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公开(公告)号：US20160141473A1
公开(公告)日：2016-05-19
申请号：US14988334
申请日：2016-01-05
CPC分类号： H01L33/60 , G02B5/1861 , G02B5/1871 , G02B19/0028 , G02B19/0061 , H01L33/105 , H01L33/52 , H01L33/58 , H01L2933/005 , H01L2933/0058 , H01L2933/0083
摘要： A light emitting diode device is described which includes at least one planar non-periodic high-index-contrast grating. The light emitting diode device includes a cavity formed between a reflective optical element and a transmissive optical element. One or both of the optical elements can be a planar non-periodic high-index-contrast grating. The transmissive optical element can be a collimating lens used to collimate incident beams of light while the reflective optical element can be a parabolic reflector used to reflect incident beams of light along a direction opposite to an incidence direction. A light emitter can be disposed within the cavity and can emit beams of light.
摘要翻译： 描述了包括至少一个平面非周期性高折射率对比度光栅的发光二极管器件。 发光二极管装置包括在反射光学元件和透射光学元件之间形成的空腔。 一个或两个光学元件可以是平面非周期性高折射率对比度光栅。 透射光学元件可以是用于准直入射光束的准直透镜，而反射光学元件可以是用于沿着与入射方向相反的方向反射入射光束的抛物面反射器。 光发射器可以设置在空腔内并且可以发射光束。
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公开(公告)号：US11923899B2
公开(公告)日：2024-03-05
申请号：US17539275
申请日：2021-12-01
IPC分类号： H04B10/079
CPC分类号： H04B10/07955
摘要： Examples described herein relate to a method for synchronizing a wavelength of light in an optical device. In some examples, a heater voltage may be predicted for a heater disposed adjacent to the optical device in a photonic chip. The predicted heater voltage may be applied to the heater to cause a change in the wavelength of the light inside the optical device. In response to applying the heater voltage, an optical power inside the optical device may be measured. Further, a check may be performed to determine whether the measured optical power is a peak optical power. If it is determined that measured optical power is the peak optical power, the application of the predicted heater voltage to the heater may be continued.
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公开(公告)号：US11876345B2
公开(公告)日：2024-01-16
申请号：US17015001
申请日：2020-09-08
发明人： Di Liang , Chih C. Shih , Kevin B. Leigh , Geza Kurczveil , Marco Fiorentino
IPC分类号： H01S5/024 , H01S5/0237 , H01S5/0239 , H01S5/187 , H01S5/40 , H01S5/00
CPC分类号： H01S5/02469 , H01S5/0237 , H01S5/0239 , H01S5/02476 , H01S5/187 , H01S5/0085 , H01S5/4025
摘要： Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.
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54.发明授权公开(公告)号：US11340410B2
公开(公告)日：2022-05-24
申请号：US17074472
申请日：2020-10-19
摘要： An photonic circuit includes a substrate, a plurality of first light waveguides disposed on the substrate, the first light waveguides extending in a first direction, a plurality of second light waveguides disposed on the substrate and extending in a second direction intersecting the first direction, and a plurality of first micro-ring resonators disposed on the substrate. Each of the first light waveguides has an intersection with each of the second light waveguides. Each of the intersections is provided with a first micro-ring resonator of the first micro-ring resonators. Each first micro-ring resonator is configured to route signals of a respective wavelength from one of the light waveguides at the intersection to another light waveguide at the intersection.
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公开(公告)号：US10989878B2
公开(公告)日：2021-04-27
申请号：US15929675
申请日：2020-05-15
发明人： Raymond G. Beausoleil , Di Liang , Marco Fiorentino , Geza Kurczveil , Mir Ashkan Seyedi , Zhihong Huang
摘要： An example system for multi-wavelength optical signal splitting is disclosed. The example disclosed herein comprises a first splitter, a second splitter, and a modulator. The system receives a multi-wavelength optical signal and an electrical signal, wherein the multi-wavelength optical signal comprises a plurality of optical wavelengths and has a power level. The first splitter is to split the plurality of optical wavelengths into a plurality of optical wavelength groups. The second splitter is to split the multi-wavelength optical signal or the plurality of optical wavelength groups into a plurality of lower power signal groups. The modulator is to encode the electrical signal into the plurality of optical wavelength groups, the plurality of lower power signal groups, or a combination thereof.
