公开(公告)号：US20210081636A1

公开(公告)日：2021-03-18

申请号：US17106644

申请日：2020-11-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Yu-Feng Chen ,  Chih-Hua Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC: G06K9/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16

Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

公开(公告)号：US10811384B2

公开(公告)日：2020-10-20

申请号：US16713009

申请日：2019-12-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Wei Chen ,  Chih-Hua Chen ,  Hsin-Yu Pan ,  Hao-Yi Tsai ,  Lipu Kris Chuang ,  Tin-Hao Kuo

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L25/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/538 ,  H01L23/29

Abstract: A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically connected to the redistribution structure. The heat dissipation component is disposed on the redistribution structure and includes a concave portion for receiving the at least one semiconductor device and an extending portion connected to the concave portion and contacting the redistribution structure, wherein the concave portion contacts the at least one semiconductor device. The encapsulating material is disposed over the redistribution structure, wherein the encapsulating material fills the concave portion and encapsulates the at least one semiconductor device.

公开(公告)号：US20200303364A1

公开(公告)日：2020-09-24

申请号：US16898409

申请日：2020-06-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Wei Chen ,  Chih-Hua Chen ,  Hsin-Yu Pan ,  Hao-Yi Tsai ,  Lipu Kris Chuang ,  Tin-Hao Kuo

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528 ,  H01L23/34 ,  H01L21/56

Abstract: Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.

公开(公告)号：US20200303211A1

公开(公告)日：2020-09-24

申请号：US16892320

申请日：2020-06-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Feng Chen ,  Chih-Hua Chen ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hung-Jui Kuo ,  Hui-Jung Tsai ,  Hao-Yi Tsai

IPC: H01L21/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/538

Abstract: A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.

公开(公告)号：US20190252209A1

公开(公告)日：2019-08-15

申请号：US16396779

申请日：2019-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Feng Chen ,  Chih-Hua Chen ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hung-Jui Kuo ,  Hui-Jung Tsai ,  Hao-Yi Tsai

IPC: H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.

公开(公告)号：US20190139886A1

公开(公告)日：2019-05-09

申请号：US15877398

申请日：2018-01-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chih-Hua Chen ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Yu-Chih Huang ,  Yu-Peng Tsai ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Jen-Jui Yu

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/522

Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

公开(公告)号：US10074615B1

公开(公告)日：2018-09-11

申请号：US15794003

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Cheng Tseng ,  Chih-Hua Chen ,  Hsiu-Jen Lin ,  Hao-Yi Tsai ,  Kuo-Chung Yee ,  Chia-Hung Liu

IPC: H01L23/552 ,  H01L23/34 ,  H01L23/538 ,  H01L21/02

Abstract: A package structure including at least one conductive plate, a redistribution layer, a first semiconductor chip, a conductive shielding structure and an insulating encapsulant is provided. The first semiconductor chip is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the first semiconductor chip is disposed on the at least one conductive plate and electrically connected to the redistribution layer. The conductive shielding structure is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the conductive shielding structure surrounds the first semiconductor chip and electrically connects the at least one conductive plate with the redistribution layer. The insulating encapsulant is disposed on the redistribution layer, encapsulating the first semiconductor chip, the conductive shielding structure, and surrounding the at least one conductive plate.