公开(公告)号：US20190177203A1

公开(公告)日：2019-06-13

申请号：US16276909

申请日：2019-02-15

申请人： Corning Incorporated

发明人： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

IPC分类号： C03B33/02 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K26/38 ,  B23K26/0622

摘要： Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

公开(公告)号：US10301871B2

公开(公告)日：2019-05-28

申请号：US15094897

申请日：2016-04-08

申请人： View, Inc.

发明人： Dhairya Shrivastava ,  Robin Friedman ,  Vinod Khosla ,  Rao Mulpuri

IPC分类号： G02F1/153 ,  E06B9/24 ,  E06B3/67 ,  B23K26/359 ,  G09F23/02

摘要： Thin-film devices, for example, multi-zone electrochromic windows, and methods of manufacturing are described. In certain cases, a multi-zone electrochromic window comprises a monolithic EC device on a transparent substrate and two or more tinting zones, wherein the tinting zones are configured for independent operation.

公开(公告)号：US10295915B2

公开(公告)日：2019-05-21

申请号：US16049962

申请日：2018-07-31

申请人： POSTECH Academy-Industry Foundation

发明人： Jun Suk Rho ,  In Ki Kim ,  Heon Yeong Jeong

IPC分类号： G06F7/20 ,  G03F7/20 ,  C23C14/04 ,  B23K26/362 ,  H01L21/308 ,  G03F1/00 ,  B23K26/06 ,  B23K26/18 ,  B23K26/359 ,  B23K103/00

摘要： A mask manufacturing apparatus, a method of manufacturing the mask, and a mask for lithography, capable of providing a pattern having a size in nanometer unit using the photo-lithography process are provided. A mask manufacturing apparatus, a method of manufacturing the mask, and an elastic film for a photo-mask lower a critical dimension of the pattern(s) without increasing a manufacturing cost. The mask manufacturing apparatus and the method of manufacturing the mask, and the mask for lithography provide a pattern having a size in nanometer unit using the photo-lithography process.

公开(公告)号：US10280107B2

公开(公告)日：2019-05-07

申请号：US15739964

申请日：2016-06-23

申请人： SILTECTRA GmbH

发明人： Marko Swoboda ,  Christian Beyer ,  Franz Schilling ,  Jan Richter

IPC分类号： H01L21/268 ,  H01L21/304 ,  C03B33/02 ,  B23K26/00 ,  B28D1/22 ,  B28D5/00 ,  C03B33/09 ,  B23K26/359 ,  B23K26/70 ,  B23K26/53 ,  B23K26/0622 ,  B23K26/60 ,  H01L21/02 ,  B23K101/40

摘要： The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the center (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

公开(公告)号：US20190126396A1

公开(公告)日：2019-05-02

申请号：US16224502

申请日：2018-12-18

申请人： BROTHER KOGYO KABUSHIKI KAISHA

发明人： Yasuo NISHIKAWA ,  Yoshihisa KUSUMOTO

IPC分类号： B23K26/082 ,  B23K26/359 ,  G05B19/4067 ,  B23K26/02

摘要： A laser machining apparatus includes: a laser beam emission device; a visible laser beam emission device; a scanner; and a controller. The controller is configured to perform: generating machining data including coordinate data representing a machining pattern to be machined on a workpiece; machining the workpiece with a laser beam according to the machining data by controlling the laser beam emission device and the scanner; generating, in response to receiving a resuming command after the machining has been halted at a stopping position, a guide pattern based on a stopping point coordinate and the machining data, the guide pattern being used for resuming the machining from the stopping position, the stopping point coordinate indicating the stopping position and being determined by the coordinate data; and projecting the guide pattern onto the workpiece with a visible laser beam by controlling the visible laser beam emission device and the scanner.

