公开(公告)号：US20160004263A1

公开(公告)日：2016-01-07

申请号：US14322909

申请日：2014-07-02

Applicant: Microsoft Corporation

Inventor： Sean James ,  Christian L. Belady ,  Stephan W. Gilges ,  Sriram Sankar ,  John Siegler ,  Brian Andersen ,  Eric C. Peterson ,  J Darrin Schroeder

IPC: G05D23/00 ,  E04B9/00 ,  E04B5/48

CPC classification number: G05D23/00 ,  E04B5/48 ,  E04B9/00 ,  F24F11/0001 ,  F24F11/30 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20536 ,  H05K7/20554

Abstract: Electrical power is provided to power consuming, heat-exhausting devices by multiple gas-fueled electrical power sources located near such devices. Exhaust heat from such devices is utilized as intake cooling air for the gas-fueled power sources, thereby excluding them from cooling capacity requirements. The gas piping delivering gas to gas-fueled power sources is positioned so as to be within hot aisles comprising exhaust heat. The gas piping is located up high for lighter than air gasses and near the floor for heavier than air gasses, with leak detection located nearby. Additionally, gas piping is externally coated with material that visually indicates a leak. By locating gas piping in the hot aisle, exhausted heat increases temperature and, thereby, pressure of the gas, resulting in more efficient gas distribution through the piping and preventing valve freezing. Furthermore, the gas piping is located after potential ignition sources in the airstream.

Abstract translation: 通过位于这种装置附近的多个气体燃料电源将电力提供给耗电的排热装置。 这种装置的排气用作气体燃料动力源的进气冷却空气，从而排除了冷却能力的要求。 将气体输送到气体燃料电源的气体管道被定位成在包括排气热的热通道内。 气体管道位于比气体更轻的地方，靠近地面比气体重，泄漏检测位于附近。 此外，气体管道外部涂有可视化表示泄漏的材料。 通过将气体管道定位在热通道中，耗尽的热量会增加温度，从而增加气体的压力，从而更有效地通过管道分配气体并防止阀门冻结。 此外，气体管道位于气流中的潜在点火源之后。

公开(公告)号：US08937807B2

公开(公告)日：2015-01-20

申请号：US13300871

申请日：2011-11-21

Applicant: Carmelo Engracia Baquiano ,  Carmelo Delovino Cayaban ,  Paul Francis Brosas Montalbo ,  Joseph Estorgio Celocia

Inventor： Carmelo Engracia Baquiano ,  Carmelo Delovino Cayaban ,  Paul Francis Brosas Montalbo ,  Joseph Estorgio Celocia

IPC: H05K7/20 ,  G05D23/19 ,  H05K1/18

CPC classification number: G05D23/19 ,  H05K1/0201 ,  H05K1/18 ,  H05K7/20 ,  H05K7/20536 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/2018

Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.

Abstract translation: 包括在冷启动启动期间操作的加热装置的电路板组件包括具有计算机部件的电路板。 连接到电路板组件的热传递装置在计算机部件操作以移除由计算机部件产生的热量时起作用。 加热装置用于加热热转印装置。 当感测到计算机部件或热转印装置处的冷启动条件的温度时，现场可编程门阵列用于激励加热装置。 加热装置加热时的热转印装置将计算机部件加热到大于冷启动条件的温度。 连接到加热装置的控制装置提供加热装置的操作模式。

公开(公告)号：US20140248830A1

公开(公告)日：2014-09-04

申请号：US14277880

申请日：2014-05-15

Applicant: International Business Machines Corporation

Inventor： Frederic Bauchot ,  Jean-Yves Clement ,  Jean-Marc Legrand

IPC: H05K7/20

CPC classification number: H05K7/20209 ,  G05D23/1919 ,  H05K7/20 ,  H05K7/20536 ,  H05K7/20709 ,  H05K7/20718 ,  H05K7/20745 ,  H05K7/20836

Abstract: A cooling management system including component racks, a cooling system, pressure measurement devices, and a computing system within a structure. Each component rack includes an exothermic apparatus. The structure includes warm air aisle spaces and cold air aisle spaces located between the component racks. The cooling system feeds cold air into each cold air aisle space. The cold air flows through the component racks resulting in displacement of warm air from each exothermic apparatus. The warm air flows into the warm air aisle spaces and is directed back to the cooling system. The pressure measurement devices measure differential pressure values between the cold air aisle spaces and the warm air aisle spaces. The computing system monitors the differential pressure values, perform calculations associated with the differential pressure values, and control a fan speed of at least one fan within the cooling system based on the calculations.

