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公开(公告)号：US09293828B2
公开(公告)日：2016-03-22
申请号：US13851471
申请日：2013-03-27
Applicant: Apple Inc.
Inventor： Peter Bevelacqua , Hao Xu , Jayesh Nath , Jennifer M. Edwards , Mattia Pascolini
CPC classification number: H01Q9/0442 , H01Q1/2266 , H01Q5/371 , H01Q5/378 , H01Q5/392 , H01Q9/42
Abstract: Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may form a dual arm inverted-F antenna and an additional antenna such as a monopole antenna sharing a common antenna ground. The antenna structures may have three ports. A first antenna port may be coupled to an inverted-F antenna resonating element at a first location and a second antenna port may be coupled to the inverted-F antenna resonating element at a second location. A third antenna port may be coupled to the additional antenna. An adjustable component may be coupled to the first antenna port to tune the inverted-F antenna. The inverted-F antenna may be near-field coupled to the additional antenna so that the inverted-F antenna may serve as a tunable parasitic antenna resonating element that tunes the additional antenna.
Abstract translation: 电子设备可以包括射频收发器电路和天线结构。 天线结构可以形成双臂倒F天线和附加天线，例如共享公共天线地的单极天线。 天线结构可以具有三个端口。 第一天线端口可以在第一位置处耦合到倒F天线谐振元件，并且第二天线端口可以在第二位置处耦合到倒F天线谐振元件。 第三天线端口可以耦合到附加天线。 可调组件可以耦合到第一天线端口以调谐倒F天线。 反F天线可以近场耦合到附加天线，使得倒F天线可以用作调谐附加天线的可调谐寄生天线谐振元件。
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公开(公告)号：US20150372656A1
公开(公告)日：2015-12-24
申请号：US14310240
申请日：2014-06-20
Applicant: Apple Inc.
Inventor： Matthew A. Mow , Thomas E. Biedka , Liang Han , Ming-Ju Tsai , James G. Judkins , Enrique Ayala Vazquez , Jayesh Nath , Hongfei Hu , Nanbo Jin , Hao Xu , Yijun Zhou , Yuehui Ouyang , Victor Lee , Mattia Pascolini , Ruben Caballero
CPC classification number: H03H7/38 , H04B1/0458 , H04B1/18 , H04B1/48 , H04B17/29
Abstract: An electronic device may be provided with wireless circuitry. Control circuitry may be used to adjust the wireless circuitry. The wireless circuitry may include antennas that are tuned, adjustable impedance matching circuitry, antenna port selection circuitry, and adjustable transceiver circuitry. Wireless circuit adjustments may be made by ascertaining a current usage scenario for the electronic device based on sensor data, information from cellular base station equipment or other external equipment, signal-to-noise ratio information or other signal information, antenna impedance measurements, and other information about the operation of the electronic device.
Abstract translation: 电子设备可以设置有无线电路。 控制电路可用于调整无线电路。 无线电路可以包括被调谐的天线，可调阻抗匹配电路，天线端口选择电路和可调收发器电路。 可以通过基于传感器数据，来自蜂窝基站设备或其他外部设备的信息，信噪比信息或其他信号信息，天线阻抗测量等来确定电子设备的当前使用场景来进行无线电路调整 关于电子设备的操作的信息。
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53.发明申请Electronic Device With Multiple Antenna Feeds and Adjustable Filter and Matching Circuitry 有权具有多个天线馈电和可调滤波器和匹配电路的电子设备公开(公告)号：US20140329558A1
公开(公告)日：2014-11-06
申请号：US13888110
申请日：2013-05-06
Applicant: Apple Inc.
Inventor： Dean F. Darnell , Enrique Ayala Vazquez , Hongfei Hu , Yuehui Ouyang , Mattia Pascolini , Robert W. Schlub , Peter Bevelacqua , Hao Xu , Jayesh Nath , Yijun Zhou , Nanbo Jin , David Pratt , Matthew A. Mow , Ming-Ju Tsai , Liang Han , Thomas E. Biedka
IPC: H04W88/06
CPC classification number: H04B1/0458 , H04B1/18
Abstract: Electronic devices may include antenna structures. The antenna structures may form an antenna having first and second feeds at different locations. A first transceiver may be coupled to the first feed using a first circuit. A second transceiver may be coupled to the second feed using a second circuit. The first and second feeds may be isolated from each other using the first and second circuits. The second circuit may have a notch filter that isolates the second feed from the first feed at operating frequencies associated with the first transceiver. The first circuit may include an adjustable component such as an adjustable capacitor. The adjustable component may be placed in different states depending on the mode of operation of the second transceiver to ensure that the first feed is isolated from the second feed.
