公开(公告)号：US3204084A

公开(公告)日：1965-08-31

申请号：US27865963

申请日：1963-05-07

申请人： GEN DYNAMICS CORP

发明人： SPENCER JR JESSIE H ,  BOWDEN DEAN T

IPC分类号： B64D15/12 ,  H05B3/36

CPC分类号： B64D15/12 ,  H05B3/36 ,  H05B2203/005 ,  H05B2203/007 ,  H05B2203/011 ,  H05B2203/017 ,  H05B2203/033 ,  H05B2214/02

公开(公告)号：US2884509A

公开(公告)日：1959-04-28

申请号：US64407057

申请日：1957-03-05

申请人： ELECTROFILM INC

发明人： HEATH ARTHUR N

IPC分类号： H05B3/34

CPC分类号： H05B3/342 ,  H05B2203/003 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/015 ,  H05B2203/017 ,  H05B2203/033

公开(公告)号：US2631219A

公开(公告)日：1953-03-10

申请号：US9171149

申请日：1949-05-06

申请人： SUCHY CHARLES T

发明人： SUCHY CHARLES T

IPC分类号： H05B3/34

CPC分类号： H05B3/342 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/036

公开(公告)号：US20240245129A1

公开(公告)日：2024-07-25

申请号：US18624096

申请日：2024-04-01

申请人： SHENZHEN GEEKVAPE TECHNOLOGY CO., LTD.

发明人： Shengwei ZHANG

IPC分类号： A24F40/48 ,  A24F40/10 ,  A24F40/44 ,  A24F40/46 ,  H05B3/06

CPC分类号： A24F40/48 ,  A24F40/10 ,  A24F40/44 ,  A24F40/46 ,  H05B3/06 ,  H05B2203/007 ,  H05B2203/016 ,  H05B2203/021

摘要： The present embodiment discloses an atomizing core, including an atomizing base and a heating member. The atomizing base is configured to be in contact with an atomizing medium. The atomizing base has an atomizing passage inside, and an air inlet and an air outlet of the atomizing passage are respectively in communication with two end faces of the atomizing base. The cross section of the atomizing passage perpendicular to the extending direction thereof has at least two shapes. The heating member is disposed in the atomizing passage and is arranged in a circumferential direction of the atomizing passage. The heating member at least covers more than half of the atomizing passage in the circumferential direction.

公开(公告)号：US20240092023A1

公开(公告)日：2024-03-21

申请号：US17990256

申请日：2022-11-18

申请人： Sprintray Imc.

发明人： Huijian Tian ,  Aayush Patel ,  Anjali Daniels

IPC分类号： B29C64/386 ,  B29C64/295 ,  B33Y30/00 ,  B33Y50/00 ,  G05D23/19 ,  H05B3/28

CPC分类号： B29C64/386 ,  B29C64/295 ,  B33Y30/00 ,  B33Y50/00 ,  G05D23/1931 ,  H05B3/28 ,  H05B2203/007

摘要： A heating and sensing system for use with three-dimensional (3D) printing systems is provided. The heating and sensing system includes heating elements and/or sensor devices configured with a printing platform to set and sense the temperature of the platform. The system includes one or more controllers electrically configured with the heating elements and/or with the sensor devices via an electrical interface provided between the printing platform and a corresponding printer arm. The controller(s) are used to control the various elements of the system.

公开(公告)号：US20240044526A1

公开(公告)日：2024-02-08

申请号：US17882904

申请日：2022-08-08

申请人： Haier US Appliance Solutions, Inc.

发明人： Joshua Duane Longenecker ,  Bryan Isaac D'Souza ,  Richard Dustin Henderson ,  Charles D. Robinson, III ,  Timothy Scott Shaffer

IPC分类号： F24F1/0093 ,  H05B3/18 ,  F24F13/08 ,  H05B1/02

CPC分类号： F24F1/0093 ,  H05B3/18 ,  F24F13/08 ,  H05B1/028 ,  H05B2203/013 ,  F24F2221/34 ,  H05B2203/007

摘要： An air conditioner unit includes an indoor heat exchanger assembly positioned in an indoor portion of the air conditioner unit. The indoor heat exchanger assembly includes an indoor heat exchanger and an indoor fan. The air conditioner unit also includes a heating unit. The heating unit may be positioned in the indoor portion of the air conditioner unit downstream of the indoor fan and/or at the exhaust side of the indoor fan.

