公开(公告)号：US1138486A

公开(公告)日：1915-05-04

申请号：US1914846090

申请日：1914-06-19

Applicant: KELLEY GEORGE WALKER ,  KELLEY ISAIAH S

Inventor： KELLEY GEORGE WALKER ,  KELLEY ISAIAH S

CPC classification number: B61D35/007

公开(公告)号：US691239A

公开(公告)日：1902-01-14

申请号：US1901073114

申请日：1901-08-24

Applicant: GEORGE WALKER ,  CARNES JOHN W

Inventor： CARNES JOHN W

CPC classification number: E04D1/16

公开(公告)号：US08986944B2

公开(公告)日：2015-03-24

申请号：US11497919

申请日：2006-08-02

Applicant: Douglas T. Yamanishi ,  Paul G. Hujsak ,  Sara F. Snyder ,  George Walker ,  Junquan Xu ,  Mingxian Huang ,  Guoliang Tao ,  Lei Wu ,  Xiaobo Wang ,  Joe Ouyang ,  Charina Schmitigal ,  Jing Cheng ,  Jia Xu

Inventor： Douglas T. Yamanishi ,  Paul G. Hujsak ,  Sara F. Snyder ,  George Walker ,  Junquan Xu ,  Mingxian Huang ,  Guoliang Tao ,  Lei Wu ,  Xiaobo Wang ,  Joe Ouyang ,  Charina Schmitigal ,  Jing Cheng ,  Jia Xu

IPC: C12Q1/24 ,  C12Q1/68 ,  G01N1/40 ,  G01N33/569 ,  G01N33/574 ,  B01L3/00

CPC classification number: C12Q1/6881 ,  B01L3/5027 ,  C12N5/0602 ,  G01N1/40 ,  G01N1/4077 ,  G01N33/56966 ,  G01N33/57407 ,  G01N2333/4724 ,  Y10T436/25375

Abstract: The present invention includes methods of enriching rare cells, such as cancer cells, from biological samples, such as blood samples. The methods include performing at least one debulking step on a blood sample and selectively removing at least one type undesirable component from the blood sample to obtain a blood sample that is enriched in a rare cell of interest. In some embodiments magnetic beads coupled to specific binding members are used to selectively removed components.

Abstract translation: 本发明包括从诸如血液样品的生物样品中富集稀有细胞如癌细胞的方法。 所述方法包括对血液样品进行至少一个减压步骤，并从血液样品中选择性地除去至少一种不需要的组分以获得富含稀有细胞的血液样品。 在一些实施例中，耦合到特定结合构件的磁珠用于选择性地去除组分。

公开(公告)号：US20090209029A1

公开(公告)日：2009-08-20

申请号：US12233565

申请日：2008-09-18

Applicant: Antonio Guia ,  George Walker ,  Mingxian Huang ,  Abdelleh Menikh ,  Lei Wu ,  Sithiphong Khachonesin ,  Julian Yuan ,  Jia Xu

Inventor： Antonio Guia ,  George Walker ,  Mingxian Huang ,  Abdelleh Menikh ,  Lei Wu ,  Sithiphong Khachonesin ,  Julian Yuan ,  Jia Xu

IPC: C12M1/34

CPC classification number: G01N33/48728 ,  B01L3/502761 ,  B01L3/502792 ,  B01L3/5085 ,  B01L3/5088 ,  B01L2200/027 ,  B01L2200/0647 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B01L2300/161 ,  B01L2400/049 ,  B03C5/026 ,  B65B31/00 ,  C12Q2565/629 ,  C23C16/452 ,  F16J15/021 ,  G01N15/1031 ,  G01N31/22 ,  G01N35/00029 ,  G01N2035/00158 ,  G01N2333/705 ,  H01J2237/3142

Abstract: The present invention includes biochips for the measurement of cellular ion channels and methods of use and manufacture. The biochips of the present invention have enhanced sealing capabilities provided in part by chemically modifying the surface of the biochip surface or substrate or by exposure to an ionized gas. The present invention also includes novel cartridges for biochips.

