Ultrasonic device and electronic apparatus

    公开(公告)号:US11041832B2

    公开(公告)日:2021-06-22

    申请号:US16431783

    申请日:2019-06-05

    IPC分类号: G01N29/32 B65H7/12

    摘要: An ultrasonic device has a substrate in which ultrasonic elements transmitting an ultrasonic wave in a first direction are arrayed. A reverberation reduction film which reduces reverberant vibration of the substrate is arranged on a side of the first direction in the ultrasonic element. In the reverberation reduction film, a groove is arranged between the ultrasonic elements next to each other.

    Liquid surface sensor and liquid surface detection method

    公开(公告)号:US10656003B2

    公开(公告)日:2020-05-19

    申请号:US16203908

    申请日:2018-11-29

    发明人: Chikara Kojima

    摘要: A liquid surface sensor includes a hollow member having a first opening end and a second opening end, and a sensor unit provided so as to close the first opening end of the hollow member. The sensor unit includes a vibration plate, and a piezoelectric element which is provided on the vibration plate and is formed by laminating a first electrode film, a piezoelectric film, and a second electrode film in a thickness direction of the vibration plate.

    Ultrasound sensor and method of manufacturing thereof

    公开(公告)号:US10130339B2

    公开(公告)日:2018-11-20

    申请号:US15115146

    申请日:2015-06-30

    发明人: Chikara Kojima

    摘要: An ultrasound sensor, including a plurality of ultrasound elements which include a first electrode, a piezoelectric layer, and a second electrode and which are arranged in a first direction and a second direction, in which at least a portion of the plurality of ultrasound elements are grouped, at least one of the first electrode and the second electrode is shared for each of the grouped ultrasound elements, bypass wiring is connected to at least one of the shared first electrode and second electrode, a following α value of the bypass wiring is greater than the α value of the first electrode or second electrode on which the bypass wiring is connected, and the electric resistance value per unit length of the bypass wiring is lower than that of the first electrode or the second electrode. α value=(Young's modulus of Constituent Material)×(cross-sectional area of wiring or electrode).