公开(公告)号：US20150129276A1

公开(公告)日：2015-05-14

申请号：US14163016

申请日：2014-01-24

申请人： U.S. Army Research Laboratory ATTN: RDRL-LOC-I

发明人： Justin L. Shumaker ,  Geoffrey A. Slipher ,  Randy A. Mrozek

IPC分类号： H01B11/00 ,  H01B3/30 ,  H01B7/06 ,  H04L5/14 ,  H01B3/46 ,  B64D17/00 ,  H01B3/44 ,  H01B3/40 ,  H01B3/28 ,  H01B1/22 ,  B64D1/00

CPC分类号： H01B1/24 ,  B64D17/02 ,  H01B1/22 ,  H01B3/28 ,  H01B3/30 ,  H01B3/305 ,  H01B3/306 ,  H01B3/40 ,  H01B3/441 ,  H01B3/442 ,  H01B3/443 ,  H01B3/445 ,  H01B3/447 ,  H01B3/46 ,  H01B7/06

摘要： This application generally relates to deformable elastomeric conductors and differential signaling transmission techniques. According to one embodiment, a deformable elastomeric conductor is configured to transmit electrical signals. It comprises: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically conductive. The conductive filler material may include substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain. Thus, over a transmission distance of an electrical signal through the conductor, the transmission does not suffer greater than about 3 dB of signal attenuation when subjected to the deformation.

摘要翻译： 本申请通常涉及可变形弹性体导体和差分信号传输技术。 根据一个实施例，可变形弹性体导体被配置成传输电信号。 它包括：弹性聚合物基体; 以及均匀分散在弹性体聚合物基质中的导电填料，足以使材料导电。 导电填料材料可以包括基本上非缠结的颗粒，其纵横比足够大，以使得颗粒基本上保持与相邻颗粒的接触和/或紧密接近，以便当材料经受 变形高达和超过10％的应变。 因此，在通过导体的电信号的传输距离上，当经受变形时，传输不会遭受大于3dB的信号衰减。

公开(公告)号：US20140205843A1

公开(公告)日：2014-07-24

申请号：US14238491

申请日：2012-06-26

申请人： Christian Beisele

发明人： Christian Beisele

IPC分类号： H01B3/40 ,  H01B19/04

CPC分类号： H01B19/04 ,  C08L63/00 ,  H01B3/40 ,  H01B3/427 ,  H01B3/46 ,  Y10T428/31511

摘要： Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an OH-terminated polysiloxane, (d) a cyclic polysiloxane and (e) a non-ionic, fluoroaliphatic surface-active reagent, (f) a filler, (g) a hardener selected from anhydrides, (h) a curing accelerator selected from accelerators for anhydride curing of epoxy resins.

摘要翻译： 公开了使用可固化组合物用于仪器变压器的无填料包封，其包括（a）脂环族环氧树脂，（b）聚氧化烯二缩水甘油醚（c）OH封端的聚硅氧烷，（d）环状聚硅氧烷和（e） 非离子型氟脂族表面活性剂，（f）填料，（g）选自酸酐的硬化剂，（h）选自用于环氧树脂的酸酐固化的促进剂的固化促进剂。

公开(公告)号：US20140187675A1

公开(公告)日：2014-07-03

申请号：US14012275

申请日：2013-08-28

申请人： Hitachi Industrial Equipment Systems Co., Ltd.

发明人： Atsushi OOTAKE ,  Chie KOBAYASHI ,  Tetsuji KATO

IPC分类号： H01B3/40

CPC分类号： H01B3/40 ,  C08K3/36 ,  C08K9/04 ,  C08K2201/011 ,  H01B3/28 ,  C08L63/00

摘要： The present invention provides an insulation resin material containing a filler for high voltage equipment includes a polar resin, a hardener, a filler, and fine particles added to at least one of the polar resin and the hardener, and having polar organic substituents exposed at the surface thereof. According to this invention, an insulation resin material for high voltage equipment which is easy to control viscosity, does not cause a problem of filler settling, and provides easy handling in the molding process such as molding, and high voltage equipment using the insulation resin material can be provided.

