Valve apparatus for shuttering removal
    51.
    发明授权
    Valve apparatus for shuttering removal 失效
    阀门拆卸装置

    公开(公告)号:US3666229A

    公开(公告)日:1972-05-30

    申请号:US3666229D

    申请日:1970-05-18

    IPC分类号: E04G19/00 B28B7/12

    CPC分类号: E04G19/00

    摘要: A valve apparatus for use in the removal of shuttering by means of compressed air or other gas. The apparatus comprises a valve body insertible into an aperture in a shuttering plate and having a flange formed at one end thereof for abutment with the inside surface of the shuttering plate. The valve body has a hollow cylindrical portion which extends from the flange and is externally screw-threaded to engage a nut which can be screwed towards the flange so as to clamp the shuttering plate between the nut and the flange, thereby securing the valve apparatus in position. The cylindrical body portion is also connectible with a pipe for supplying compressed air or other gas and accommodates a valve closure device which normally closes an opening through the flange end of the valve body. The valve closure device preferably has a frusto-conical closure element which seats in said opening, the opening also having a frusto-conical configuration but the angle of taper of the closure element being greater than that of the opening, the maximum diameters of the closure element and opening being substantially equal.

    摘要翻译: 一种阀装置,用于通过压缩空气或其它气体去除挡板。 该装置包括阀体,其可插入到挡板中的孔中,并且具有在其一端形成的凸缘,用于与挡板的内表面邻接。 阀体具有中空的圆柱形部分,其从凸缘延伸并且是外螺纹的,以与可以朝向凸缘螺合的螺母接合,以将挡板夹在螺母和凸缘之间,从而将阀装置固定在 位置。 圆柱形主体部分也可与用于供应压缩空气或其他气体的管道连接,并容纳阀闭合装置,该阀关闭装置通常关闭通过阀体的凸缘端的开口。 阀闭合装置优选地具有位于所述开口中的截头圆锥形闭合元件,该开口还具有截头圆锥形构造,但封闭元件的锥度角大于开口的锥度,该封闭件的最大直径 元件和开口基本相等。

    Method for handling cast articles
    52.
    发明授权
    Method for handling cast articles 失效
    处理CAST文章的方法

    公开(公告)号:US3663681A

    公开(公告)日:1972-05-16

    申请号:US3663681D

    申请日:1970-01-26

    发明人: EHRLICH JOSEF

    IPC分类号: B28B1/26 B28B7/12

    摘要: Injection molding method for molding articles, particularly ceramic articles such as square lavatories which have a flat back edge surface. The injection molding takes place at high pressure. Particular means are provided for handling the molds and for removing the top or cover of the carrier, rotating the top or cover and removing the finished cast article such that the finish piece is positioned to rest on its flat surface. The cast article is rotated through 90 degrees, set on a movable surface and then separated from the mold cover by applying pressure which moves the article and the movable surface a small amount. The apparatus facilitates handling of the molds and makes possible rapid and repeated use of the mold and thereby greatly augments their utility.

    Methods of dechucking and system thereof
    58.
    发明授权
    Methods of dechucking and system thereof 有权
    脱扣方法及其系统

    公开(公告)号:US08832916B2

    公开(公告)日:2014-09-16

    申请号:US13180647

    申请日:2011-07-12

    申请人: Henry S. Povolny

    发明人: Henry S. Povolny

    摘要: A method for dechucking a substrate from an electrostatic chuck (ESC) in a plasma processing system is provided. The method includes flowing a first gas into a plasma chamber. The method also includes flowing a second gas to a backside of the substrate to create a high pressure buildup of the second gas under the backside. The method further includes reducing a flow of the second gas such that at least a portion is trapped under the substrate backside. The method yet also includes pumping out the plasma chamber to increase a pressure differential between a first pressure that exists under the backside of the substrate and a second pressure that exists in a region above the substrate, wherein the pressure differential enables the substrate to be lifted from the ESC. The method yet also includes removing the substrate from the ESC.

    摘要翻译: 提供了一种用于在等离子体处理系统中从静电卡盘(ESC)去除基板的方法。 该方法包括使第一气体流入等离子体室。 该方法还包括将第二气体流动到衬底的背面,以产生第二气体在背面下方的高压累积。 该方法还包括减少第二气体的流动,使得至少一部分被捕获在衬底背面下方。 该方法还包括泵出等离子体室以增加存在于衬底背面的第一压力与存在于衬底上方的区域中的第二压力之间的压力差,其中压力差使衬底能够被提升 从ESC。 该方法还包括从ESC去除衬底。

    METHODS AND APPARATUS FOR RAPID IMPRINT LITHOGRAPHY

    公开(公告)号:US20100244324A1

    公开(公告)日:2010-09-30

    申请号:US12794971

    申请日:2010-06-07

    IPC分类号: B28B7/12

    摘要: A mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface.