Abstract:
There is disclosed an electronic device comprising a plate-shaped electronic element having electrode films. The electronic element is elastically supported by spring members in an electrically insulating case so as to be respectively in contact with the electrode films. Each spring member includes supporting plates opposing to the electrode films and spring pieces for being respectively in contact with the electrode films at contact points thereof. Each spring piece is formed integrally with the supporting plate so as to be extended with a curvature toward the electrode film from one end of the supporting plate in the longitudinal direction thereof to the contact point, to be folded by a predetermined angle at the contact point, and to be further extended toward the supporting plate from the contact point without contact with the supporting plate. Further, each spring piece has a predetermined thickness and a predetermined width so as to be cut when a current flowing in the spring pieces through the electronic element becomes larger than a predetermined threshold current in an abnormal state of the electronic element.
Abstract:
A PTC thermistor device includes a case in which a holding plate made of metallic material is vertically arranged; and on each of both main surfaces of the holding plate, an electrode from a respective one of two PTC thermistor units is fixed. Therefore, the two PTC thermistor units are thermally coupled with each other through the holding plate. A terminal is integrally formed at the lower end of the holding plate, which is exposed outside the case. A throughhole for reducing an area of a section of a heat conduction path from the holding plate to the terminal is formed in the heat conduction path.
Abstract:
A heat sink with fins comprising: a base plate made of a heat conductive material; a plurality of heat dissipating fins which are positioned in heat-dissipating-fin mounting portions formed on one surface of said base plate and are jointed to said base plate by mechanical crimping; and at least one heat pipe which is positioned in a heat-pipe mounting portion formed on an opposite surface of said base plate, portions in the vicinity of said heat pipe being crimped to joint said heat pipe to said base plate.
Abstract:
A sealed plate type metallic heat pipe is disclosed having multiple independent through holes which run through the inside of the heat pipe. All of the through holes are connected in fluid communication at each end. A working fluid is disposed in the through holes and a wire or a wire mesh is disposed in at least one of the through holes.