摘要翻译： 本发明提供一种包含高压设备用填料的绝缘树脂材料，包括极性树脂，硬化剂，填料和添加到至少一种极性树脂和硬化剂中的微粒，并且在 表面。 根据本发明，用于容易控制粘度的高压设备的绝缘树脂材料不会引起填料沉降的问题，并且在诸如模塑的成型过程中提供易于处理，并且使用绝缘树脂材料的高压设备 可以提供。

公开(公告)号：US20140141254A1

公开(公告)日：2014-05-22

申请号：US14131095

申请日：2012-06-29

申请人： HITACHI, LTD.

发明人： Kotaro Araya ,  Satoru Amou

IPC分类号： H01B3/40

CPC分类号： H01B3/40 ,  B32B1/08 ,  B32B17/064 ,  B32B27/08 ,  B32B27/281 ,  B32B27/308 ,  B32B27/34 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/762 ,  B32B2457/00 ,  C03C17/3405 ,  H01B3/308 ,  H01B3/427 ,  H01B7/0208 ,  Y10T428/31515

摘要： Provided is a laminated structure having excellent self-repairing performance, which can be prepared by an inexpensive and simple method; also provided are a self-bonding insulated wire and electrical machine using the same. A self-repairing laminated structure in which a self-repairing resin layer is formed on a base material and a thermosetting resin topcoat is formed on an outer layer thereof is characterized in that the self-repairing resin layer includes an uncured cross-linkable or curable thermoplastic resin, and the thermosetting resin topcoat includes a cross-linking agent, curing agent, or curing catalyst of the cross-linkable thermoplastic resin.

摘要翻译： 提供一种具有优异的自修复性能的层叠结构，其可以通过廉价和简单的方法制备; 还提供了使用其的自粘绝缘电线电机。 在其外层上形成有在基材上形成自修复树脂层和热固性树脂外涂层的自修复层压结构，其特征在于，所述自修复树脂层包括未固化的可交联或可固化的 热塑性树脂和热固性树脂面漆包括可交联热塑性树脂的交联剂，固化剂或固化催化剂。

公开(公告)号：US20140065413A1

公开(公告)日：2014-03-06

申请号：US14013568

申请日：2013-08-29

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chung Hee LEE ,  Jae Choon CHO ,  Jong Yoon JANG ,  Hee Sun CHUN ,  Jong Su PARK ,  Sung Hyun KIM

IPC分类号： H01B3/00 ,  H01B19/04 ,  H01B17/60 ,  H01B3/40

CPC分类号： H01B3/002 ,  H01B3/40 ,  H01B17/60 ,  H01B19/04 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/265 ,  Y10T428/31511

摘要： Disclosed herein are an insulating film and a producing method of the insulating film which can address problems caused by dents by providing a reinforcing layer having the weight ratio of the silica of 60 to 80 wt % on one surface of the insulating film.

摘要翻译： 这里公开了绝缘膜和绝缘膜的制造方法，其可以通过在绝缘膜的一个表面上设置二氧化硅的重量比为60〜80重量％的增强层来解决由凹痕引起的问题。

公开(公告)号：US20140014402A1

公开(公告)日：2014-01-16

申请号：US13939743

申请日：2013-07-11

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jae Choon Cho ,  Jong Yoon Jang ,  Chung Hee Lee ,  Hee Sun Chun ,  Sung Hyun Kim ,  Choon Keun Lee

IPC分类号： H01B3/40 ,  H05K1/03

CPC分类号： H01B3/40 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4676

摘要： This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up type multilayer printed circuit board, and to an insulating film manufactured using the epoxy resin composition, and to a multilayer printed circuit board in which inner circuits formed of copper (Cu) are insulated by virtue of the insulating film to thus form multiple layers.

摘要翻译： 本发明涉及环氧树脂组合物，由其形成的绝缘膜和印刷电路板，更具体地说，涉及包含环氧树脂，酸酐固化剂等的环氧树脂组合物，其通过减少显示出改进的介电性能 积层型多层印刷电路板中的介电常数，介电切线等，以及使用该环氧树脂组合物制造的绝缘膜，以及由铜（Cu）形成的内部电路被绝缘的多层印刷电路板 绝缘膜的优点因此形成多层。

公开(公告)号：US07820741B2

公开(公告)日：2010-10-26

申请号：US11865355

申请日：2007-10-01

申请人： Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

发明人： Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

IPC分类号： H01B3/40

CPC分类号： B32B7/12 ,  C08K3/32 ,  C08K5/34928 ,  C08L13/00 ,  C08L63/00 ,  C08L2666/22 ,  C09J133/02 ,  Y10T428/265 ,  Y10T428/2804 ,  Y10T428/287

摘要： The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.

