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105 条记录 (耗时 0.017 秒)

    LIGHT EMITTING DEVICE
    51.
    发明申请
    LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20220209497A1

    公开(公告)日：2022-06-30

    申请号：US17697897

    申请日：2022-03-17

    申请人： NICHIA CORPORATION

    发明人： Masatoshi NAKAGAKI ,  Soichiro MIURA

    IPC分类号： H01S5/02355 ,  H01S5/40 ,  H01S5/0233

    摘要： A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.

    SEMICONDUCTOR LASER DIODE
    52.
    发明申请
    SEMICONDUCTOR LASER DIODE 有权

    公开(公告)号：US20220140566A1

    公开(公告)日：2022-05-05

    申请号：US17573701

    申请日：2022-01-12

    申请人： OSRAM OLED GmbH

    发明人： Wolfgang Reill

    IPC分类号： H01S5/0237 ,  H01S5/042 ,  H01S5/065 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0234 ,  H01S5/0235

    摘要： A semiconductor laser diode includes a semiconductor body having an emitter region; and a first connection element that electrically contacts the semiconductor body in the emitter region, wherein the semiconductor body is in contact with the first connection element in the emitter region, at least in places in the emitter region, the semiconductor body has a structuring that enlarges a contact area between the semiconductor body and the first connection element, the semiconductor body includes a connection region that directly adjoins the first connection element at the contact area, and the connection region is a highly p-doped layer.

    Light emitting element housing package, light emitting device, and light emitting module
    54.
    发明授权
    Light emitting element housing package, light emitting device, and light emitting module 有权

    公开(公告)号：US11322907B2

    公开(公告)日：2022-05-03

    申请号：US16275964

    申请日：2019-02-14

    申请人： KYOCERA Corporation

    发明人： Daisuke Ueyama ,  Chiaki Doumoto ,  Takeshi Kamikawa

    IPC分类号： H01S5/0233 ,  H01S5/023 ,  H01L23/00 ,  H01S5/0235 ,  H01S5/02345 ,  H01S5/024 ,  H01S5/02216

    摘要： A light emitting element housing package of the present disclosure includes a base part including a first surface including a first recessed part for mounting a light emitting element. Surface roughness Sa of at least such a region of a bottom surface of the first recessed part that is opposite to a light emitting element mounted on the first recessed part is smaller than surface roughness Sa of a region other than the first recessed part of the first surface. Further, a light emitting device of the present disclosure includes the light emitting element housing package and a light emitting element housed in the light emitting element housing package. Further, a light emitting module of the present disclosure includes the light emitting device and a module substrate on which the light emitting device is mounted.

    Laser Package Structure
    55.
    发明申请
    Laser Package Structure 有权

    公开(公告)号：US20220085571A1

    公开(公告)日：2022-03-17

    申请号：US17477811

    申请日：2021-09-17

    申请人： iReach Corporation

    发明人： Shou-Lung Chen ,  Hsin-Chan Chung ,  Hsiu-Ju Yang ,  Chih-Chiang Lu ,  Kuo-Min Huang

    IPC分类号： H01S5/183 ,  H01S5/02 ,  H01S5/0233

    摘要： A package structure of a laser device is provided, including: a first light transmissive substrate including a first surface, a second surface opposing the first surface, a first side surface between the first surface and the second surface, and a second side surface opposing the first side surface; a laser structure including a first laser chip and a second laser chip which are disposed on the first surface, and the first laser chip including a third side surface; a first optical component disposing on the first light transmissive substrate and corresponding in position to the first laser chip; and a second optical component disposing on the light transmissive substrate and corresponding in position to the second laser chip; wherein the first side surface is coplanar with the third side surface.

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    57.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20210249837A1

    公开(公告)日：2021-08-12

    申请号：US17237793

    申请日：2021-04-22

    申请人： Panasonic Corporation

    发明人： Shinichiro NOZAKI

    IPC分类号： H01S5/023 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/024

    摘要： A semiconductor light emitting device includes a mount section having an insulating property connected to a heat sink, a plurality of semiconductor laser elements disposed on the mount section, and a heat radiation block having an insulating property disposed on the plurality of semiconductor laser elements. A first wiring made of a metal is disposed on an upper surface of the mount section, and a second wiring made of a metal is disposed on a lower surface of the heat radiation block, a part of the second wiring being electrically connected to the first wiring. By electrically connecting the first wiring and the second wiring to each of the plurality of semiconductor laser elements, the plurality of semiconductor laser elements are connected in series, and have a same polarity with each other at a side that each of the plurality of semiconductor laser elements is connected to the first wiring.

    LASER
    59.
    发明公开
    LASER 审中-公开

    公开(公告)号：US20230291173A1

    公开(公告)日：2023-09-14

    申请号：US18321257

    申请日：2023-05-22

    申请人： HISENSE LASER DISPLAY CO., LTD.

    发明人： Zinan ZHOU ,  Youliang TIAN ,  Xin ZHANG ,  Yunchen LU ,  Jianjun LI ,  Xintuan TIAN ,  Qian SHAO

    IPC分类号： H01S5/0233 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02315

    CPC分类号： H01S5/0233 ,  H01S5/4025 ,  H01S5/02469 ,  H01S5/02315

    摘要： Provided is a laser. The laser includes: a base plate, an annular side wall, a plurality of conductive pins, a plurality of light-emitting chips, and a plurality of conductive wires; wherein the side wall and the plurality of light-emitting chips are disposed on the base plate, the side wall surrounds the plurality of light-emitting chips, the plurality of conductive pins are extended through the side wall and are affixed into the side wall, and sides, distal from the base plate, of portions of the plurality of conductive pins surrounded by the side wall include planar regions, wherein the planar region of each of the plurality of conductive pins is connected to the light-emitting chip via the conductive wire.