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公开(公告)号：US11985791B1
公开(公告)日：2024-05-14
申请号：US17476836
申请日：2021-09-16
Applicant: Core Scientific, Inc.
Inventor： Lawrence Kom
CPC classification number: H05K7/20145 , F24F13/0218 , H05K7/20745 , H05K7/20836 , Y10T137/86936
Abstract: An adjustable cooling duct for improved facility (e.g., data center) cooling is disclosed. In one embodiment, the cooling duct comprises a cylindrical flexible membrane (e.g., fabric) having a first annular end and a second annular end, and a cincture mechanism connected around the perimeter of the cylindrical flexible membrane between the first annular end and the second annular end. The cincture mechanism may be motorized and that may be controlled by a management computer based on pressure sensor readings. The cincture mechanisms may be automated for coordinated control of multiple ducts in parallel by the management computer based on environmental sensor readings to improve facility cooling.
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公开(公告)号：US20210368654A1
公开(公告)日：2021-11-25
申请号：US16879564
申请日：2020-05-20
Applicant: CORE SCIENTIFIC, INC.
Inventor： Lawrence Kom , Thomas Fuller
Abstract: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks in a two-dimensional array and connected via network switches with ports corresponding to their location in the racks. The computer devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack. Instructions are sent to the computing devices to set one or more attributes such as fan speed, operating frequency and voltage according to one ore more patterns. The patterns can be linear or nonlinear and can be shifted, rotated, or changed over time periodically or based on temperature or other performance measurements from the computing devices.
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公开(公告)号：US11882644B1
公开(公告)日：2024-01-23
申请号：US17476796
申请日：2021-09-16
Applicant: Core Scientific, Inc.
Inventor： Lawrence Kom
IPC: H05K7/20 , H05K5/02 , G06T7/00 , H04L12/24 , H04L41/5074
CPC classification number: H05K7/20145 , G06T7/001 , H04L41/5074 , H05K5/0213 , H05K7/20209 , H05K7/20836
Abstract: A cooling device for improving the cooling of computing devices in a data center is disclosed. The cooling device comprises an air deflector that is configured to be attached to a hot aisle air barrier at an angle to direct computing device exhaust air toward the nearest hot aisle exhaust vent. The device may comprise a mounting mechanism for fixing the air deflector in position, such as eyelets or clips that attach to the computing device's exhaust fan grille. The air deflector may be rotatable so that the angle between the hot aisle air barrier and the air deflector may be adjusted. The cooling device may further comprise a visual air flow indicator to assist in positioning of the air deflector and airflow monitoring.
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公开(公告)号：US11092614B1
公开(公告)日：2021-08-17
申请号：US17076711
申请日：2020-10-21
Applicant: Core Scientific, Inc.
Inventor： Lawrence Kom , Thomas Fuller
IPC: G01P5/00 , G06F1/3296 , H05K7/20 , G06F11/30 , G06F1/3206 , G06F1/20
Abstract: A method for measuring airflow for a plurality of computing devices may include characterizing the fan performance of a selected computing device of the plurality of computing devices to provide characterized RPM information. Each of the computing devices may include a cooling fan configured to exhaust heat into a hot aisle. Each cooling fan may include a rotor and a tachometer. The method may also include connecting the computing devices via a network, distributing computing workloads to the plurality of computing devices, and/or performing work on the computing workloads on the plurality of computing devices. Additionally, the method may include reading RPM information from the selected computing device's fan's tachometer and/or comparing the read RPM information with the characterized RPM information to determine a backpressure value for the selected computing device. The power to the selected computing device's fan may be reduced prior to reading the RPM information.
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Patent Agency Ranking
公开(公告)号：US10942195B1
公开(公告)日：2021-03-09
申请号：US16938085
申请日：2020-07-24
Applicant: Core Scientific, Inc.
Inventor： Lawrence Kom , Thomas Fuller
IPC: G01P5/00 , G06F1/3206 , G06F1/3296 , G06F11/30 , H05K7/20 , G06F1/20
Abstract: Systems and methods for cooling computing devices in a data center and measuring airflow are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks between cold aisles and hot aisles and are connected via network switches. The computing devices are oriented so that their cooling fans operate to exhaust waste heat to one side of the rack. Measurement instructions are sent to selected computing devices to cause them to go into a lower power state that reduces or stops computational work and reduces electrical power to the cooling fan so that the fan does not spin based on the electromotive force and can instead spin in an opposite direction based on ambient airflow caused by the difference in air pressure from the hot aisle to the cold aisle.
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公开(公告)号：US11956928B1
公开(公告)日：2024-04-09
申请号：US17476786
申请日：2021-09-16
Applicant: Core Scientific, Inc.
Inventor： Jacob Taylor , Thomas Middleton Rutledge Fuller , Lawrence Kom
CPC classification number: H05K7/20745 , F24F7/06 , H05K7/20145
Abstract: A facility (e.g., data center) for more efficient cooling of computing devices is disclosed. In one embodiment, the data center comprises a set of external walls, a ceiling connected to the external walls and having circular exhaust openings, and one or more pods positioned within the external walls and below the ceiling. A set of flexible tubes are used to connect the pod exhaust openings to the ceiling openings. Actuating closures may be used (e.g., at one end of each of the tubes) to control airflow, and air pressure sensors may be placed near or inside one or more of the tubes. A controller may be configured to receive air pressure data from the air pressure sensors and adjust the actuating closures to maintain a desired air pressure level. In some examples, the actuating closure may have a normally closed position when power is not applied.
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公开(公告)号：US11540415B2
公开(公告)日：2022-12-27
申请号：US17161042
申请日：2021-01-28
Applicant: Core Scientific, Inc.
Inventor： Devon Baldwin , Kamil Lazarowich , Thomas Middleton Rutledge Fuller , Lawrence Kom
Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack and have openings that permit exhaust air to flow from the computing devices through the air barrier into a hot aisle. The rack may be configured to be connected to other similar racks to form a vertical annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular cylinder to improve airflow.
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公开(公告)号：US20220124934A1
公开(公告)日：2022-04-21
申请号：US17161042
申请日：2021-01-28
Applicant: Core Scientific, Inc.
Inventor： Devon Baldwin , Kamil Lazarowich , Thomas Middleton Rutledge Fuller , Lawrence Kom
Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack and have openings that permit exhaust air to flow from the computing devices through the air barrier into a hot aisle. The rack may be configured to be connected to other similar racks to form a vertical annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular cylinder to improve airflow.
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公开(公告)号：US11237605B2
公开(公告)日：2022-02-01
申请号：US16879564
申请日：2020-05-20
Applicant: CORE SCIENTIFIC, INC.
Inventor： Lawrence Kom , Thomas Fuller
Abstract: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks in a two-dimensional array and connected via network switches with ports corresponding to their location in the racks. The computer devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack. Instructions are sent to the computing devices to set one or more attributes such as fan speed, operating frequency and voltage according to one ore more patterns. The patterns can be linear or nonlinear and can be shifted, rotated, or changed over time periodically or based on temperature or other performance measurements from the computing devices.
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