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72 条记录 (耗时 0.021 秒)

    Methods of fabricating a microstructure array
    52.
    发明授权
    Methods of fabricating a microstructure array 失效
    制造微结构阵列的方法

    公开(公告)号：US06632342B1

    公开(公告)日：2003-10-14

    申请号：US09534070

    申请日：2000-03-24

    申请人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    发明人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    IPC分类号： C25D502

    CPC分类号： G02B3/0025 ,  G02B3/0012 ,  G02B3/0031 ,  G02B3/0056 ,  Y10S428/901 ,  Y10T428/24917

    摘要： In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

    摘要翻译： 在制造微结构阵列的方法中，提供具有导电部分的衬底，在衬底的导电部分上形成绝缘掩模层，在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或电沉积沉积在开口中和绝缘掩模层上。 在第一镀层或电沉积层上和导电部分上进一步形成第二镀层，通过化学镀以减小阵列上微结构的尺寸分布。

    Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array
    54.
    发明授权
    Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array 失效
    微结构阵列和微结构阵列的制造方法，用于形成微结构阵列的模具和微透镜阵列

    公开(公告)号：US06503384B1

    公开(公告)日：2003-01-07

    申请号：US09536128

    申请日：2000-03-28

    申请人： Takayuki Teshima ,  Takayuki Yagi

    发明人： Takayuki Teshima ,  Takayuki Yagi

    IPC分类号： C25D502

    CPC分类号： G02B3/0031 ,  G02B3/0012 ,  G02B3/0056

    摘要： In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.

    摘要翻译： 在制造微结构阵列的方法中，提供具有导电部分的衬底，在衬底的导电部分上形成绝缘掩模层，在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或无电镀或电沉积沉积在开口中和绝缘掩模层上。 至少第一电镀或电沉积层的表面被制成导电的。 之后，去除绝缘掩模层，并且通过电镀在第一镀层或电沉积层上和导电部分上形成第二镀层，以将第一镀层或电沉积层牢固地固定在衬底上。

    STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    57.
    发明申请
    STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    其制造方法及其制造方法

    公开(公告)号：US20140211920A1

    公开(公告)日：2014-07-31

    申请号：US14342756

    申请日：2012-08-07

    申请人： Yutaka Setomoto ,  Takayuki Teshima

    发明人： Yutaka Setomoto ,  Takayuki Teshima

    IPC分类号： G01N23/20 ,  C25D1/00

    CPC分类号： G01N23/20 ,  A61B6/484 ,  B81B3/0008 ,  B81C1/00952 ,  C25D1/00 ,  G03F7/00 ,  G21K1/025 ,  G21K2207/005

    摘要： A method for manufacturing a structure by using a silicon mold, in which disturbances in arrangement due to charges are reduced, can be provided.The method for manufacturing a structure includes the steps of forming a recessed portion in a silicon substrate, cleaning, drying, or conveying the silicon substrate while charges of a plurality of portions sandwiched between the recessed portion are removed, and filling a metal into the recessed portion of the silicon substrate subjected to the cleaning, drying, or conveying.

    摘要翻译： 可以提供通过使用其中减少由于电荷引起的布置的干扰的硅模制造结构的方法。 制造结构的方法包括以下步骤：在硅衬底中形成凹陷部分，清洁，干燥或输送硅衬底，同时去除夹在凹部之间的多个部分的电荷，并将金属填充到凹陷 经过清洗，干燥或输送的硅衬底部分。

    Production process of liquid composition, image forming process and image forming apparatus
    58.
    发明授权
    Production process of liquid composition, image forming process and image forming apparatus 有权
    液体组成，成像过程和成像设备的生产工艺

    公开(公告)号：US08163816B2

    公开(公告)日：2012-04-24

    申请号：US11746233

    申请日：2007-05-09

    申请人： Kazumichi Nakahama ,  Takayuki Teshima ,  Yukio Hanyu

    发明人： Kazumichi Nakahama ,  Takayuki Teshima ,  Yukio Hanyu

    IPC分类号： C09D11/00 ,  C08F8/30 ,  B60C1/00 ,  C08L53/00 ,  B41J2/01

    CPC分类号： C09D11/54 ,  C09D11/322

    摘要： A process for producing a liquid composition including a pigment and a stimuli-responsive dispersant, the pigment being contained in the liquid composition in a dispersed state, the process including (1) obtaining a solution dissolving the pigment in a first solvent and (2) mixing the solution with a second solvent, wherein the stimuli-responsive dispersant is contained in at least one solvent of the first and second solvents. The first solvent is an aprotic solvent. The second solvent is water or an aqueous solution.

    摘要翻译： 一种制备包含颜料和刺激响应性分散剂的液体组合物的方法，所述颜料以分散状态包含在所述液体组合物中，所述方法包括（1）获得将颜料溶解在第一溶剂中的溶液和（2） 将溶液与第二溶剂混合，其中刺激响应性分散剂包含在第一和第二溶剂的至少一种溶剂中。 第一溶剂是非质子溶剂。 第二种溶剂是水或水溶液。

    Pigment ink composition and coating material
    59.
    发明授权
    Pigment ink composition and coating material 有权
    颜料油墨组合物和涂料

    公开(公告)号：US07927412B2

    公开(公告)日：2011-04-19

    申请号：US12175098

    申请日：2008-07-17

    申请人： Akira Kuriyama ,  Takayuki Teshima ,  Kazumichi Nakahama ,  Rie Ueno ,  Masatoshi Watanabe ,  Takeo Suga

    发明人： Akira Kuriyama ,  Takayuki Teshima ,  Kazumichi Nakahama ,  Rie Ueno ,  Masatoshi Watanabe ,  Takeo Suga

    IPC分类号： C09D11/00 ,  C09D11/02

    CPC分类号： C09D11/54 ,  C09D11/322

    摘要： A pigment ink composition has high transparency and good color characteristics such as a high OD that are not inferior to those of dyes, even though pigment particles are used, and also has good weatherability and remaining ability on the coating and printing medium surface that are inherent to pigment particles. The pigment ink composition contains pigment particles including at least needle pigment particles, a dispersant, and a solvent. The needle pigment particles have a needle shape with an aspect ratio of at least 3, an average aspect ratio of at least 5 and at most 7, an average short dimension of at least 20 nm and at most 30 nm, and a distribution of short dimension with a standard deviation of 2.0 nm or less. The needle pigment particles are covered with the dispersant.

    摘要翻译： 颜料油墨组合物即使使用颜料颗粒，也具有高的透明性和良好的颜色特性，例如高的OD，它们不劣于染料，并且具有良好的耐候性和在固有的涂料和印刷介质表面上的剩余能力 到颜料颗粒。 颜料墨水组合物含有至少包含针状颜料颗粒，分散剂和溶剂的颜料颗粒。 针状颜料颗粒具有纵横比至少为3，平均长宽比为至少5且至多为7，平均短尺寸为至少20nm且至多为30nm的针状，并且分布为短 标准偏差为2.0nm以下的尺寸。 针状颜料颗粒被分散剂覆盖。