COMPUTING SYSTEM AND METHOD
    51.
    发明申请

    公开(公告)号:US20210240474A1

    公开(公告)日:2021-08-05

    申请号:US16777503

    申请日:2020-01-30

    Abstract: A datacenter including a first voltage sensor and/or first amperage sensor along with a second voltage sensor and/or second amperage sensor. The first amperage and voltage sensors are associated with a first computing device (FCD) and the second amperage and voltage sensors are associated with a second computing device (SCD). The datacenter also includes an electronic control unit (ECU) that communicates with the FCD and the SCD. The ECU is configured to receive FCD energy consumption information and additional updated FCD energy consumption information via the first voltage and/or amperage sensor(s). FCD energy consumption information is associated with energy consumed by the FCD during a first customer billing cycle. The ECU is also configured to divide a first blockchain mining reward into a first customer portion and a first datacenter portion and withhold the first customer portion when the first datacenter portion is less than a first minimum threshold.

    System for cooling computing devices of a plurality of facilities

    公开(公告)号:US10701836B2

    公开(公告)日:2020-06-30

    申请号:US16268424

    申请日:2019-02-05

    Abstract: A system for cooling computing devices within a facility includes an air inlet that delivers cool air to a supply air space within the facility, an exhaust air damper that is configured to exhaust heated air from an exhaust air space within the facility, and computing devices that are arranged within the facility to at least partially partition the supply air space from the exhaust air space. The system also includes an air filter that is configured to filter the cool air and a mixing damper that is positioned within the interior space of the facility and that is operable to control an amount of exhaust air that is mixed with the cool air. The cool air and/or a portion of the exhaust air are used to cool the computing devices and airflow through the system is substantially driven by fans of the computing devices.

    Computing device cooling facility including a mixing chamber

    公开(公告)号:US10694642B2

    公开(公告)日:2020-06-23

    申请号:US16268433

    申请日:2019-02-05

    Abstract: A system for cooling computing devices within a facility includes an air inlet that delivers cool air to a supply air space within the facility, an exhaust air damper that is configured to exhaust heated air from an exhaust air space within the facility, and computing devices that are arranged within the facility to at least partially partition the supply air space from the exhaust air space. The system also includes an air filter that is configured to filter the cool air and a mixing damper that is positioned within the interior space of the facility and that is operable to control an amount of exhaust air that is mixed with the cool air. The cool air and/or a portion of the exhaust air are used to cool the computing devices and airflow through the system is substantially driven by fans of the computing devices.

    Automatic repair of computing devices in a data center

    公开(公告)号:US10691528B1

    公开(公告)日:2020-06-23

    申请号:US16776213

    申请日:2020-01-29

    Abstract: A system and method for automating management and repair of a plurality of computing devices located in a data center is disclosed. Health status queries are issued for one or more of the computing devices. If responses not indicative of good device health are received, one or more repair instructions are automatically sent to the unhealthy computing device to repair the computing device by moving it to an acceptable state. If the repair instructions are not successful, a support ticket is automatically generated for the corresponding computing device or devices. Problematic statuses across areas of the data center may be detected and ticketed in addition to individual problematic devices. So-called repeat offender devices may be detected and ticketed even if the repair instructions are successful.

    MULTI-FLOOR FACILITY FOR COOLING COMPUTING DEVICES

    公开(公告)号:US20200045855A1

    公开(公告)日:2020-02-06

    申请号:US16268428

    申请日:2019-02-05

    Abstract: A system for cooling computing devices within a facility includes an air inlet that delivers cool air to a supply air space within the facility, an exhaust air damper that is configured to exhaust heated air from an exhaust air space within the facility, and computing devices that are arranged within the facility to at least partially partition the supply air space from the exhaust air space. The system also includes an air filter that is configured to filter the cool air and a mixing damper that is positioned within the interior space of the facility and that is operable to control an amount of exhaust air that is mixed with the cool air. The cool air and/or a portion of the exhaust air are used to cool the computing devices and airflow through the system is substantially driven by fans of the computing devices.

    SYSTEM AND METHOD FOR COOLING COMPUTING DEVICES WITHIN A COLD ISLE OF A FACILITY

    公开(公告)号:US20200045852A1

    公开(公告)日:2020-02-06

    申请号:US16268392

    申请日:2019-02-05

    Abstract: A system for cooling computing devices within a facility includes an air inlet that delivers cool air to a supply air space within the facility, an exhaust air damper that is configured to exhaust heated air from an exhaust air space within the facility, and computing devices that are arranged within the facility to at least partially partition the supply air space from the exhaust air space. The system also includes an air filter that is configured to filter the cool air and a mixing damper that is positioned within the interior space of the facility and that is operable to control an amount of exhaust air that is mixed with the cool air. The cool air and/or a portion of the exhaust air are used to cool the computing devices and airflow through the system is substantially driven by fans of the computing devices.

    Rack for cooling computing devices in a hyperboloid configuration

    公开(公告)号:US12041747B2

    公开(公告)日:2024-07-16

    申请号:US17575184

    申请日:2022-01-13

    CPC classification number: H05K7/18 H05K7/20172 H05K7/20718

    Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack. The air barrier may have openings for the computing devices to permit exhaust air to flow through the air barrier into a hot aisle. The rack maybe configured to be connected to other similar racks to form a vertical annular hyperboloid or a vertical hyperbolic annular paraboloid, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular hyperboloid or a vertical hyperbolic annular paraboloid to improve airflow.

    Air deflector for cooling computing devices

    公开(公告)号:US11882644B1

    公开(公告)日:2024-01-23

    申请号:US17476796

    申请日:2021-09-16

    Inventor: Lawrence Kom

    Abstract: A cooling device for improving the cooling of computing devices in a data center is disclosed. The cooling device comprises an air deflector that is configured to be attached to a hot aisle air barrier at an angle to direct computing device exhaust air toward the nearest hot aisle exhaust vent. The device may comprise a mounting mechanism for fixing the air deflector in position, such as eyelets or clips that attach to the computing device's exhaust fan grille. The air deflector may be rotatable so that the angle between the hot aisle air barrier and the air deflector may be adjusted. The cooling device may further comprise a visual air flow indicator to assist in positioning of the air deflector and airflow monitoring.

    Helical-configured shelving for cooling computing devices

    公开(公告)号:US11516942B1

    公开(公告)日:2022-11-29

    申请号:US17126758

    申请日:2020-12-18

    Inventor: Devon Baldwin

    Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports computing devices and comprises planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. The rack may be configured to be connected to other similar racks to form a vertical geometric prism or annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle. A number of vertical supports may hold the shelves in a vertically spaced arrangement to from a helix within the prism or cylinder. An air barrier may be affixed to the rack and have openings permitting exhaust air to flow from the computing devices through the air barrier. The helix formed by the shelves may channel the airflow generated by the computing devices into a vortex to improve cooling.

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