Measuring airflow for computing devices

    公开(公告)号:US11092614B1

    公开(公告)日:2021-08-17

    申请号:US17076711

    申请日:2020-10-21

    摘要: A method for measuring airflow for a plurality of computing devices may include characterizing the fan performance of a selected computing device of the plurality of computing devices to provide characterized RPM information. Each of the computing devices may include a cooling fan configured to exhaust heat into a hot aisle. Each cooling fan may include a rotor and a tachometer. The method may also include connecting the computing devices via a network, distributing computing workloads to the plurality of computing devices, and/or performing work on the computing workloads on the plurality of computing devices. Additionally, the method may include reading RPM information from the selected computing device's fan's tachometer and/or comparing the read RPM information with the characterized RPM information to determine a backpressure value for the selected computing device. The power to the selected computing device's fan may be reduced prior to reading the RPM information.

    Measuring airflow for computing devices

    公开(公告)号:US10942195B1

    公开(公告)日:2021-03-09

    申请号:US16938085

    申请日:2020-07-24

    摘要: Systems and methods for cooling computing devices in a data center and measuring airflow are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks between cold aisles and hot aisles and are connected via network switches. The computing devices are oriented so that their cooling fans operate to exhaust waste heat to one side of the rack. Measurement instructions are sent to selected computing devices to cause them to go into a lower power state that reduces or stops computational work and reduces electrical power to the cooling fan so that the fan does not spin based on the electromotive force and can instead spin in an opposite direction based on ambient airflow caused by the difference in air pressure from the hot aisle to the cold aisle.

    SYSTEM AND METHOD FOR COOLING COMPUTING DEVICES

    公开(公告)号:US20210368654A1

    公开(公告)日:2021-11-25

    申请号:US16879564

    申请日:2020-05-20

    IPC分类号: H05K7/20 G06F1/20

    摘要: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks in a two-dimensional array and connected via network switches with ports corresponding to their location in the racks. The computer devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack. Instructions are sent to the computing devices to set one or more attributes such as fan speed, operating frequency and voltage according to one ore more patterns. The patterns can be linear or nonlinear and can be shifted, rotated, or changed over time periodically or based on temperature or other performance measurements from the computing devices.

    Rack for cooling computing devices

    公开(公告)号:US11363743B2

    公开(公告)日:2022-06-14

    申请号:US16938565

    申请日:2020-07-24

    发明人: Thomas Fuller

    IPC分类号: H05K7/20

    摘要: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The devices are positioned on shelves in racks and are connected via network switches. The computing devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack into a hot aisle, and each position is offset from positions on neighboring shelves above and below the current shelf. The racks can be offset, or the positions within the racks can be offset. Each computing device on the rack can also be angled horizontally and or vertically to improve airflow. Multiple racks can be configured together into sloped regular polygons, with the interior forming the hot aisle, and deflectors can be installed to further improve airflow.

    System and method for cooling computing devices

    公开(公告)号:US11237605B2

    公开(公告)日:2022-02-01

    申请号:US16879564

    申请日:2020-05-20

    IPC分类号: G06F1/20 H05K7/20 F04D15/00

    摘要: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks in a two-dimensional array and connected via network switches with ports corresponding to their location in the racks. The computer devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack. Instructions are sent to the computing devices to set one or more attributes such as fan speed, operating frequency and voltage according to one ore more patterns. The patterns can be linear or nonlinear and can be shifted, rotated, or changed over time periodically or based on temperature or other performance measurements from the computing devices.

    RACK FOR COOLING COMPUTING DEVICES

    公开(公告)号:US20220030749A1

    公开(公告)日:2022-01-27

    申请号:US16938565

    申请日:2020-07-24

    发明人: Thomas Fuller

    IPC分类号: H05K7/20

    摘要: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The devices are positioned on shelves in racks and are connected via network switches. The computing devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack into a hot aisle, and each position is offset from positions on neighboring shelves above and below the current shelf. The racks can be offset, or the positions within the racks can be offset. Each computing device on the rack can also be angled horizontally and or vertically to improve airflow. Multiple racks can be configured together into sloped regular polygons, with the interior forming the hot aisle, and deflectors can be installed to further improve airflow.