Abstract:
There are provided a control signal generation circuit receiving an external instruction input in synchronization with a clock signal to generate a control signal for defining a data output period in response to the external instruction, and an output buffer circuit receiving data read from a memory array for output to an output node for the data output period, and there is further provided an output control circuit for controlling turning first, second and third transistors on and off, the output control circuit in the data out period turning on and off one of the first and second transistors complementarily in response to the read data and also turning on the third transistor in response to the control signal.
Abstract:
Pulses are generated using an edge of a clock signal applied from a low speed tester as a trigger, and internal clock signals are generated utilizing the pulses. Internal circuitry is operated in synchronization with the internal clock signals. Thus a synchronous semiconductor device operating at high speed can be tested using a low speed tester.
Abstract:
A semiconductor memory device is configured to include a static random access memory (SRAM) array and a dynamic random access memory (DRAM) array. The memory device includes an internal data line which enables the transfer of data blocks between the SRAM and DRAM arrays. Data transfer circuitry is provided separately from the internal data line and includes a latch circuit for latching the data to be transferred. The data transfer circuitry is responsive to a transfer designating signal.
Abstract:
A read enable signal OEMF activated in response to an input command is applied to an N minus 2 clock shift circuit included in an output control circuit for implementation of ZCAS latency. An output signal of the N minus 2 clock shift circuit and an internal mask instructing signal activated in response to an external mask instructing signal are logically processed and applied to a one-clock shift circuit. According to an output signal OEMQM of one-clock shift circuit, a data output enable signal OEM controlling activation/inactivation of an output buffer circuit is activated/inactivated. Data output controlling portion occupying area of a synchronous dynamic random access memory is reduced and timings of activation/inactivation of data output by different commands are made the same.
Abstract:
A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption. Since data writing path and data reading path are separately provided in the DRAM array, addresses to the DRAM array can be applied in non-multiplexed manner, so that data can be transferred at high speed from the DRAM array to the SRAM array, enabling high speed operation even at a cache miss.
Abstract:
In a synchronous dynamic random access memory (SDRAM), one bank A is divided into banks A0 and A1, and two sets of writing-related circuits are arranged corresponding to each memory cell array bank and are capable of performing writing operation substantially independently. The first and second bits of write data applied successively from the outside world are applied alternately to write registers. Since the I/O line pair is connected to the selected memory cells in respective memory cell array banks after incorporation of the second bit data to be written is completed, the potential levels of the corresponding I/O line pair always change to the corresponding potential levels from the initial state in writing the first and second bit data.
Abstract:
Memory arrays are divided into banks which can be operated independent from each other. Read data storing registers and write data storing registers operating independent from each other are provided for the banks. The memory array is divided into a plurality of small array blocks, local IO lines are arranged corresponding to each array block, and the local IO lines are connected to global IO lines. The global IO lines are connected to preamplifier groups and to write buffer groups. By control signal generating circuits and by a register control circuit, inhibition of writing of a desired bit only during successive writing operation can be done, data can be collectively written to the selected memory cells when the final data is input if the data writing should be stopped before reaching the wrap length in successive writing, and the timing for activating the memory array when the write cycle should be repeatedly carried out can be delayed. A synchronous semiconductor memory device having small chip area, high speed of operation, low power consumption and multiple functions is provided.
Abstract:
A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption. Since data writing path and data reading path are separately provided in the DRAM array, addresses to the DRAM array can be applied in non-multiplexed manner, so that data can be transferred at high speed from the DRAM array to the SRAM array, enabling high speed operation even at a cache miss.
Abstract:
A semiconductor memory device containing a cache includes a static random access memory (SRAM) as a cache memory, and a dynamic random access memory (DRAM) as a main memory. Collective transfer of data blocks is possible between the DRAM and the SRAM through a bi-directional data transfer gate circuit and through an internal data line. A DRAM row decoder and a DRAM column decoder are provided in the DRAM. A SRAM row decoder and an SRAM column decoder are provided in the SRAM. Addresses of the SRAM and DRAM can be independently applied. The data transfer gate includes a latch circuit for latching data from the SRAM, which serves as a high speed memory, an amplifier circuit and a gate circuit for amplifying data from the DRAM, which serves as a large capacity memory, and for transmitting the amplified data to the SRAM, and a gate circuit, responsive to a DRAM write enable signal for transmitting write data to corresponding memory cells of the DRAM. After the data of the SRAM has been latched by a latch circuit, write data is transmitted from the gate circuit to the DRAM, and the write data is transmitted to the SRAM through the amplifier circuit and the gate circuit.
Abstract:
Memory arrays are divided into banks which can be operated independent from each other. Read data storing registers and write data storing registers operating independent from each other are provided for the banks. The memory array is divided into a plurality of small array blocks, local IO lines are arranged corresponding to each array block, and the local IO lines are connected to global IO lines. The global IO lines are connected to preamplifier groups and to write buffer groups. By control signal generating circuits and by a register control circuit, inhibition of writing of a desired bit only during successive writing operation can be done, data can be collectively written to the selected memory cells when the final data is input if the data writing should be stopped before reaching the wrap length in successive writing, and the timing for activating the memory array when the write cycle should be repeatedly carried out can be delayed. A synchronous semiconductor memory device having small chip area, high speed of operation, low power consumption and multiple functions is provided.