摘要:
A high performance TMR sensor is fabricated by employing a composite inner pinned (AP1) layer in an AP2/Ru/AP1 pinned layer configuration. In one embodiment, there is a 10 to 80 Angstrom thick lower CoFeB or CoFeB alloy layer on the Ru coupling layer, a and 5 to 50 Angstrom thick Fe or Fe alloy layer on the CoFeB or CoFeB alloy, and a 5 to 30 Angstrom thick Co or Co rich alloy layer formed on the Fe or Fe alloy. A MR ratio of about 48% with a RA of
摘要:
A high performance TMR sensor with a spacer including at least one Cu layer and one or more MgO layers is disclosed. Optionally, Cu may be replaced by one of Au, Zn, Ru, or Al. In addition, there may be a dopant such as Zn, Mn, Al, Cu, Ni, Cd, Cr, Ti, Zr, Hf, Ru, Mo, Nb, Co, or Fe in the MgO layer. In an alternative embodiment, the MgO layer may be replaced by other low band gap insulating or semiconductor materials. A resonant tunneling mechanism is believed to be responsible for achieving an ultra-low RA of
摘要:
A composite seed layer that reduces the shield to shield distance in a read head while improving Hex and Hex/Hc is disclosed and has a SM/A/SM/B configuration in which the SM layers are soft magnetic layers, the A layer is made of at least one of Co, Fe, Ni, and includes one or more amorphous elements, and the B layer is a buffer layer that contacts the AFM layer in the spin valve. The SM/A/SM stack together with the S1 shield forms an effective shield such that the buffer layer serves as the effective seed layer with a thickness as low as 5 Angstroms while maintaining a blocking temperature of 260° C. in the AFM layer. The lower SM layer may be omitted. Examples of the amorphous layer are CoFeB, CoFeZr, CoFeNb, CoFeHf, CoFeNiZr, CoFeNiHf, and CoFeNiNbZr while the buffer layer may be Cu, Ru, Cr, Al, or NiFeCr.
摘要翻译:公开了一种复合种子层,其在改善Hex和Hex / Hc的同时减小了读头中屏蔽距离的屏蔽,并具有SM / A / SM / B构造,其中SM层是软磁性层,制成A层 的Co,Fe,Ni中的至少一种,并且包括一个或多个非晶元素,并且B层是与自旋阀中的AFM层接触的缓冲层。 SM / A / SM堆叠与S1屏蔽形成有效的屏蔽,使得缓冲层用作有效种子层,其厚度低至5埃,同时在AFM层中保持260℃的阻挡温度。 可以省略下层SM层。 非晶层的实例是CoFeB,CoFeZr,CoFeNb,CoFeHf,CoFeNiZr,CoFeNiHf和CoFeNiNbZr,而缓冲层可以是Cu,Ru,Cr,Al或NiFeCr。
摘要:
A TMR sensor and a CPP GMR sensor all include a free layer that is of the form CoFexBy/non-magnetic layer/NiFez or of the form CoFe/CoFeB/non-magnetic layer/NiFe, where, in one embodiment, the thickness of the non-magnetic layer is less than approximately 15 angstroms and the atom percentage x, z of Fe can vary between 0 and 70% for x and 0 and 100% for z and the atom percentage, y, of B can vary between 0 and 30%. This arrangement can produce a 5-10% improvement in dR/R and can allow the coupling field between the CoFeB and the NiFe to be strong enough that an in-stack biasing of the CoFeB layer occurs and the hysteresis behavior and stability of the sensor is improved.
摘要:
A MTJ structure is disclosed in which the seed layer is made of a lower Ta layer, a middle Hf layer, and an upper NiFe or NiFeX layer where X is Co, Cr, or Cu. Optionally, Zr, Cr, HfZr, or HfCr may be employed as the middle layer and materials having FCC structures such as CoFe and Cu may be used as the upper layer. As a result, the overlying layers in a TMR sensor will be smoother and less pin dispersion is observed. The Hex/Hc ratio is increased relative to that for a MTJ having a conventional Ta/Ru seed layer configuration. The trilayer seed configuration is especially effective when an IrMn AFM layer is grown thereon and thereby reduces Hin between the overlying pinned layer and free layer. Ni content in the NiFe or NiFeX middle layer is above 30 atomic % and preferably >80 atomic %.
摘要:
A high performance TMR sensor is fabricated by employing a composite inner pinned (AP1) layer in an AP2/Ru/AP1 pinned layer configuration. In one embodiment, there is a 10 to 80 Angstrom thick lower CoFeB or CoFeB alloy layer on the Ru coupling layer, a and 5 to 50 Angstrom thick Fe or Fe alloy layer on the CoFeB or CoFeB alloy, and a 5 to 30 Angstrom thick Co or Co rich alloy layer formed on the Fe or Fe alloy. A MR ratio of about 48% with a RA of
摘要:
The conventional free layer in a CPP GMR read head has been replaced by a tri-layer laminate comprising Co rich CoFe, moderately Fe rich NiFe, and heavily Fe rich NiFe. The result is an improved device that has a higher MR ratio than prior art devices, while still maintaining free layer softness and acceptable magnetostriction. A process for manufacturing the device is also described.
摘要:
A method of forming a high performance magnetic tunnel junction (MTJ) is disclosed wherein the tunnel barrier includes at least three metal oxide layers. The tunnel barrier stack is partially built by depositing a first metal layer, performing a natural oxidation (NOX) process, depositing a second metal layer, and performing a second NOX process to give a MOX1/MOX2 configuration. An uppermost metal layer on the MOX2 layer is not oxidized until after the MTJ stack is completely formed and an annealing process is performed to drive unreacted oxygen in the MOX1 and MOX2 layers into the uppermost metal layer. In an alternative embodiment, a plurality of metal oxide layers is formed on the MOX1 layer before the uppermost metal layer is deposited. The resulting MTJ stack has an ultralow RA around 1 ohm-μm2 and maintains a high magnetoresistive ratio characteristic of a single metal oxide tunnel barrier layer.
摘要:
A composite free layer having a FL1/insertion/FL2 configuration is disclosed for achieving high dR/R, low RA, and low λ in TMR or GMR sensors. Ferromagnetic FL1 and FL2 layers have (+) λ and (−) λ values, respectively. FL1 may be CoFe, CoFeB, or alloys thereof with Ni, Ta, Mn, Ti, W, Zr, Hf, Tb, or Nb. FL2 may be CoFe, NiFe, or alloys thereof with Ni, Ta, Mn, Ti, W, Zr, Hf, Tb, Nb, or B. The thin insertion layer includes at least one magnetic element such as Co, Fe, and Ni, and at least one non-magnetic element selected from Ta, Ti, W, Zr, Hf, Nb, Mo, V, Cr, or B. In a TMR stack with a MgO tunnel barrier, dR/R>60%, λ˜1+10−6, and RA=1.2 ohm-um2 when FL1 is CoFe/CoFeB/CoFe, FL2 is CoFe/NiFe/CoFe, and the insertion layer is CoTa or CoFeBTa.
摘要:
The invention discloses how the insertion of a layer of CoFeB serves to increase the robustness of an MTF device by smoothing the interface between the tunnel barrier and the pinned layer.