公开(公告)号：US09915556B2

公开(公告)日：2018-03-13

申请号：US15082059

申请日：2016-03-28

申请人： TactoTek Oy

发明人： Antti Keränen ,  Mikko Heikkinen

IPC分类号： G01D11/28 ,  F21V23/04 ,  F21K9/60 ,  H01H13/83

摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

公开(公告)号：US20160345437A1

公开(公告)日：2016-11-24

申请号：US15158645

申请日：2016-05-19

申请人： TactoTek Oy

发明人： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Jarkko TORVINEN

IPC分类号： H05K1/18 ,  H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L31/0203 ,  H05K1/02 ,  H01L31/02

CPC分类号： H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

摘要： A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device

摘要翻译： 一种用于电子设备的多层结构，其具有用于容纳电子设备（204）的柔性基底膜（202）。 设置在所述衬底膜（202）上的至少一个电子部件（204）; 以及设置在所述衬底膜（202）上的多个导电迹线（206），用于对包括所述至少一个电子部件（204）的电子元件进行电力供应和/或连接，其中至少一个优选地，热成型盖（210）附接到所述 在所述至少一个电子部件（204）的顶部上的所述基底膜（202），所述至少一个热成型盖（210）和容纳所述电子器件（204）的所述基底膜（202）用热塑性材料（208）包覆成型。 本发明还涉及一种用于制造电子设备的多层结构的方法

公开(公告)号：US20150308639A1

公开(公告)日：2015-10-29

申请号：US14264273

申请日：2014-04-29

申请人： Tactotek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21K99/00 ,  F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

摘要翻译： 一种电子产品的制造方法，包括：获得柔性光学上基本上透明或半透明的基片; 根据预定示意图在基片上印刷多个电导体; 根据示意图，在基板上打印或布置包括光电发光，优选LED（发光二极管））的多个电子部件，其中至少一些印刷导体被配置为向其提供电流; 以及将柔性的光学上基本上透明的光导薄片附接到所述基底上，以便建立功能性多层结构，其中由所述光发射组件发射的光被耦合到所述光导，在其中传播，并且至少部分地耦合到 通过基板的环境。 介绍了相关的布置和电子设备。

公开(公告)号：US20150257278A1

公开(公告)日：2015-09-10

申请号：US14198833

申请日：2014-03-06

申请人： TactoTek Oy

发明人： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC分类号： H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC分类号： H05K3/1216 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0108 ,  H05K2203/1105 ,  H05K2203/1316 ,  Y10T29/53174

摘要： A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

摘要翻译： 一种用于制造电子产品的方法，包括提供柔性的，可选地光学上基本上透明或半透明的基底膜，在基底膜上印刷多个导电墨水导电迹线，所述迹线限定多个导体和导电接触区域，用于 至少一个电子表面可安装部件的接触件，将至少一个电子表面安装部件（例如集成电路）布置在基板膜上，使得当它们仍然是湿的时候触点满足预定的接触区域以建立电气 连接，并且进一步固定，任选地包覆成型组件。 介绍相关安排和电子产品。

公开(公告)号：US20140049516A1

公开(公告)日：2014-02-20

申请号：US13970649

申请日：2013-08-20

申请人： TACKTOTEK OY

发明人： Mikko Olavi Heikkinen ,  Antti Johannes Keranen ,  Juha Heikki Salo

IPC分类号： G06F3/042

CPC分类号： G06F3/042 ,  G06F3/0421 ,  G06F2203/04109 ,  Y10T29/49105

摘要： A touch panel (10) includes a first planar substrate (30) for receiving tactile contact from one or more objects. The first planar substrate (30) is operable to guide light radiation (310) therein by total internal reflection (TIR), wherein electronic circuits (220) are provided to transmit and detect the light radiation (310) guided within the first planar substrate (30) and to detect spatial positions of the tactile contact (40) of the one or more objects by a corresponding disturbance in the light radiation (310) propagating within the first planar substrate (30). The electronic circuits (220) are implemented by way of printed and/or deposited electronic elements onto at least one of: a trim (200) of the touch panel (10), the first planar substrate (30), a second planar protective substrate (20) which is operable to provide protection to the electronic circuits (220).

