigerant, a condenser configured to condense the compressed refrigerant, an expansion device configured to enable expansion of the condensed refrigerant, and a heat exchanger configured to transfer heat from a liquid coolant to the expanded refrigerant; (2) a liquid coolant loop configured to transfer heat from an electronics system via the liquid coolant; and (3) a controller configured to: (a) obtain operating data regarding the refrigerant, the liquid coolant, and/or the electronics system; and (b) adjust operation of the refrigerant loop and/or the liquid coolant loop based on the obtained operating data.
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公开(公告)号：US12063761B1
公开(公告)日：2024-08-13
申请号：US17221797
申请日：2021-04-03
Applicant: Nautilus TRUE, LLC
Inventor： Arnold Castillo Magcale
CPC classification number: H05K7/20818 , F25B9/008 , F25B25/005 , H05K7/20309 , H05K7/20327
Abstract: Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.
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10.发明公开
公开(公告)号：US20240263851A1
公开(公告)日：2024-08-08
申请号：US18618087
申请日：2024-03-27
Applicant: ECOOLTEC GROSSKOPF GMBH
Inventor： Jürgen SÜß
CPC classification number: F25B25/005 , F25B13/00 , F25B47/025 , F25B2313/003 , F25B2313/004 , F25B2700/2104
Abstract: Apparatus for temperature-controlling a space to be temperature-controlled with a space limitation separating the space to be temperature-controlled from a surrounding area, comprising: a primary heat pump circuit with an evaporator, a condenser, a compressor, and an expansion element, wherein the primary heat pump circuit comprises a natural such as a flammable, primary working fluid, wherein the evaporator, the liquefier, the compressor, and the expansion element are arranged outside of the space to be temperature-controlled; a secondary circuit thermally coupled to and fluidically decoupled from the evaporator or the condenser via a heat exchanger and comprising a temperature-controlling element arranged in the space to be temperature-controlled and connected to the heat exchanger via a line arrangement comprising a secondary fluid that differs from the primary working fluid, wherein the line arrangement penetrates the space limitation.
