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公开(公告)号：US12112870B2
公开(公告)日：2024-10-08
申请号：US18459217
申请日：2023-08-31
申请人： Suncall Corporation
发明人： Naoya Ashida , Kenji Murakami
IPC分类号： H01C13/00
CPC分类号： H01C13/00
摘要： A shunt resistor the resistive value of which can be lowered simply and easily has: a first resistive body, two base materials that sandwich the first resistive body therebetween and are joined by a welding to the first resistive body, and a second resistive body joined by a welding to the two base materials at different positions from the first resistive body. In addition, the second resistive body can come into contact with the first resistive body.
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公开(公告)号：US12005985B2
公开(公告)日：2024-06-11
申请号：US17229142
申请日：2021-04-13
申请人： Shimano Inc.
发明人： Shinya Fujimura , Hitoshi Takayama
摘要： A component is provided for a human-powered vehicle. The component includes a component body, a single substrate, a resistor, an electric wire, a signal processing unit, a signal output, and an electric power input. The single substrate is provided on the component body. The resistor is formed on the single substrate and forms a strain gauge with part of the single substrate. The electric wire is formed on the single substrate and electrically connected to the resistor. The signal processing unit is formed or directly mounted on the single substrate and electrically connected to the electric wire. The signal output outputs a signal from the signal processing unit. The electric power input is electrically connected to the signal processing unit and supplied with electric power from a power supply provided on at least one of the human-powered vehicle and the component body.
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公开(公告)号：US20230411053A1
公开(公告)日：2023-12-21
申请号：US18459217
申请日：2023-08-31
申请人： Suncall Corporation
发明人： Naoya Ashida , Kenji Murakami
IPC分类号： H01C13/00
CPC分类号： H01C13/00
摘要： A shunt resistor the resistive value of which can be lowered simply and easily has: a first resistive body, two base materials that sandwich the first resistive body therebetween and are joined by a welding to the first resistive body, and a second resistive body joined by a welding to the two base materials at different positions from the first resistive body. In addition, the second resistive body can come into contact with the first resistive body.
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公开(公告)号：US20230411052A1
公开(公告)日：2023-12-21
申请号：US18459188
申请日：2023-08-31
申请人： Suncall Corporation
发明人： Naoya Ashida , Kenji Murakami
IPC分类号： H01C13/00
CPC分类号： H01C13/00
摘要： A shunt resistor the resistive value of which can be lowered simply and easily has: a first resistive body, two base materials that sandwich the first resistive body therebetween and are joined by a welding to the first resistive body, and a second resistive body joined by a welding to the two base materials at different positions from the first resistive body. In addition, the second resistive body can come into contact with the first resistive body.
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公开(公告)号：US11626399B2
公开(公告)日：2023-04-11
申请号：US17589923
申请日：2022-02-01
发明人： Kazuma Yoshida , Ryosuke Okawa , Tsubasa Inoue
IPC分类号： H01L27/06 , H01C1/08 , H01C13/00 , H01L21/8234 , H01L23/31 , H01L23/528 , H01L29/78
摘要： Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.
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公开(公告)号：US20220191978A1
公开(公告)日：2022-06-16
申请号：US17576019
申请日：2022-01-14
摘要： A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.
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公开(公告)号：US20210311096A1
公开(公告)日：2021-10-07
申请号：US17053228
申请日：2019-05-08
申请人： KOA CORPORATION
发明人： Tamotsu ENDO
摘要： Provided is a shunt resistor including: a first terminal and a second terminal each made of an electrically conductive metal material and having a first plane, a second plane, and an outer peripheral surface around the planes; and a resistive body connected to the respective first planes and connecting the first terminal and the second terminal, the first planes of the first terminal and the second terminal opposing each other. A bonding area between the resistive body and the first planes is smaller than an area of the first planes. The first terminal and the second terminal each have a hole penetrating through from the first plane to the second plane. A voltage detection terminal is connected to opposing surface sides of the first terminal and the second terminal.
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公开(公告)号：US20210199999A1
公开(公告)日：2021-07-01
申请号：US17197419
申请日：2021-03-10
申请人： Japan Display Inc.
发明人： Hirofumi OHIRA
IPC分类号： G02F1/137 , G02F1/1343 , H01C13/00 , B60R1/12
摘要： A display device includes a display panel, and a front panel overlapping with the display panel and being switched into a reflection state in which incident light is reflected and a transmission state in which incident light is transmitted. The front panel includes a first substrate, a second substrate facing the first substrate, a liquid crystal layer sealed between the first substrate and the second substrate, a first translucent electrode provided on a side of the first substrate on which the liquid crystal layer is located, a second translucent electrode provided on a side of the second substrate on which the liquid crystal layer is located, a discharge resistor that is electrically coupled to the second translucent electrode and is provided on the second substrate, and a first conductive pillar that electrically couples the first translucent electrode and the discharge resistor.
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公开(公告)号：US10786864B2
公开(公告)日：2020-09-29
申请号：US15778934
申请日：2016-11-24
申请人： Suncall Corporation
摘要： In manufacturing method of shunt resistor according to the present invention, at least one of first and second conductors that is thicker than a resistance alloy plate member includes a joining surface abutted to the resistance alloy plate member with their edges on one side in a plate-thickness direction being aligned with each other, a first inclined surface that is gradually located on one side in the plate-thickness direction from the joining surface toward the side opposite to the resistance alloy plate member in the plate-surface direction, and a first plate surface extending to the side opposite to the resistance alloy plate member in the plate-surface direction from the first inclined surface. Electron beams or laser is emitted to the joining surfaces of the conductor having the larger thickness and the resistance alloy plate member from one side in the plate-thickness direction to weld the joining surfaces.
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公开(公告)号：US10578651B2
公开(公告)日：2020-03-03
申请号：US15738983
申请日：2016-06-14
申请人： KOA CORPORATION
发明人： Kosuke Arai , Kenji Kameko
IPC分类号： G01R1/20 , G01R15/00 , H01C1/04 , H01C13/00 , G01R15/20 , G01R15/14 , G01R19/00 , H01C17/00 , G01R35/00 , G01R21/06 , G01R15/16 , G01R15/18 , G01R19/25
摘要： Provided is a current sensing resistor made of electrically conductive metal, the resistor including a code display portion obtained by encoding characteristic information specific to the current sensing resistor and displaying the encoded characteristic information in a readable manner.
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