Abstract translation: 包括组件机架，冷却系统，压力测量装置和结构内的计算系统的冷却管理系统。 每个组件机架包括放热装置。 该结构包括温暖的空气通道空间和位于组件架之间的冷空气通道空间。 冷却系统将冷空气送入每个冷空气通道空间。 冷空气流过组件机架，导致来自每个放热装置的暖空气的移动。 暖空气流入暖空气通道空间，并被引导回冷却系统。 压力测量装置测量冷气通道空间和暖空气通道间的差压值。 计算系统监视差压值，执行与差压值相关的计算，并且基于计算来控制冷却系统内的至少一个风扇的风扇速度。

公开(公告)号：US08693199B2

公开(公告)日：2014-04-08

申请号：US13775610

申请日：2013-02-25

Applicant: International Business Machines Corporation

Inventor： Eric A. Eckberg ,  Howard V. Mahaney ,  William M. Megarity ,  Roger R. Schmidt ,  Tejas Shah ,  Scott A. Shurson

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20536 ,  H05K7/20781

Abstract: A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Abstract translation: 提供了一种方法，其包括提供热交换器门，所述热交换器门包括横跨电子机架的空气入口或出口侧的至少一部分的门组件。 门组件包括气流开口，其有助于空气进入或流出通过电子机架的气流。 门组件还包括空气 - 冷却剂热交换器和结构支撑件。 热交换器设置成使得通过气流开口的气流穿过热交换器。 热交换器包括热交换器芯和耦合到芯的热交换器壳体。 该芯包括至少一个循环穿过壳体的冷却剂传送通道。 结构支撑件附接到热交换器壳体以与壳体一起限定管状门支撑结构。 通过热交换器壳体的冷却剂输送通道的循环位于管状门支撑结构内。

公开(公告)号：US08223497B2

公开(公告)日：2012-07-17

申请号：US12557277

申请日：2009-09-10

Applicant: Lance LeRoy Sundstrom ,  Michael Gillespie ,  Randolph Hook

Inventor： Lance LeRoy Sundstrom ,  Michael Gillespie ,  Randolph Hook

IPC: H05K7/20

CPC classification number: H05K7/1404 ,  H05K7/20436 ,  H05K7/20536

Abstract: A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position.

Abstract translation: 提供了一种用于机箱通道中的可扩展楔形夹具组件的模块。 模块包括第一侧，第二侧，附接到第一侧的第一延伸部和附接到第二侧的第二延伸部。 第一个扩展和第二个扩展是灵活的。 当楔形夹具组件膨胀时，第一延伸部和第二延伸部从第一位置弯曲到第二位置。 当楔形夹具从扩张位置返回到松弛位置时，第一延伸部和第二延伸部从第二位置返回到第一位置。

公开(公告)号：US06497110B2

公开(公告)日：2002-12-24

申请号：US09941137

申请日：2001-08-28

Applicant: Howard L. Davidson ,  Dennis M. Pfister ,  Charles Byrd

Inventor： Howard L. Davidson ,  Dennis M. Pfister ,  Charles Byrd

IPC: F25D2312

CPC classification number: H05K7/20354 ,  F25B17/08 ,  F25B35/04 ,  F25B39/026 ,  F25B49/046 ,  F25B2333/005 ,  F25D23/12 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05B6/701 ,  H05B6/802 ,  H05B6/808 ,  H05K7/20309 ,  H05K7/20363 ,  H05K7/20536 ,  H01L2924/00

Abstract: To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.

公开(公告)号：US06388882B1

公开(公告)日：2002-05-14

申请号：US09909360

申请日：2001-07-19

Applicant: L. Ronald Hoover ,  Jon Zuo ,  A. L. Phillips

Inventor： L. Ronald Hoover ,  Jon Zuo ,  A. L. Phillips

IPC: H05K720

CPC classification number: H05K7/20336 ,  F28D15/0266 ,  H05K7/20536

Abstract: The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electronic components and subsystems, in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.