摘要翻译： 本发明提供了一种无卤阻燃粘合剂组合物，其不仅在单层结构内，而且在高密度的多层结构内表现出优异的抗迁移性能。 根据本发明的阻燃粘合剂组合物包括：（A）无卤环氧树脂，（B）含羧基的丙烯酸树脂和/或含羧基的丙烯腈 - 丁二烯橡胶，（C）固化 试剂，（E）特定的多磷酸 - 三聚氰胺类化合物盐和/或多磷酸 - 二胺化合物盐，和（F）离子清除剂和/或重金属钝化剂。

公开(公告)号：US07820740B2

公开(公告)日：2010-10-26

申请号：US11865330

申请日：2007-10-01

申请人： Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

发明人： Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

IPC分类号： H01B3/40

CPC分类号： H05K3/386 ,  B32B7/12 ,  C08K5/0066 ,  C08K5/5317 ,  C09J7/35 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2471/00 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0769 ,  Y10T428/14 ,  Y10T428/266 ,  Y10T428/2804

摘要： The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates.The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.

摘要翻译： 本发明提供了一种无卤阻燃粘合剂组合物，其不仅在单层结构内，而且在诸如覆铜层压板之类的高密度多层结构内表现出优异的抗迁移性能。 根据本发明的阻燃粘合剂组合物包括：（A）无卤环氧树脂，（B）含羧基的丙烯酸树脂和/或含羧基的丙烯腈 - 丁二烯橡胶，（C）固化 （E）特定的次膦酸盐和/或二膦酸盐化合物，和（F）离子清除剂和/或重金属钝化剂。

公开(公告)号：US20080268237A1

公开(公告)日：2008-10-30

申请号：US12164952

申请日：2008-06-30

申请人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

发明人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

IPC分类号： H01B3/00 ,  H01B3/40

CPC分类号： H01B3/30 ,  B32B15/08 ,  C08K3/34 ,  C08K7/00 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustionThe invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.

摘要翻译： 本发明的目的是提供一种用于绝缘基板，印刷电路板，层压板，具有树脂的铜箔，覆铜层压板，聚酰亚胺膜，用于TAB的膜和预浸料的材料，其物理性质优异 特性，尺寸稳定性，耐热性，阻燃性等，特别是通过燃烧时的形状保持效果而显示优异的阻燃效果本发明提供一种绝缘基材的材料，其包含100重量份的热塑性树脂或 热塑性树脂和热固性树脂的混合物和0.1至100重量份层状硅酸盐。

公开(公告)号：US20050256240A1

公开(公告)日：2005-11-17

申请号：US10526949

申请日：2003-10-03

申请人： J. Nelson

发明人： J. Nelson

IPC分类号： C08K3/00 ,  C08K3/18 ,  H01B3/10 ,  H01B3/28 ,  H01B3/30 ,  H01B3/40 ,  H01B3/44

CPC分类号： H01B3/10 ,  B82Y30/00 ,  C08K3/01 ,  C08K2201/011 ,  H01B3/28 ,  H01B3/306 ,  H01B3/40 ,  H01B3/441

摘要： A dielectric is provided which possesses high dielectric constant and high dielectric strength, while having the ca-pabilities of a polymer. The dielectric comprises a nanometric composite, which includes a stoichiometric nano-particulate filler embedded in a polymer or resin matrix. Filler particles are reduced in physical size to dimension to the same order as the polymer chain length of the host material and interact cooperatively thereby mitigating the associated Maxwell-Wagner process and reducing interfacial polarization. The internal fields for the new formulation are nearly a factor of 10 lower then for conventional (micro) material. The large changes in the internal field of the composite permit engineering of nanocomposite materials with enhanced electric strength and improved voltage endurance properties.

摘要翻译： 提供具有高介电常数和高介电强度的电介质，同时具有聚合物的可靠性。 电介质包括纳米复合材料，其包括嵌入聚合物或树脂基质中的化学计量的纳米颗粒填料。 填料颗粒的物理尺寸减小到与主体材料的聚合物链长度相同的顺序并且协同地相互作用，从而减轻相关的麦克斯韦 - 瓦格纳（Maxwell-Wagner）工艺并减少界面极化。 新制剂的内部领域几乎比常规（微）材料低10倍。 复合材料内部的巨大变化允许纳米复合材料的工程化，具有增强的电气强度和改善的耐电压性能。