摘要:
A semiconductor rectifier in which the sum of loss during reverse recovery and loss in a conducting state can be suppressed even if the ratio between the periods of the conducting and blocking states varies and a method of driving the same are disclosed. A voltage is applied to a gate electrode formed in a face-to-face relationship with a base layer of a first conductivity type and an emitter layer of a second conductivity type with a gate insulation film interposed therebetween to form an inversion layer on the surface of the base layer of the first conductivity type. As a result, the base layer of the first conductivity type and the short layer of the first conductivity type are short-circuited to decrease the density of carriers in the base layer of the first conductivity type, loss during a reverse recovery operation can be suppressed.
摘要:
The present invention relates to a bidirectional breakover component including a lightly-doped N-type substrate, an upper P-type region extending over practically the entire upper surface of the component except its circumference, a lower P-type uniform layer on the lower surface side of the component, substantially complementary N-type regions respectively formed in the upper region and in the lower layer, a peripheral P-type well, an overdoped P-type region at the upper surface of the well, and lightly-doped N-type regions between the circumference of the upper region and the well.
摘要:
In a bidirectional surge protection device formed on a semiconductor substrate, buried layers, which have the same conduction type as and are higher in impurity concentration than the semiconductor substrate, are formed on the entire surfaces of the device regions provided on both surfaces of the semiconductor substrate or formed under emitter-push restraining layers alone, wherein injection of minority carriers from a surface opposite to the surface on which the device operates is restrained to lower a holding current. As a result, the bidirectional surge protection device easily becomes OFF once it becomes ON.
摘要:
A field-effect-controllable semiconductor component includes a semiconductor body with first and second surfaces. An inner zone of a first conduction type adjoins the first surface. An anode zone of the opposite, second conduction type adjoins the inner zone in the direction of the first surface and adjoins the second surface in the opposite direction. At least one first base zone of the second conduction type is embedded in the first surface. At least one source zone of the first conduction type is embedded in the first surface. At least one source electrode makes contact with the base zones and the source zones. At least one gate electrode is insulated from the semiconductor body and the source electrode by a gate oxide and at least partly covers parts of the first base zones appearing at the first surface. Intermediate cell zones contain the source zones. Trenches enclose the intermediate cell zones and are insulated from the intermediate cell zones by a gate oxide. Gate electrode pins in the trenches are connected to the gate electrode running on the first surface.
摘要:
A distance from the bottom of a mesa groove to an underlying pn junction exceeds the elongation of a depletion layer from the underlying pn junction that occurs when a voltage nearly equal to a target withstand voltage is applied, and a groove width of a section other than a corner of the mesa groove, that is, the groove width of a straight section, is nearly equal to the distance from the bottom of the mesa groove to the underlying pn junction.
摘要:
An insulated gate thyristor is provided which includes a first-conductivity-type base layer of high resistivity, first and second second-conductivity-type base regions formed in a surface layer of a first major surface of the first-conductivity-type base layer, a first-conductivity-type source region formed in a surface layer of the first second-conductivity-type base region, a first-conductivity-type emitter region formed in a surface layer of the second second-conductivity-type base region, a gate electrode formed on surfaces of the first second-conductivity-type base region, the first-conductivity-type base layer, and the second second-conductivity-type base region, which surfaces are interposed between the first-conductivity-type source region and the first-conductivity-type emitter region, an insulating film interposed between the gate electrode and these surface of the base regions and layer, a first main electrode in contact with both the first second-conductivity-type base region and the first-conductivity-type source region, a second-conductivity-type emitter layer formed on a second major surface of the first-conductivity-type base layer, and a second main electrode in contact with the second-conductivity-type emitter layer. The entire surface areas of the second second-conductivity-type base region and the first-conductivity-type emitter region are covered with the insulating film.
摘要:
An optically-triggered silicon controlled rectifier (SCR) (21) having a number of semiconductor layers (23, 24, 31) diffused into an N type substrate (22). Specifically, the SCR is formed by diffusing a first P+ layer (23) into an upper surface of the substrate. Then, an N+ layer (24) is diffused into a portion of an upper surface of the first P+ layer. An oxide layer (25) which is permeable to optical radiation is formed on the first P+ layer. A conductive cathode terminal (26) is then deposited on the N+ layer. Therefore, a trench (30) is etched in the lower surface of the substrate. The trench is defined by a depth and a surface. A second P+ layer (31) is diffused into the surface of the trench. The depth of the trench substantially defines a spacing between the first and second P+ layers. The chip is soldered onto a pedestal (33) formed on a lead frame (34). The solder is deposited in the trench and contacts the second P+ layer to form an anode terminal (36). The pedestal may be formed by either etching or stamping a depression (35) in the lead frame.
摘要:
A gateless thyristor or a gateless triac with shorting holes having a sharp switching threshold and a high current value I.sub.H includes, a first area having a first density of shorting holes and a second area having a second density of shorting holes lower than the first density.
摘要:
A thyristor type surge protector having a breakdown voltage V.sub.BO approximately equal to a surge clamping voltage V.sub.CL includes a P-type first semiconductor layer, an N-type second semiconductor layer provided in one surface of the first semiconductor layer, a P-type third semiconductor layer provided in the second semiconductor layer so as to provide at least one first exposed region of the second semiconductor layer, and an N-type fourth semiconductor layer formed in the other surface of the first semiconductor layer so as to provide at least one exposed region of said first semiconductor layer, a first electrode provided over the third semiconductor layer and of the first exposed region, and a second electrode provided over the fourth semiconductor layer and second exposed region.
摘要:
The hold current of a breakover type surge protection device is increased by irradiating the device with .gamma. or x rays so as to form crystal lattice defects in the semiconductor regions thereof.