Abstract translation: 本发明包括用于测量细胞离子通道的生物芯片和使用和制造方法。 本发明的生物芯片具有增强的密封能力，其部分通过化学改性生物芯片表面或基底的表面或通过暴露于电离气体而提供。 本发明还包括用于生物芯片的新型盒。

公开(公告)号：US20090139248A1

公开(公告)日：2009-06-04

申请号：US12277204

申请日：2008-11-24

Applicant: ETHAN J. CRUMLIN ,  GEOFF BECKER ,  SHAUNA JIN ,  AMY LAI WONG ,  NATHAN BARKER BALL ,  GABRIEL NESTOR SANCHEZ ,  DANIEL GEORGE WALKER ,  CHRISTOPHER PAUL POSSINGER ,  OLUMUYIWA ONI ,  EMILY SMITH ,  KABIR JAMES MUKADDAM ,  MYRAIDA A. VEGA GONZALEZ

Inventor： ETHAN J. CRUMLIN ,  GEOFF BECKER ,  SHAUNA JIN ,  AMY LAI WONG ,  NATHAN BARKER BALL ,  GABRIEL NESTOR SANCHEZ ,  DANIEL GEORGE WALKER ,  CHRISTOPHER PAUL POSSINGER ,  OLUMUYIWA ONI ,  EMILY SMITH ,  KABIR JAMES MUKADDAM ,  MYRAIDA A. VEGA GONZALEZ

IPC: F25D25/00 ,  F25D3/00 ,  G01K13/00 ,  B65D81/38

CPC classification number: F25B9/14 ,  A45F3/047 ,  A45F3/10 ,  A45F2003/045 ,  F25D29/003 ,  F25D2331/8011 ,  F25D2700/123

Abstract: Disclosed is a device for the transport of temperature sensitive products including an insulated container, an insulated lid, a fastener to secure the lid to the container, an active heat exchanger, a thermal circuit to circulate heat exchange, a temperature sensor read by a temperature regulating circuit that maintains a temperature range, a power source, and a support frame that arranges the elements of the device with the overall center of mass at a location adapted for transport and storage of the device. Disclosed is also a method of transport for temperature sensitive products including securing the temperature sensitive product within an insulated container with a lid, removing heat from the container to maintain a temperature range, strapping the device onto the user's back and adjusting to the shape of the user, freeing both hands during transport of the device, and minimizing hindrances to user mobility caused by the device.

Abstract translation: 公开了一种用于输送温度敏感产品的装置，包括绝热容器，绝缘盖，将盖固定到容器上的紧固件，主动热交换器，循环热交换的热回路，温度读数温度传感器 保持温度范围的调节电路，电源和支撑框架，其将装置的整体质心布置在适于装置运输和储存的位置。 公开了一种用于温度敏感产品的运输方法，包括将温度敏感产品固定在具有盖的绝热容器内，从容器中除去热量以保持温度范围，将该装置捆扎在使用者的背部上并根据 用户在设备的传输期间释放双手，并且最小化对由设备引起的用户移动的障碍。

公开(公告)号：US20080106284A1

公开(公告)日：2008-05-08

申请号：US11929982

申请日：2007-10-30

Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

IPC: G01R31/26

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080048697A1

公开(公告)日：2008-02-28

申请号：US11929883

申请日：2007-10-30

Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

IPC: G01R1/067

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080048691A1

公开(公告)日：2008-02-28

申请号：US11930010

申请日：2007-10-30

Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

IPC: G01R31/02

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080048690A1

公开(公告)日：2008-02-28

申请号：US11929873

申请日：2007-10-30

Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

IPC: G01R31/02

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080047741A1

公开(公告)日：2008-02-28

申请号：US11930026

申请日：2007-10-30

Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

IPC: H05K1/03 ,  H05K1/11

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.