Abstract translation: 电子设备可以包括天线结构。 天线结构可以形成在不同位置具有第一和第二馈送的天线。 第一收发器可以使用第一电路耦合到第一馈送。 第二收发器可以使用第二电路耦合到第二馈送。 第一和第二馈送可以使用第一和第二电路彼此隔离。 第二电路可以具有陷波滤波器，其在与第一收发器相关联的工作频率下将第二馈送与第一馈送隔离。 第一电路可以包括诸如可调电容器的可调节部件。 取决于第二收发器的操作模式，可调整部件可以被置于不同的状态，以确保第一进给与第二进给隔离。
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公开(公告)号：US20250112371A1
公开(公告)日：2025-04-03
申请号：US18477868
申请日：2023-09-29
Applicant: Apple Inc.
Inventor： Behnam Ghassemiparvin , Jingni Zhong , Ming Chen , Bhaskara R Rupakula , Yiren Wang , Han Wang , Yuan Tao , Victor C Lee , Salih Yarga , Erdinc Irci , Jennifer M Edwards , Hao Xu , Hongfei Hu , Carlo Di Nallo , Mattia Pascolini
Abstract: An electronic device may be provided with an antenna module having a substrate. An antenna may be disposed on the substrate. The antenna may have a directly fed patch and parasitic patches. The antenna may be fed by a feed via. The parasitic patches may include a first layer of parasitic patches separated by a gap overlapping the directly fed patch. The parasitic patches may include an additional parasitic patch formed in a second layer. The additional parasitic patch may overlap the gap. A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in a ground layer. The landing pad may short the via to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating at DC frequencies.
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公开(公告)号：US12218424B2
公开(公告)日：2025-02-04
申请号：US17832421
申请日：2022-06-03
Applicant: Apple Inc.
Inventor： Bhaskara R. Rupakula , Harish Rajagopalan , Hao Xu , Jennifer M. Edwards , Bilgehan Avser , Siwen Yong
Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
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Patent Agency Ranking
公开(公告)号：US11955717B2
公开(公告)日：2024-04-09
申请号：US17471037
申请日：2021-09-09
Applicant: Apple Inc.
Inventor： Thomas Wu Yang , Michael D. Quinones , Harish Rajagopalan , Gareth L. Rose , Bhaskara R. Rupakula , Jiechen Wu , Hao Xu
IPC: H01Q21/08 , H01Q1/22 , H01Q13/06 , H04B7/0413 , H04B7/12
CPC classification number: H01Q21/08 , H01Q1/2283 , H01Q13/06 , H04B7/0413 , H04B7/12
Abstract: A radio frequency system package may include waveguides and loading blocks. The loading blocks may include dielectric material having a high dielectric constant between 13 and 20. Additionally, the loading blocks may be made of mold, epoxy, or the like material, and the loading blocks may fit into a region cut out of the waveguides. Moreover, the loading blocks may lower the cut-off frequency for wireless communication otherwise provided by the waveguides without the loading blocks (e.g., 28 GHz). In particular, the loading blocks may facilitate communication in low mmWave frequencies, such as 24 GHz.
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公开(公告)号：US20240079784A1
公开(公告)日：2024-03-07
申请号：US18458710
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Han Wang , Victor C. Lee , Jingni Zhong , Ming Chen , Bhaskara R. Rupakula , Yiren Wang , Yuan Tao , Christopher Q. Ma , Zhiheng Zhou , Sherry Cao , Kevin M. Froese , Hao Xu , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q9/0414 , H01Q9/0442 , H01Q9/40
Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.
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公开(公告)号：US20240079782A1
公开(公告)日：2024-03-07
申请号：US18458916
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Alden T. Rush , Han Wang , Jingni Zhong , Ming Chen , Yiren Wang , Yuan Tao , Hao Xu , Hongfei Hu , Mattia Pascolini
Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.
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公开(公告)号：US20240079761A1
公开(公告)日：2024-03-07
申请号：US18458835
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Jingni Zhong , Ming Chen , Han Wang , Alden T Rush , Behnam Ghassemiparvin , Bhaskara R Rupakula , Yiren Wang , Yuan Tao , Hao Xu , Jennifer M Edwards , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q9/0407
Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
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公开(公告)号：US20240072417A1
公开(公告)日：2024-02-29
申请号：US18502979
申请日：2023-11-06
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q9/0414 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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