公开(公告)号：US11716792B2

公开(公告)日：2023-08-01

申请号：US16768226

申请日：2018-11-30

申请人： Pilkington Group Limited

发明人： Leigh Francis Mellor

IPC分类号： H05B3/86 ,  B32B17/10

CPC分类号： H05B3/86 ,  B32B17/10036 ,  B32B17/10174 ,  H05B2203/007 ,  H05B2203/011 ,  H05B2203/013 ,  H05B2203/016 ,  H05B2203/017 ,  H05B2203/031

摘要： The invention concerns a conductive pattern sheet for use in a glazing, comprising a substrate, a conductive pattern arranged on the substrate, wherein the conductive pattern comprises first and second busbars arranged at opposing edges of the conductive pattern for connecting a power supply thereto, a plurality of conductive lines each conductive line arranged between the first and second busbars, wherein at least a portion of the plurality of conductive lines is configured to have a transition region wherein a change from a first resistance per unit length (R1) at a first end of the transition region to a second resistance per unit length (R2) at a second end of the transition region occurs over a predetermined length (L) of the transition region wherein a rate of change of resistance per unit length (R1-R2)/L is from 1 to 16,000 ohms per centimetre squared and the substrate is a polymer sheet.

公开(公告)号：US20230217550A1

公开(公告)日：2023-07-06

申请号：US17784113

申请日：2020-12-11

申请人： Phoenix Contact GmbH & Co. KG

发明人： Frank Best ,  Patrick Hartmann

IPC分类号： H05B3/26 ,  H05B1/02

CPC分类号： H05B3/26 ,  H05B1/0294 ,  H05B2203/007

摘要： A device for thermally loading an enclosure and/or a heat sink includes: at least one circuit board arranged or arrangeable in the enclosure or on the heat sink, each at least one circuit board having at least one conductor track and at least two fields within each of which a continuous electrically conductive track section of the at least one conductor track runs, a path length of the at least one conductor track section within each of the at least two fields being greater than one or each edge length of a respective field or one or each diagonal of the respective field or a perimeter of the respective field. The fields include tiles of a tiling of a first side of the circuit board The conductor track sections each thermally load the enclosure and/or the heat sink depending on a current feed to the respective conductor track.

公开(公告)号：US20230217549A1

公开(公告)日：2023-07-06

申请号：US17990052

申请日：2022-11-18

申请人： Micron Optoelectronics Co., Ltd.

发明人： Wei SU ,  Shourong HU ,  Guoliang ZHANG ,  Yu SU

IPC分类号： H05B3/20 ,  H05B1/02

CPC分类号： H05B3/20 ,  H05B1/02 ,  H05B2203/017 ,  H05B2203/013 ,  H05B2203/007

摘要： Disclosed are an electrothermal film structure, an electrothermal film heating device and a method for manufacturing an electrothermal film. The electrothermal film structure includes a supporting layer, a meshed conductive circuit layer and a transparent optical layer. The meshed conductive circuit layer provided on the supporting layer includes several micron-level conductive circuits distributed in a mesh, and the transparent optical layer is provided on the meshed conductive circuit layer.

公开(公告)号：US20190208579A1

公开(公告)日：2019-07-04

申请号：US16334195

申请日：2017-08-22

申请人： Heraeus Noblelight GmbH

发明人： Lotta GAAB ,  Thomas PIELA ,  Christoph STERNKIKER ,  Jürgen WEBER

IPC分类号： H05B3/26 ,  H05B3/24 ,  H01L21/67 ,  H01L21/673

CPC分类号： H05B3/265 ,  H01L21/67098 ,  H01L21/673 ,  H05B3/24 ,  H05B3/262 ,  H05B2203/003 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/032

摘要： Infrared panel radiators are provided including a carrier with a heating surface, and a printed conductor made of an electrically conductive resistor material that generates heat when current flows through it. The printed conductor is applied to a printed conductor occupation surface of the carrier. The printed conductor includes a first printed conductor section for generation of a first power per unit area and a second printed conductor section for generation of a second power per unit area that differs from the first power per unit area. The carrier contains a composite material including an amorphous matrix component and an additional component in the form of a semiconductor material. The first printed conductor section and the second printed conductor section are circuited in series and differ from each other by their occupation density and/or by their conductor cross-section.