公开(公告)号：US07219787B2

公开(公告)日：2007-05-22

申请号：US11035952

申请日：2005-01-18

申请人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

发明人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

IPC分类号： B65G43/08

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/0452 ,  Y10T29/49124

摘要： In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working drive units, board conveying/holding devices, recognition cameras and so forth are also arranged in the work area. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

摘要翻译： 在组件安装工作区域中，两个电子电路板以锯齿形的方式放置，并且组件独立地安装在每个板上。 工作区域还设有两套工作驱动单元，板式输送/保持装置，识别照相机等。 用于保持板的板传送/保持装置移动到靠近分量供给单元的位置，并且部件安装在相应的安装区域中。

公开(公告)号：US20070101572A1

公开(公告)日：2007-05-10

申请号：US10564275

申请日：2004-08-25

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 元件安装装置具有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板上的板上 保持位置的第二安装头，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持各个部件的晶片的晶片保持台的部件供给装置 进给，使得晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US20050259862A1

公开(公告)日：2005-11-24

申请号：US10522742

申请日：2003-07-31

申请人： Akira Kabeshita ,  Eiichi Hachiya

发明人： Akira Kabeshita ,  Eiichi Hachiya

IPC分类号： H05K13/04 ,  H05K1/02 ,  H05K3/00 ,  H05K13/08 ,  G06K9/00

CPC分类号： H05K13/0812 ,  H05K1/0269 ,  H05K3/0008 ,  H05K13/0853

摘要： In a component placement recognition mark recognizing device for recognizing recognition marks for component placement that are provided corresponding to component placement positions where components are to be placed in a plurality of partition areas on a board. The device has a recognition camera for recognizing the recognition marks straightly disposed in the plurality of areas and a moving device for running the recognition camera at a generally uniform velocity in a deposition direction in which the recognition marks are straightly disposed. The recognition marks are recognized with use of the recognition camera while the recognition camera is run by the moving device.

摘要翻译： 在组件放置识别标识识别装置中，用于识别与元件放置位置相对应的元件放置识别标记，其中元件放置位置将被放置在板上的多个分区中。 该装置具有用于识别在多个区域中直线设置的识别标记的识别摄像机，以及用于在识别标记被直线设置的沉积方向上以大致均匀的速度运行识别照相机的移动装置。 当识别照相机由移动装置运行时，使用识别照相机识别识别标记。

公开(公告)号：US20050133346A1

公开(公告)日：2005-06-23

申请号：US11035997

申请日：2005-01-18

申请人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

发明人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

IPC分类号： B23Q5/40 ,  B23Q7/00 ,  B23Q7/14 ,  B65G15/10 ,  H05K3/00 ,  H05K13/00 ,  H05K13/04 ,  H05K13/08

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/0452 ,  Y10T29/49124

摘要： In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working their drive units, board conveying/holding devices recognition cameras and so forth are also arranged. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

摘要翻译： 在组件安装工作区域中，两个电子电路板以锯齿形的方式放置，并且组件独立地安装在每个板上。 还安排了两套其驱动单元，板传送/保持装置识别照相机等。 用于保持板的板传送/保持装置移动到靠近分量供给单元的位置，并且部件安装在相应的安装区域中。

公开(公告)号：US06594887B1

公开(公告)日：2003-07-22

申请号：US09554187

申请日：2000-05-10

申请人： Osamu Okuda ,  Akira Kabeshita ,  Naoyuki Kitamura ,  Yoshihiro Yoshida ,  Mamoru Inoue ,  Kazuo Mori

发明人： Osamu Okuda ,  Akira Kabeshita ,  Naoyuki Kitamura ,  Yoshihiro Yoshida ,  Mamoru Inoue ,  Kazuo Mori