摘要翻译： 触摸面板（10）包括用于从一个或多个物体接收触觉接触的第一平面基板（30）。 第一平面基板（30）可操作以通过全内反射（TIR）引导其中的光辐射（310），其中提供电子电路（220）以传输和检测在第一平面基板（...）内引导的光辐射（310） 并且通过在第一平面基板（30）内传播的光辐射（310）中的对应扰动来检测一个或多个物体的触觉（40）的空间位置。 电子电路（220）通过印刷和/或沉积的电子元件实现到以下至少一个：触摸面板（10）的装饰（200），第一平面基板（30），第二平面保护基板 （20），其可操作以向所述电子电路（220）提供保护。

公开(公告)号：US20130234171A1

公开(公告)日：2013-09-12

申请号：US13787860

申请日：2013-03-07

申请人： TACTOTEK OY

发明人： Mikko Heikkinen ,  Antti Keranen ,  Juha Salo

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  G02B6/0021 ,  G02B6/0046 ,  G02B6/0065 ,  G02B6/0068 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method and a system for forming one or more integrated light guides comprising one or more light sources and one or more light transmissive materials are disclosed. At least one of the one or more light transmissive materials is capable of transmitting light emitted by at least one of the one or more light sources. The method includes disposing the one or more light sources on one or more sides of a substrate to form an arrangement of the one or more light sources. Additionally, the method includes molding the one or more light transmissive materials onto one or more parts of one or more sides of the arrangement of the one or more light sources to form the one or more integrated light guides.

摘要翻译： 公开了一种用于形成包括一个或多个光源和一个或多个透光材料的一个或多个集成光导的方法和系统。 一个或多个透光材料中的至少一个能够透射由一个或多个光源中的至少一个发射的光。 该方法包括将一个或多个光源设置在衬底的一个或多个侧面上以形成一个或多个光源的布置。 另外，该方法包括将一个或多个光透射材料模制成一个或多个光源的布置的一个或多个侧面的一个或多个部分，以形成一个或多个集成光导。

公开(公告)号：US12095016B1

公开(公告)日：2024-09-17

申请号：US18398773

申请日：2023-12-28

申请人： TactoTek Oy

发明人： Miikka Kärnä ,  Ilpo Hänninen ,  Samuli Yrjänä ,  Simo Koivikko

IPC分类号： H01L33/60 ,  H01L25/075 ,  H01L33/48 ,  H10K50/842 ,  H10K50/856

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/483 ,  H10K50/842 ,  H10K50/856 ,  H01L2933/0058

摘要： An integrated optically functional multilayer structure including a flexible, substrate film arranged with a circuit design including electrical conductors on a first side of the substrate film; at least one light source provided upon the first side of the substrate film and connected to the circuit design the at least one light source internally illuminates at least a portion of the structure for external perception; and an optically transmissive layer produced upon the first side of the substrate film and the at least one light source said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source; wherein the substrate film defines holes therethrough and upon one or more of them the optically transmissive layer defines an outcoupling surface, configured to redirect and reflect, incident light emitted by light sources of the at least one light source.

公开(公告)号：US20240237218A1

公开(公告)日：2024-07-11

申请号：US18609232

申请日：2024-03-19

申请人： TactoTek Oy

发明人： Vinski BRÄYSY ,  Ilpo HÄNNINEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Topi WUORI ,  Mikko SIPPARI ,  Heikki ALAMÄKI

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/12 ,  H05K3/30 ,  H05K3/32

CPC分类号： H05K1/181 ,  H05K1/111 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

摘要： A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US11950367B2

公开(公告)日：2024-04-02

申请号：US18353143

申请日：2023-07-17

申请人： TactoTek Oy

发明人： Vinski Bräysy ,  Ilpo Hänninen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Topi Wuori ,  Mikko Sippari ,  Heikki Alamäki

IPC分类号： H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

CPC分类号： H05K1/181 ,  H05K1/111 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

摘要： A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US11906774B2

公开(公告)日：2024-02-20

申请号：US18326110

申请日：2023-05-31

申请人： TactoTek Oy

发明人： Antti Keränen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC分类号： F21V8/00 ,  G02B5/08

CPC分类号： G02B6/0031 ,  G02B6/004 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0061 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B5/0883

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.