Abstract:
There is disclosed an electronic device comprising a plate-shaped electronic element having electrode films. The electronic element is elastically supported by spring members in an electrically insulating case so as to be respectively in contact with the electrode films. Each spring member includes supporting plates opposing to the electrode films and spring pieces for being respectively in contact with the electrode films at contact points thereof. Each spring piece is formed integrally with the supporting plate so as to be extended with a curvature toward the electrode film from one end of the supporting plate in the longitudinal direction thereof to the contact point, to be folded by a predetermined angle at the contact point, and to be further extended toward the supporting plate from the contact point without contact with the supporting plate. Further, each spring piece has a predetermined thickness and a predetermined width so as to be cut when a current flowing in the spring pieces through the electronic element becomes larger than a predetermined threshold current in an abnormal state of the electronic element.
Abstract:
A PTC polymer assembly in which a sheet of PTC polymer is sandwiched between two electrodes, and electric terminations are mechanically and electrically connected to the electrodes, at least one of the terminations is a looped spring connected at one end to one of the electrodes and at another end to a mounting element, with a loop between the electrode and the mounting element to which it is mechanically connected.
Abstract:
A ceramic PTCR slug has glass-bonded-aluminum layers bonded to the major opposite surfaces. Patches of silver film are bonded to selected regions of the glass-aluminum layers and stainless steel contacts are spring loaded against the silver patches. The stainless steel contacts provide good thermal isolation to the slug. The low cost contacts are complemented by the minumum use of silver in the electrode. The package provides long life under relatively heavy duty service.
Abstract:
An electronic circuit part comprises a solid-state circuit element and at least one pin terminal, which are electrically connected through an intervening elastomeric sheet, which is anisotropically electroconductive in the direction perpendicular to its plane.
Abstract:
A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
Abstract:
Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.
Abstract:
A temperature safety resistor assembly includes a hollow shell, a resistor and two conductive components. The resistor is disposed within the shell and at least one of the two conductive components is welded with an end of the resistor by a low temperature solder. An elastic deformation portion is formed on the conductive component and the elastic deformation portion is deformed to accumulate an elastic restoring force. When the current flowing through the conductive component and the resistor is abnormally increased, the temperature of the conductive component is increased till a melting point of the low temperature solder, the solder is melted and the conductive component is bounded from the end of the resistor by the elastic restoring force of the elastic deformation portion so as to cut off the temperature safety resistor assembly and protect the rest of the circuits.