IPC分类号： B23P1900

CPC分类号： H05K13/0452 ,  H05K13/08 ,  Y10T29/49131 ,  Y10T29/49137 ,  Y10T29/53174 ,  Y10T29/53261

摘要： A component installing device comprises: a tray component supply section (8) having a plurality of conjointly provided tray component supply mechanisms (7) for moving selected trays (4) from a storage position (5) to a component supply position (6), according to need, thereby providing the components (2) accommodated therein for use; and a cassette component supply section (13) having a plurality of mutually aligned component supply cassettes (12) for carrying components in a tape cassette or a bulk cassette, and transporting said components to a component supply position (11), one at a time, thereby providing said components for use. Components (2) accommodated in the respective trays (4) located at the component supply positions (6) of the respective tray component supply mechanisms (7) in the tray component supply section (8), and components (2) transported to the component supply positions (11) of the respective component supply cassettes (12) in the cassette component supply section (13), are variously handled and installed at prescribed positions on a circuit board (1) by means of an installing head (21).

摘要翻译： 一种部件安装装置，包括：托盘部件供应部分，具有多个联合提供的托盘部件供应机构，用于将选定的托盘从储存位置（5）移动到零件供应位置（6）; 根据需要，由此提供容纳在其中的组件（2）供使用; 以及具有多个相互对准的部件供应盒（12）的盒部件供应部分（13），用于承载带盒或散装盒中的部件，并将所述部件一次一个地传送到部件供应位置（11） ，从而提供所述组件供使用。 容纳在位于托盘部件供给部（8）中的各个托盘部件供给机构（7）的部件供给位置（6）的相应的托盘（4）中的部件（2）以及运送到部件 各个部件供给盒（12）在盒部件供给部（13）中的供给位置（11）通过安装头（21）进行各种处理和安装在电路板（1）上的规定位置。

公开(公告)号：US06581282B2

公开(公告)日：2003-06-24

申请号：US10071104

申请日：2002-02-11

申请人： Kazuo Mori ,  Osamu Okuda ,  Hiroshi Uchiyama ,  Akira Kabeshita

发明人： Kazuo Mori ,  Osamu Okuda ,  Hiroshi Uchiyama ,  Akira Kabeshita

IPC分类号： H05K334

CPC分类号： B23K3/082 ,  B23K2101/40 ,  H05K3/3484 ,  H05K3/3489 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49197 ,  Y10T29/53178 ,  Y10T29/53183

摘要： A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.

公开(公告)号：US06490781B2

公开(公告)日：2002-12-10

申请号：US09989521

申请日：2001-11-21

申请人： Kazunori Kanai ,  Naoto Mimura ,  Yuji Miyata ,  Akira Kabeshita

发明人： Kazunori Kanai ,  Naoto Mimura ,  Yuji Miyata ,  Akira Kabeshita

IPC分类号： B23P2100

CPC分类号： F16P3/08 ,  H05K13/0417 ,  H05K13/0888 ,  Y10T29/53026 ,  Y10T29/53035 ,  Y10T29/53061 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T74/2193

摘要： The safety device includes an opening/closing cover which isolates a takeout part and an accommodating part of a component feeder unit from each other and which has a sensor for detecting a closed state. The component feeder unit includes the component accommodating part, a feed-out part and the takeout part, and sensors for transmission through voids common to the plurality of set component feeder units. Upon a detection by any one of the sensors during the operation of the machine, the machine is halted. For replacement of the component feeder units, a changeover switch is pressed, by which the detecting function is paused for a specified time period. Thus, a safety device which allows the component feeder units to be replaced even during the operation of the machine can be obtained.

摘要翻译： 该安全装置包括一个打开/关闭盖，该打开/关闭盖将部件供给单元的取出部分和容纳部彼此隔离，并具有用于检测关闭状态的传感器。 部件供给单元包括部件容纳部，送出部和取出部，以及用于通过多个组件供给单元共用的空隙传输的传感器。 在机器操作期间由任何一个传感器检测到，机器停止。 为了更换部件供给单元，按下切换开关，通过该转换开关将检测功能暂停指定的时间段。 因此，可以获得即使在机器的操作期间也能够更换部件供给单元的安全装置。

