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    SPECTROMETER APPARATUS
    51.
    发明申请
    SPECTROMETER APPARATUS 审中-公开

    公开(公告)号：US20190301930A1

    公开(公告)日：2019-10-03

    申请号：US15938605

    申请日：2018-03-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： Sara Loi ,  Alberto Pagani ,  Guido Chiaretti

    IPC: G01J3/02 ,  G01J3/28 ,  G01J3/14

    Abstract: A spectrometer includes a substrate; a plurality of light detectors in the substrate; and a plurality of light filters over the plurality of light detectors, each of the plurality of light filters transmitting a different wavelength or reflecting a different wavelength, each of the light filters aligned with a corresponding one of the plurality of light detectors.

    Integrated circuit comprising at least an integrated antenna
    52.
    发明授权
    Integrated circuit comprising at least an integrated antenna 有权

    公开(公告)号：US10424633B2

    公开(公告)日：2019-09-24

    申请号：US16052777

    申请日：2018-08-02

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alberto Pagani ,  Alessandro Finocchiaro

    IPC: H01L49/02 ,  G01R31/28 ,  G01R31/302 ,  H01L21/66 ,  H01L23/528 ,  H01L23/00 ,  H01L23/58 ,  H01L23/66 ,  H01L29/06 ,  H01L23/544 ,  H01L25/065

    Abstract: A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.

    Inverse electrowetting energy harvesting and scavenging methods, circuits and systems
    54.
    发明授权
    Inverse electrowetting energy harvesting and scavenging methods, circuits and systems 有权

    公开(公告)号：US10250163B2

    公开(公告)日：2019-04-02

    申请号：US15143015

    申请日：2016-04-29

    Applicant: STMicroelectronics S.R.L.

    Inventor： Sara Loi ,  Alberto Pagani

    IPC: H02N1/08

    Abstract: An inverse electrowetting harvesting and scavenging circuit includes a first substrate having first and second surfaces. An electrode is formed proximate the first surface and includes an insulating layer covering a surface of the electrode. An electromechanical systems device includes a moveable mass extending over the first surface of the first substrate that may be displaced relative to the first substrate in three dimensions responsive to external forces applied to the moveable mass. The movable mass includes a moveable electrode and a conductive fluid is positioned between the insulating layer of the electrode and the movable electrode. Energy harvesting and scavenging circuitry is electrically coupled to the moveable electrode and the other electrode and is configured to provide electrical energy responsive to electrical energy generated by the moveable electrode, conductive fluid and the electrode through the reverse electrowetting phenomena due to movement of the moveable electrode relative to the electrode and to the conductive fluid on top of the electrode.

    Method of filling probe indentations in contact pads
    55.
    发明授权
    Method of filling probe indentations in contact pads 有权

    公开(公告)号：US10186463B2

    公开(公告)日：2019-01-22

    申请号：US15005178

    申请日：2016-01-25

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alberto Pagani

    IPC: H01L21/66 ,  H01L23/00 ,  G01R31/28 ,  H01L21/768 ,  H01L23/528 ,  H01L23/532

    Abstract: An integrated electronic circuit has probe indentations filled by a hard covering substance. The integrated circuit device results from a process of manufacturing including forming a substrate comprising a plurality of functional components of the electronic circuit, creating a plurality of conductive layers on such substrate to form an electric contact region with high hardness equal to or greater than a first hardness value of about 300 HV, contacting the electric contact region with a probe thereby causing an indentation. The process further comprises, after the test run, creating a covering conductive layer on at least one part of the electric contact region contacted by the probe to fill the indentation.

    Integrated circuit (IC) including semiconductor resistor and resistance compensation circuit and related methods
    56.
    发明授权
    Integrated circuit (IC) including semiconductor resistor and resistance compensation circuit and related methods 有权

    公开(公告)号：US10153073B2

    公开(公告)日：2018-12-11

    申请号：US15614292

    申请日：2017-06-05

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alberto Pagani ,  Alessandro Motta

    IPC: H01C7/10 ,  H01L27/02 ,  H01L49/02 ,  H01L23/34 ,  H01L29/36 ,  H01L21/66

    Abstract: In one example, a method of compensating resistance in an integrated circuit includes providing a four terminal resistor in a semiconductor substrate. The resistor includes a first resistor and a second resistor coupled in series, a first terminal at a first end of the resistor, a second terminal at a second end of the resistor, a test terminal at a node connecting the first resistor and the second resistor, and a tuning terminal. The first resistor has a first conductivity type and the second resistor has a second conductivity type opposite to the first conductivity type. The first resistor includes a first portion extending along a first direction and a second portion extending along a second direction perpendicular to the first direction. The method further includes computing a voltage to be applied at the tuning terminal to compensate the difference between the resistance of the first and the second resistors.

    Method for producing probes for testing integrated electronic circuits
    58.
    发明授权
    Method for producing probes for testing integrated electronic circuits 有权

    公开(公告)号：US10107837B2

    公开(公告)日：2018-10-23

    申请号：US14950171

    申请日：2015-11-24

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alberto Pagani

    IPC: H05K3/30 ,  G01R3/00 ,  G01R1/067 ,  G01R31/319 ,  G01R1/073

    Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

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