Invention Application
- Patent Title: Fingerprint Sensor Device and Method
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Application No.: US17106644Application Date: 2020-11-30
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Publication No.: US20210081636A1Publication Date: 2021-03-18
- Inventor: Chen-Hua Yu , Yu-Feng Chen , Chih-Hua Chen , Hao-Yi Tsai , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H01L21/56 ; H01L21/768 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H01L23/00 ; H01L25/16
Abstract:
A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
Public/Granted literature
- US11625940B2 Fingerprint sensor device and method Public/Granted day:2023-04-11
Information query