公开(公告)号：US06389683B1

公开(公告)日：2002-05-21

申请号：US09414960

申请日：1999-10-12

申请人： Kazuo Mori ,  Osamu Okuda ,  Hiroshi Uchiyama ,  Akira Kabeshita

发明人： Kazuo Mori ,  Osamu Okuda ,  Hiroshi Uchiyama ,  Akira Kabeshita

IPC分类号： B23P1900

CPC分类号： B23K3/082 ,  B23K2101/40 ,  H05K3/3484 ,  H05K3/3489 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49197 ,  Y10T29/53178 ,  Y10T29/53183

摘要： A solvent transfer unit is made a slide type and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer the flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, a time for moving the nozzles up, down is shortened and a total cycle time is reduced, so that production efficiency is improved.

摘要翻译： 溶剂转印单元被制成滑动型，并且在头部具有多个喷嘴，吸附和保持部件同时向下移动以将焊剂转移到电子部件。 与通过具有旋转式溶剂转移单元的传统电子部件安装装置一个接一个地降低喷嘴的转印操作的电子部件安装方法相比，缩短了向上，向下移动喷嘴的时间，并且总周期 时间缩短，生产效率提高。

公开(公告)号：US5589029A

公开(公告)日：1996-12-31

申请号：US504748

申请日：1995-07-20

申请人： Hisako Matsui ,  Akira Kabeshita

发明人： Hisako Matsui ,  Akira Kabeshita

IPC分类号： B23P19/00 ,  H01L21/67 ,  H05K13/02 ,  H05K13/04 ,  B32B35/00

CPC分类号： H05K13/0421 ,  H01L2221/68322 ,  Y10S156/932 ,  Y10T156/1983

摘要： A semiconductor chip-supply apparatus includes a sucking member, provided below an adhesive sheet, for sucking the adhesive sheet thereto, thus holding the adhesive sheet thereon. A semiconductor chip is bonded to an upper face of the adhesive sheet, which is positioned below the semiconductor chip. A push-up needle has a tip thereof positioned in a vicinity of a lower face of the adhesive sheet. A driving mechanism moves the sucking member and the adhesive sheet sucked thereto and held by the sucking member downward relatively to the push-up needle. A sucking collet for sucking and transporting the semiconductor chip separated from the adhesive sheet by a push-up operation of the push-up needle moves upward relatively to the sucking member and the adhesive sheet, the operation being caused by the downward movement of the sucking member and the adhesive sheet, which is caused by the driving mechanism.

摘要翻译： 半导体芯片供给装置包括设置在粘合片下方的吸附构件，用于将粘合片吸附到其上，从而将粘合片保持在其上。 将半导体芯片粘合到位于半导体芯片下方的粘合片的上表面。 上推针的顶端位于粘合片的下表面附近。 驱动机构使吸引部件和吸引到该吸附部件的粘合片相对于上推针移动。 用于通过上推针的上推操作从粘合片分离的半导体芯片的吸入和传送的吸入夹头相对于吸引部件和粘合片向上移动，该操作是由于吸入部件和粘合片的向下移动而引起的 构件和由驱动机构引起的粘合片。

公开(公告)号：US5582341A

公开(公告)日：1996-12-10

申请号：US496691

申请日：1995-06-29

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Ohnakada ,  Kenichi Nishino ,  Nobuhiko Muraoka

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Ohnakada ,  Kenichi Nishino ,  Nobuhiko Muraoka

IPC分类号： G02F1/1345 ,  B23K20/02 ,  G09F9/00 ,  H01L23/50 ,  B23K37/04

CPC分类号： B23K20/023

摘要： A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

摘要翻译： 提供一种端子部件接合装置，其具有用于支撑其上具有端子部件的板的支撑台。 具有加热器的压力工具以可移动的方式设置在工作台上方的垂直方向上，以便将端子部件以热和压力结合到板上。 沿着压力工具的下表面设置无震动片材，沿着无震动片材的下表面设置用于端子部件的按压板，并且由比无冲击片材的热膨胀系数低的板材制成。