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公开(公告)号：US10795104B2
公开(公告)日：2020-10-06
申请号：US16587873
申请日：2019-09-30
摘要： A photonic integrated circuit package includes two arrays or sets of integrated comb laser modules that are bonded to a silicon interposer. Each comb laser of an array has a common or overlapping spectral range, with each laser in the array being optically coupled to a local optical bus. The effective spectral range of the lasers in each array are different, or distinct, as to each array. An optical coupler is disposed within the silicon interposer and is optically coupled to each of the local optical buses. An ASIC (application specific integrated circuit) is bonded to the silicon interposer and provides control and operation of the comb laser modules.
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公开(公告)号：US10677995B2
公开(公告)日：2020-06-09
申请号：US15520829
申请日：2014-10-23
发明人： Terrel L Morris , Raymond G Beausoleil , Jason Pelc , Marco Fiorentino , Charles M Santori , Michael W Cumbie
摘要： One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.
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公开(公告)号：US20200132933A1
公开(公告)日：2020-04-30
申请号：US16175578
申请日：2018-10-30
摘要： Examples herein relate to polarization diversity optical interface assemblies including a single mode optical fiber and first and second grating couplers disposed on a substrate. The first and second grating couplers are coupled to first and second waveguides, respectively. The assemblies further includes an optical connector to couple light between the single mode optical fiber and each of the first and second grating couplers. The optical connector includes a ferrule and a walk-off crystal. The ferrule is coupled to a portion of the single mode optical fiber. The walk-off crystal is configured to spatially separate the light into first and second orthogonal polarization modes prior to passing through the respective first and second grating couplers and/or combine the first and second polarization modes of the light prior to passing through the single mode optical fiber.
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公开(公告)号：US20200049909A1
公开(公告)日：2020-02-13
申请号：US16526374
申请日：2017-01-30
发明人： Sagi Mathai , Michael Rene Ty Tan , Marco Fiorentino , Paul Kessler Rosenberg , David Kielpinski , Wayne Victor Sorin
IPC分类号： G02B6/42 , G02B6/34 , H01L23/544
摘要： In some examples a silicon photonic (SiPh) solder reflowable assembly may comprise a silicon interposer bonded to an organic substrate, the silicon interposer having an optical grating disposed on the interposer to couple an optical signal, a lens array chip, the lens array comprising one or more lenses on a wafer, the lens array chip flip chip reflowed to the silicon interposer by a bonding agent and the one or more lenses having a predetermined shape that expands, collimates, and tilts a beam of the optical signal exiting the grating. The wafer has a coefficient of thermal expansion (CTE) that matches silicon and the one or more lenses and the grating are aligned in such a way the optical signal enters the grating at a desired angle.
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公开(公告)号：US10432315B2
公开(公告)日：2019-10-01
申请号：US15745709
申请日：2015-07-21
发明人： Janet Chen , Cheng Li , Marco Fiorentino , Raymond G Beausoleil
IPC分类号： G02F1/01 , G02B6/293 , G02F1/025 , H04B10/50 , H04B10/67 , H04B10/80 , H04B10/079 , H04B10/2575
摘要： One example includes an optical transmitter system. The system includes a waveguide to receive and propagate an optical signal. The system also includes a ring modulation system comprising a ring resonator that is optically coupled to the waveguide and is to resonate a given wavelength of the optical signal in response to an input data signal that is provided to a modulation amplifier to provide carrier injection to change a refractive index of the ring resonator to resonate the given wavelength of the optical signal to modulate the optical signal. The system further includes a tuning controller associated with the ring modulation system. The tuning controller can implement iterative feedback tuning of the ring modulation system based on a relative amplitude of an optical intensity of the given wavelength in the ring resonator and a variable reference amplitude to substantially stabilize the ring resonator with respect to the given wavelength.
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