-
公开(公告)号：US20190387147A1
公开(公告)日：2019-12-19
申请号：US16553112
申请日：2019-08-27
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG , Nan GUO
IPC分类号： H04N5/225 , H01L27/146 , H05K3/28
摘要： A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
-
42.发明申请公开(公告)号：US20190263040A1
公开(公告)日：2019-08-29
申请号：US16307926
申请日：2017-06-06
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
摘要： A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213). When a circuit board is mounted in the forming cavity (213), once a molding material (13) filled into the base forming guide groove (215) is solidified into form by undergoing a transition process from a liquid state to a solid state, a molded base (12) is formed at the position corresponding to the base forming guide groove (215), a through hole of the molded base (12) is formed at the position corresponding to the light window forming block (214), where the molded base (12) is integrally formed on the circuit board so as to form the molded circuit board (10) of the camera module (100). The through hole is used for providing the camera module (100) with an optical path. The molded base (12) can serve as a frame for the camera module (100).
-
43.发明申请公开(公告)号：US20190148429A1
公开(公告)日：2019-05-16
申请号：US16082533
申请日：2017-03-09
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhongyu LUAN , Zhenyu CHEN , Zhen HUANG
IPC分类号： H01L27/146 , H05K1/02 , H04N5/225 , H05K1/11
摘要： A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.
-
公开(公告)号：US20180352127A1
公开(公告)日：2018-12-06
申请号：US15780532
申请日：2015-12-01
发明人： Mingzhu WANG , Baozhong ZHANG , Zhenyu CHEN , Zhen HUANG , Heng JIANG
摘要： A photographing module and electric bracket thereof. The electric bracket can be made into any shape, having not only a function of a traditional base that supports a motor, but also serving to dispose a circuit, so as to ensure stability and security of a circuit of the photographing module. The electric bracket can also integrate therein a drive coil or an EMI shielding conductive layer, so as to reduce a material loss and manufacturing cost, while increasing reliability of shielding protection.
-
45.发明申请公开(公告)号：US20170244877A1
公开(公告)日：2017-08-24
申请号：US15460213
申请日：2017-03-15
发明人： Mingzhu WANG , Bojie ZHAO , Zhenyu CHEN , Takehiko TANAKA , Nan GUO , Zhen HUANG , Duanliang CHENG , Liang DING , Feifan CHEN , Heng JIANG
CPC分类号： H04N5/2258 , G02B3/0075 , G02B7/006 , H04N5/2254 , H04N5/2257 , H05K3/284 , H05K2201/10121 , H05K2203/1316 , H05K2203/1327
摘要： An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
-
公开(公告)号：US20170155807A1
公开(公告)日：2017-06-01
申请号：US15057074
申请日：2016-02-29
发明人： Baozhong ZHANG , Mingzhu WANG , Nan GUO , Zhen HUANG , Feifan CHEN , Yinhuan WANG , Bo PENG
IPC分类号： H04N5/225
CPC分类号： H04N5/2252 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H04N5/2253 , H01L2924/00014
摘要： A camera module includes an optical lens, a plurality of different camera components, and a plurality of connection elements pre-formed on at least one of the camera components for electrical connection. Each of the connection elements includes a first connection element formed on a surface of the camera component and a first conduction element electrically formed on the first connection element and protruded from the first connection element in order to electrically connect with other camera components.
-
公开(公告)号：US20240210811A1
公开(公告)日：2024-06-27
申请号：US18288707
申请日：2022-04-12
发明人： Bojie ZHAO , Linmin YE , Jiayao QUE , Zhen HUANG , Yinli FANG , Chao HONG , Qiang FU , Dongli YUAN
CPC分类号： G03B30/00 , G02B7/023 , G03B5/00 , G03B2205/0015 , G03B2205/0061
摘要： A camera module, including: a photosensitive assembly; a lens assembly held on a photosensitive path of the photosensitive assembly, wherein the lens assembly is provided with an optical axis; and a driving assembly, including a first carrying frame, a first driving element and a first prepressing component, wherein the photosensitive assembly is mounted to the first carrying frame, and the first driving element is designed as a piezoelectric actuator, and wherein the first driving element is frictionally coupled to the first carrying frame through the first prepressing component, and is configured to, after being driven, move in a two-dimensional trajectory in a plane perpendicular to the optical axis in a manner of bending vibration along two directions, and thereby drive the first carrying frame by friction to bring the photosensitive assembly to move in a first direction in the plane perpendicular to the optical axis for optical image stabilization.
-
公开(公告)号：US20240205547A1
公开(公告)日：2024-06-20
申请号：US18288230
申请日：2022-04-12
发明人： Bojie ZHAO , Linmin YE , Jiayao QUE , Yinli FANG , Zhen HUANG , Qiang FU , Chao HONG , Dongli YUAN
CPC分类号： H04N23/687 , H04N23/54 , H04N23/55
摘要： Disclosed is a camera module, which uses a new piezoelectric actuator as a driving element to meet the driving requirement of the camera module. Specifically, the camera module uses the new piezoelectric actuator as the driving element to move an optical camera lens for optical image stabilization. Moreover, the piezoelectric actuator is arranged in the camera module in a rational arrangement scheme, so as to meet both the structural design requirement and the dimensional design requirement of the camera module.
-
49.发明申请公开(公告)号：US20220375978A1
公开(公告)日：2022-11-24
申请号：US17678347
申请日：2022-02-23
发明人： Mingzhu WANG , Zhenyu CHEN , Nan GUO , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG , Zhongyu LUAN , Heng JIANG
IPC分类号： H01L27/146 , H04N5/225 , H01L23/00
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
-
公开(公告)号：US20220362978A1
公开(公告)日：2022-11-17
申请号：US17877391
申请日：2022-07-29
发明人： Takehiko TANAKA , Zhen HUANG , Bojie ZHAO , Zhewen MEl
IPC分类号： B29C45/26 , H04N5/225 , B29C45/14 , H05K3/28 , H01L21/56 , H01L33/00 , H01L27/146 , H01R43/24
摘要： A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.
-
-
-
-
-
-
-
-
-
搜索结果
62 条记录 (耗时 0.035 秒)