公开(公告)号：US20190118303A1

公开(公告)日：2019-04-25

申请号：US16168256

申请日：2018-10-23

申请人： DISCO CORPORATION

发明人： Keiji NOMARU ,  Yuji HADANO ,  Masatoshi NAYUKI

IPC分类号： B23K26/359 ,  H01L21/67 ,  B23K26/00 ,  B23K26/06 ,  B23K26/067 ,  B23K26/142

摘要： A liquid supply mechanism disposed over a holding unit of laser processing apparatus includes a liquid chamber having a circular-disc-shaped transparent plate positioned to form a gap between the circular-disc-shaped transparent plate and an upper surface of the workpiece held by the holding table, a liquid supply nozzle that supplies a liquid from one side of the liquid chamber to the gap, a liquid discharge nozzle that discharges the liquid from the other side of the liquid chamber, and a rotation mechanism that rotates the circular-disc-shaped transparent plate and generates a flow velocity in the liquid supplied to the gap. The laser beam irradiation unit includes a laser oscillator that emits a laser beam and a condenser that condenses the laser beam emitted from the laser oscillator and irradiates the workpiece with the laser beam transmitted through the transparent plate and the liquid supplied to the gap.

公开(公告)号：US10233112B2

公开(公告)日：2019-03-19

申请号：US15251605

申请日：2016-08-30

申请人： Corning Incorporated

发明人： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC分类号： C03B33/08 ,  B23K26/00 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/53 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/382 ,  B23K26/55 ,  B23K26/359 ,  B23K103/00

摘要： The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

公开(公告)号：US20190076947A1

公开(公告)日：2019-03-14

申请号：US16123334

申请日：2018-09-06

申请人： Samsung Electronics Co., Ltd.

发明人： Young-Jong SHIN ,  Jin-Hyeong PARK

IPC分类号： B23H5/04 ,  B23K26/359 ,  B23K26/323 ,  B22D17/22

摘要： According to various embodiments, a dissimilar metal member according to various embodiments, comprises a first metallic material including a bonding portion, the bonding portion including a pattern formed by a laser; and a second metallic material bonded to the bonding portion of the first metallic material by die casting, wherein a portion of the second metallic material forming contact with the bonding portion of the first metallic material forms a reverse negative of the pattern.

公开(公告)号：US10183885B2

公开(公告)日：2019-01-22

申请号：US15496393

申请日：2017-04-25

申请人： Corning Incorporated

发明人： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Kamjula Pattabhirami Reddy ,  Pushkar Tandon ,  Sergio Tsuda ,  Natesan Venkataraman ,  Robert Stephen Wagner

IPC分类号： C03B33/02 ,  C03B25/087 ,  C03B33/07 ,  B23K26/53 ,  B23K26/0622 ,  B23K26/402 ,  C03B17/06 ,  C03B33/09 ,  B23K26/359 ,  B23K103/00 ,  B23K103/16

摘要： The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.

公开(公告)号：US09754719B2

公开(公告)日：2017-09-05

申请号：US14911682

申请日：2014-08-21

申请人： NISSAN MOTOR CO., LTD.

发明人： Takumi Ohshima ,  Kiyoshi Hasegawa ,  Kimio Nishimura ,  Takashi Sekikawa ,  Yasushi Matsushita ,  Akihisa Hori ,  Michito Kishi

IPC分类号： B26F3/00 ,  H02K15/03 ,  H01F41/02 ,  H02K1/27 ,  B23K26/359 ,  B23K26/00 ,  B23K103/00

CPC分类号： H01F41/0253 ,  B23K26/0006 ,  B23K26/359 ,  B23K2103/50 ,  B26F3/002 ,  H02K1/276 ,  H02K15/03

摘要： A cutting method and a cutting device of cutting a magnet body including a coating film feed, in a state where the magnet body in which cutout grooves serving as brittle sections are provided on a lower surface along cutting planned positions is supported by dies serving as two support points from the lower side, the magnet body to a position where the brittle section is arranged between both the support points, and press the magnet body from the upper side of a position offset rearward in the feeding direction from the brittle section between both the support points, so as to cut the magnet body into a cut magnet body and a magnet piece smaller than the cut magnet body while cutting the coating film.