Abstract translation: 本发明提供了一种用于电子部件和子系统的功能系统的热能管理架构，其包括分层方案，其中热管理部件是：（i）以多个限定级别与电子部件和子系统的系统的各个部分可操作地接合 和（ii）基本上只有热驱动的，即，没有移动部件并且不需要外部动力来进行操作的传热装置。 在一个实施例中，热管理装置和技术在功能电子系统内分为五个独立的级别。 在另一个实施例中，提供了用于绕过五个等级中的一个或多个的第六级。

公开(公告)号：US06205803B1

公开(公告)日：2001-03-27

申请号：US08639893

申请日：1996-04-26

Applicant: Robert Peter Scaringe

Inventor： Robert Peter Scaringe

IPC: F25B4100

CPC classification number: H05K7/20536 ,  B64D2013/0614 ,  F25B5/02 ,  F25B6/00 ,  F25B39/04 ,  F25B41/04 ,  H05K7/20354

Abstract: A thermal control method and apparatus flows refrigerant of a vapor compression system through a plate of an avionics pod so as to provide a compact and efficient cooling technique for aircraft performing a variety of missions. The plate can serve as an evaporator in a heat pump loop or a heat exchanger in a pumped coolant loop. As a result, the same components can be used for convection cooling and compressor-assisted cooling. At lower temperatures, the pump is operational whereas under less favorable conditions the compressor is operable. A bypass can be provided to provide thermal control where ambient temperature is excessively low. A water boiler can also be utilized when, for short periods, the ambient temperature is higher than the desired temperature for the electronics package.

Abstract translation: 热控制方法和装置使蒸汽压缩系统的制冷剂通过航空电子舱的板流动，从而为执行各种任务的飞机提供紧凑而有效的冷却技术。 该板可用作热泵回路中的蒸发器或泵送的冷却剂回路中的热交换器。 因此，相同的部件可用于对流冷却和压缩机辅助冷却。 在较低温度下，泵是可操作的，而在不利条件下，压缩机是可操作的。 可以提供旁路以提供环境温度过低的热控制。 当短时间内环境温度高于电子封装的所需温度时，也可以利用水锅炉。

公开(公告)号：US5586004A

公开(公告)日：1996-12-17

申请号：US464739

申请日：1995-06-22

Applicant: Ross M. Green ,  Michael J. Kellaway ,  David J. Shemmans ,  David J. McShane

Inventor： Ross M. Green ,  Michael J. Kellaway ,  David J. Shemmans ,  David J. McShane

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H05K7/20536 ,  B60L2210/20 ,  B60L2240/526 ,  H01L2924/0002 ,  Y02T10/725

Abstract: A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201,203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).

Abstract translation: PCT No.PCT / GB94 / 00110 Sec。 371日期：1995年6月22日 102（e）日期1995年6月22日PCT 1994年1月20日PCT PCT。 公开号WO94 / 17649 日期1994年8月4日功率半导体安装组件包括以中心轴线为中心对称布置的多个模块（20）。 每个模块具有用于安装半导体部件（205）的一个或多个散热基板表面（201,203）和用于使流体冷却介质通过其中以冷却半导体部件的内部通道（202）。 组件可以包括提供衬底表面（243）的棱柱体（24）。

公开(公告)号：US5090476A

公开(公告)日：1992-02-25

申请号：US672536

申请日：1991-03-20

Applicant: Manfred Immel

Inventor： Manfred Immel

IPC: H05K7/20

CPC classification number: H05K7/20536 ,  H05K7/20609 ,  Y10S165/311

Abstract: This invention relates to an air-water heat exchanger with an exchanger unit and a blower contained in a housing, which can be placed on the cover of a control box or the like and which is provided on the side facing the cover with an inlet and an outlet opening, which are aligned with corresponding openings in the cover of the control box or the like. By a particular routing of the air in the area of the inlet and outlet openings of the exchanger unit, even in case of leakage of the exchanger unit, no water can come out of the inlet and/or outlet openings and reach the control box or the like.

Abstract translation: 本发明涉及具有交换器单元和容纳在壳体中的鼓风机的空气 - 水热交换器，其可以放置在控制箱等的盖上，并且设置在面向盖的一侧上具有入口和 出口开口，其与控制箱等的盖中的对应开口对准。 通过在交换器单元的入口和出口开口的区域中的空气的特定布线，即使在交换器单元泄漏的情况下，也不会有水从入口和/或出口开口出来并到达控制箱或 类似。