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公开(公告)号:US10088733B2
公开(公告)日:2018-10-02
申请号:US15230582
申请日:2016-08-08
发明人: Christopher Doerr , Ricardo Aroca , Long Chen
IPC分类号: H04B10/12 , G02F1/225 , H04B10/516 , H04B10/80 , G02F1/21
摘要: A segmented traveling wave Mach Zehnder optical modulator is described. The segmented traveling wave Mach Zehnder optical modulator may comprise two or more radio frequency (RF) segments, and each RF segment may be configured to support a modulating RF signal. The modulating RF signals may be configured to modulate an optical signal propagating along an optical path of the segmented traveling wave Mach Zehnder optical modulator. The RF modulating signal in the second RF segment may be generated by amplifying the modulating RF signal of the first RF segment, using an RF amplifier. The RF amplifier may be configured to amplify a band-pass spectral portion of the modulating RF signal.
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公开(公告)号:US20180039151A1
公开(公告)日:2018-02-08
申请号:US15230582
申请日:2016-08-08
发明人: Christopher Doerr , Ricardo Aroca , Long Chen
IPC分类号: G02F1/225 , H04B10/80 , H04B10/516
CPC分类号: G02F1/2255 , G02F1/2257 , G02F2001/212 , G02F2201/127 , H04B10/516 , H04B10/801
摘要: A segmented traveling wave Mach Zehnder optical modulator is described. The segmented traveling wave Mach Zehnder optical modulator may comprise two or more radio frequency (RF) segments, and each RF segment may be configured to support a modulating RF signal. The modulating RF signals may be configured to modulate an optical signal propagating along an optical path of the segmented traveling wave Mach Zehnder optical modulator. The RF modulating signal in the second RF segment may be generated by amplifying the modulating RF signal of the first RF segment, using an RF amplifier. The RF amplifier may be configured to amplify a band-pass spectral portion of the modulating RF signal.
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公开(公告)号:US09829659B2
公开(公告)日:2017-11-28
申请号:US15295241
申请日:2016-10-17
发明人: Long Chen , Christopher Doerr , Diedrik Vermeulen
CPC分类号: G02B6/4225 , G02B6/12004 , G02B6/122 , G02B6/1228 , G02B6/2852 , G02B6/30 , G02B6/34 , G02B6/4227 , G02B2006/12109 , G02B2006/12126
摘要: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.
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公开(公告)号:US20170336658A1
公开(公告)日:2017-11-23
申请号:US15584509
申请日:2017-05-02
发明人: Long Chen
CPC分类号: G02F1/025 , G02B6/00 , G02B6/134 , G02F2001/0156
摘要: Disclosed are designs and methods of fabrication of silicon carrier-depletion based electro-optical modulators having doping configurations that produce modulators exhibiting desirable modulation efficiency, optical absorption loss and bandwidth characteristics. The disclosed method of fabrication of a modulator having such doping configurations utilizes counter doping to create narrow regions of relatively high doping levels near a waveguide center.
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65.
公开(公告)号:US20170293073A1
公开(公告)日:2017-10-12
申请号:US15482391
申请日:2017-04-07
发明人: Long Chen , Christopher Doerr
CPC分类号: G02B6/122 , G02B6/12002 , G02B6/136 , G02B6/138 , G02B6/30 , G02B2006/12061 , G02B2006/12085 , G02B2006/12176
摘要: Aspects of the present application provide an optical device comprising a suspended optical component over a cavity, such as an undercut region in a substrate. The cavity is filled with a filler material. In some embodiments, the optical device and a method may be provided to fill the cavity with the filler material using a reservoir and a channel in the substrate connecting the reservoir to the cavity to be filled.
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公开(公告)号:US20170285437A1
公开(公告)日:2017-10-05
申请号:US15472946
申请日:2017-03-29
发明人: Christopher Doerr , Long Chen , Ricardo Aroca
CPC分类号: G02F1/2257 , G02F1/025 , G02F1/2255 , G02F2001/212
摘要: An optical Mach Zehnder modulator is described. The optical Mach Zehnder modulator may comprise a plurality of segments separated by curved waveguides. For example, an optical Mach Zehnder modulator may comprise a first waveguide arm having a first pn-junction formed therein, a second waveguide arm having a second pn-junction formed therein, a third waveguide arm coupled to the first waveguide arm via a first curved waveguide and a fourth waveguide arm coupled to the second waveguide arm via a second curved waveguide. The segments may have the same polarities. Alternatively, the segments may have opposite polarities. The different segments may be driven using different RF signals. The RF signals may be delayed from one another.
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公开(公告)号:US20170285265A1
公开(公告)日:2017-10-05
申请号:US15620601
申请日:2017-06-12
发明人: Long Chen
CPC分类号: G02B6/1228 , G02B6/122 , G02B6/14 , G02B6/24 , G02B6/305 , G02B2006/12097
摘要: Techniques for forming a facet optical coupler to couple light at an edge of silicon substrate are described. The facet optical coupler includes a silicon substrate, a layer of second material disposed on the silicon substrate and in direct contact with the edge of the silicon substrate, and an undercut region disposed between a portion of the silicon substrate and the layer of second material. The undercut region is offset from the edge to provide mechanical integrity of the facet optical coupler to improve production of photonic integrated circuits having the facet optical coupler from a wafer.
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公开(公告)号:US09766410B1
公开(公告)日:2017-09-19
申请号:US14795961
申请日:2015-07-10
发明人: Long Chen
CPC分类号: G02B6/3596 , G02B6/12002 , G02B6/12004 , G02B6/124 , G02B6/2852 , G02B6/30 , G02B6/34 , G02B6/42 , G02B2006/12159
摘要: Techniques for forming a photonic integrated circuit having a facet coupler and a surface coupler are described. The photonic integrated circuit may be on a wafer, which may be diced to form an integrated device. The facet coupler may be positioned proximate to an edge of the integrated device, and the surface coupler may be positioned on a surface of the integrated device. The surface coupler may allow for evaluation and assessment of the circuit's performance, which may facilitate wafer-level testing of the circuit and diagnosis of the circuit before and after packaging.
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公开(公告)号:US09703038B1
公开(公告)日:2017-07-11
申请号:US14796678
申请日:2015-07-10
发明人: Long Chen
CPC分类号: G02B6/1228 , G02B6/14 , G02B6/24 , G02B2006/12097
摘要: Techniques for forming a facet optical coupler to couple light at an edge of silicon substrate are described. The facet optical coupler includes a silicon substrate, a layer of second material disposed on the silicon substrate and in direct contact with the edge of the silicon substrate, and an undercut region disposed between a portion of the silicon substrate and the layer of second material. The undercut region is offset from the edge to provide mechanical integrity of the facet optical coupler to improve production of photonic integrated circuits having the facet optical coupler from a wafer.
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70.
公开(公告)号:US20170031113A1
公开(公告)日:2017-02-02
申请号:US15295241
申请日:2016-10-17
发明人: Long Chen , Christopher Doerr , Diedrik Vermeulen
CPC分类号: G02B6/4225 , G02B6/12004 , G02B6/122 , G02B6/1228 , G02B6/2852 , G02B6/30 , G02B6/34 , G02B6/4227 , G02B2006/12109 , G02B2006/12126
摘要: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.
摘要翻译: 光子集成电路(PIC)可以与多个光学部件(例如,光纤阵列)光学对准。 可以通过使用耦合在PIC的第一输入/输出(I / O)光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的,并且在PIC的常规操作期间是不透射的。
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