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公开(公告)号：US20230164488A1
公开(公告)日：2023-05-25
申请号：US18094596
申请日：2023-01-09
Applicant: APPLE INC.
Inventor： Brett W. Degner , Michael E. Leclerc , David H. Narajowski , Kristopher P. Laurent , William K. Smith , Christopher J. Stringer , Daniele De Iuliis , Markus Diebel , Sung-Ho Tan
CPC classification number: H04R5/0335 , H04R1/1041 , H04R1/1008 , H04R2420/07
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US20210168506A1
公开(公告)日：2021-06-03
申请号：US17177063
申请日：2021-02-16
Applicant: Apple Inc.
Inventor： Brett W. Degner , Michael E. Leclerc , David H. Narajowski , Kristopher P. Laurent , William K. Smith , Christopher J. Stringer , Daniele de Iuliis , Markus Diebel , Sung-Ho Tan
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10945076B2
公开(公告)日：2021-03-09
申请号：US16362404
申请日：2019-03-22
Applicant: Apple Inc.
Inventor： Brett W. Degner , Michael E. Leclerc , David H. Narajowski , Kristopher P. Laurent , William K. Smith , Christopher J. Stringer , Daniele De Iuliis , Markus Diebel , Sung-Ho Tan
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10725507B2
公开(公告)日：2020-07-28
申请号：US16377155
申请日：2019-04-06
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: G06F1/16 , G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20200014144A1
公开(公告)日：2020-01-09
申请号：US16512211
申请日：2019-07-15
Applicant: Apple Inc.
Inventor： Brett W. Degner , Bradley J. Hamel , Christopher J. Stringer , Christiaan A. Ligtenberg , David H. Narajowski , Kristopher P. Laurent , Mahmoud R. Amini , Michael E. Leclerc
Abstract: Connector inserts and connector receptacles that have a small form factor, readily mate when brought into proximity to each other, and disconnect when subjected to a non-axial force.
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Patent Agency Ranking
公开(公告)号：US20190222913A1
公开(公告)日：2019-07-18
申请号：US16362399
申请日：2019-03-22
Applicant: Apple Inc.
Inventor： Michael E. Leclerc , Brett W. Degner , David H. Narajowski , Kristopher P. Laurent , Daniel R. Bloom , Daniele de Iuliis , Christopher J. Stringer , Sung-Ho Tan , Markus Diebel
IPC: H04R1/10
CPC classification number: H04R1/105 , H04R1/1008 , H04R1/1075
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10355402B2
公开(公告)日：2019-07-16
申请号：US15720165
申请日：2017-09-29
Applicant: Apple Inc.
Inventor： Brett W. Degner , Bradley J. Hamel , Christopher J. Stringer , Christiaan A. Ligtenberg , David H. Narajowski , Kristopher P. Laurent , Mahmoud R. Amini , Michael E. Leclerc
Abstract: Connector inserts and connector receptacles that have a small form factor, readily mate when brought into proximity to each other, and disconnect when subjected to a non-axial force.
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公开(公告)号：US20160282913A1
公开(公告)日：2016-09-29
申请号：US15173377
申请日：2016-06-03
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
Abstract translation: 描述了一种用于圆柱形紧凑计算系统的内部部件和外部接口装置，其包括至少具有三角形形状的结构散热器，该散热器设置在由圆柱形壳体限定的圆柱形容积内。 具有大致三角形状的计算引擎被描述为具有包括图形处理单元（GPU）板，中央处理单元（CPU）板，输入/输出（I / O）接口板，互连板和 电源单元（PSU）。
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公开(公告)号：US20140361893A1
公开(公告)日：2014-12-11
申请号：US14297573
申请日：2014-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
Abstract translation: 描述了一种用于圆柱形紧凑计算系统的内部部件和外部接口装置，其包括至少具有三角形形状的结构散热器，该散热器设置在由圆柱形壳体限定的圆柱形容积内。 具有大致三角形状的计算引擎被描述为具有包括图形处理单元（GPU）板，中央处理单元（CPU）板，输入/输出（I / O）接口板，互连板和 电源单元（PSU）。
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公开(公告)号：US20240094765A1
公开(公告)日：2024-03-21
申请号：US18370298
申请日：2023-09-19
Applicant: Apple Inc.
Inventor： Michael E. Leclerc , Simon J. Trivett , Lauren M. Farrell , Nicholas A. Rundle
IPC: G06F1/16
CPC classification number: G06F1/1616 , G06F1/1643 , G06F1/1686
Abstract: A laptop computer may include a base portion including a keyboard, and a display portion flexibly coupled to the base portion. The display portion may include a housing component formed of metal and defining a set of side surfaces, a front cover assembly coupled to the housing component and including a first glass member defining at least a portion of a front exterior surface of the display portion, and a display coupled to the first glass member, and a rear cover assembly coupled to the housing component and including a second glass member defining at least a portion of a rear exterior surface of the display portion.
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