公开(公告)号：US20050161605A1

公开(公告)日：2005-07-28

申请号：US11019261

申请日：2004-12-23

申请人： Hisanori Yokura ,  Yasutoshi Suzuki ,  Takahiko Yoshida

发明人： Hisanori Yokura ,  Yasutoshi Suzuki ,  Takahiko Yoshida

IPC分类号： G01J1/02 ,  G01N21/03 ,  G01N21/35 ,  G01N21/3504 ,  H01L27/14 ,  H01L27/144

CPC分类号： G01N21/3504 ,  G01N21/0303

摘要： An infrared gas sensor includes: an infrared light source having a resistor for emitting an infrared light by heating the resistor; an infrared light sensor having a detection device for generating an electric signal in accordance with a temperature change of the detection device corresponding to the infrared light in a case where the sensor receives the infrared light; a reflection member for reflecting the infrared light emitted from the light source to introduce the infrared light to the sensor; a casing for accommodating the light source, the light sensor, and the reflection member; and a substrate. The reflection member faces the light source. The resistor and the detection device are disposed on the substrate.

摘要翻译： 红外线气体传感器包括：红外光源，具有通过加热电阻器来发射红外光的电阻器; 红外光传感器，具有检测装置，用于在传感器接收到红外光的情况下，根据与红外光对应的检测装置的温度变化产生电信号; 用于反射从光源发射的红外光以将红外光引入传感器的反射构件; 用于容纳光源的壳体，光传感器和反射构件; 和基材。 反射构件面向光源。 电阻器和检测装置设置在基板上。

公开(公告)号：US06802222B2

公开(公告)日：2004-10-12

申请号：US10142162

申请日：2002-05-10

申请人： Seiichiro Ishio ,  Yasutoshi Suzuki ,  Keiichi Shimaoka ,  Hirofumi Funahashi

发明人： Seiichiro Ishio ,  Yasutoshi Suzuki ,  Keiichi Shimaoka ,  Hirofumi Funahashi

IPC分类号： G01L912

CPC分类号： G01L9/0073

摘要： A diaphragm-type semiconductor device includes a semiconductor substrate, a surface of which is substantially flat, a diaphragm, which covers a circular pressure reference space located on the surface, and a circular electrode layer, a middle part of which is embedded in the diaphragm. The electrode layer is larger than the space and is coaxial with the space. Therefore, internal stress is balanced between inner and outer sides of the diaphragm, and a step formed at the outer edge of the top electrode layer is separated from the diaphragm. The device also includes a step adjuster around the space on the surface. Therefore, another step formed at the outer edge of the space disappears, and a new step is formed separately from the diaphragm at the outer edge of the step adjuster. With this structure, the diaphragm has a desired flatness.

摘要翻译： 膜片型半导体器件包括其表面基本平坦的半导体衬底，覆盖位于表面上的圆形基准空间的膜片和圆形电极层，其中间部分嵌入隔膜 。 电极层比空间大，与空间同轴。 因此，内部应力在隔膜的内侧和外侧之间平衡，并且形成在顶部电极层的外边缘处的台阶与隔膜分离。 该装置还包括在表面上的空间周围的台阶调节器。 因此，形成在空间的外边缘的另一台阶消失，并且在台阶调节器的外边缘处与隔膜分开形成新的台阶。 通过这种结构，隔膜具有期望的平坦度。

公开(公告)号：US06658948B2

公开(公告)日：2003-12-09

申请号：US10053705

申请日：2002-01-24

申请人： Shinji Yoshihara ,  Yasutoshi Suzuki

发明人： Shinji Yoshihara ,  Yasutoshi Suzuki

IPC分类号： G01L122

CPC分类号： G01L9/06 ,  G01L9/0054

摘要： A bridge circuit includes four gage resistors. Each gage resistor is divided into two division gage resistors. A couple of division gage resistors. The junction points between division gage resistors outputting the same potential when no pressure is applied are used for diagnostic. Four gage resistors out of the eight gage resistors are arranged near the center of diaphragm 14, and the other four division resistors are arranged near the peripheral edge portion of the diaphragm 14 to make the stress distribution even.

摘要翻译： 桥接电路包括四个量规电阻。 每个量规电阻分为两个分压计电阻。 一对分压计电阻。 在不施加压力时输出相同电位的分压计电阻之间的接点用于诊断。 八个量具电阻器中的四个量规电阻器布置在隔膜14的中心附近，另外四个除法电阻器布置在隔膜14的周缘部分附近，使应力分布均匀。

公开(公告)号：US06653702B2

公开(公告)日：2003-11-25

申请号：US09866752

申请日：2001-05-30

申请人： Seiichiro Ishio ,  Inao Toyoda ,  Kazuaki Hamamoto ,  Yasutoshi Suzuki

发明人： Seiichiro Ishio ,  Inao Toyoda ,  Kazuaki Hamamoto ,  Yasutoshi Suzuki

IPC分类号： H01L2982

CPC分类号： H01L27/1203 ,  B81B2201/0264 ,  B81C1/00246 ,  B81C2203/0778 ,  G01L9/0054 ,  G01L9/06 ,  H01L21/84

摘要： A semiconductor pressure sensor includes a SOI substrate composed of first and second silicon substrates. A diaphragm portion is formed by the first silicon substrate as a bottom of a recess portion formed in the second silicon substrate. Strain gauges are formed on the diaphragm portion, and a circuit portion is formed on the first silicon substrate at a region other than the diaphragm portion. A LOCOS film for isolating the strain gauges from the circuit portion is formed on the first silicon substrate outside the outermost peripheral portion of the diaphragm portion.

摘要翻译： 半导体压力传感器包括由第一和第二硅衬底构成的SOI衬底。 隔膜部分由第一硅衬底形成为形成在第二硅衬底中的凹部的底部。 应变计形成在隔膜部分上，并且电路部分在隔膜部分以外的区域形成在第一硅衬底上。 在隔膜部分的最外周部分的外侧的第一硅基板上形成用于将应变计与电路部分隔离的LOCOS膜。

公开(公告)号：US06640643B2

公开(公告)日：2003-11-04

申请号：US10196210

申请日：2002-07-17

申请人： Seiichiro Ishio ,  Yasutoshi Suzuki ,  Keiichi Shimaoka ,  Hirofumi Funabashi

发明人： Seiichiro Ishio ,  Yasutoshi Suzuki ,  Keiichi Shimaoka ,  Hirofumi Funabashi

IPC分类号： G01L912

CPC分类号： G01L9/0042 ,  G01L9/0073

摘要： On a substrate, first and second capacitive portions are formed to have movable diaphragms having different areas for pressure measurement and diagnostic, wherein a communication structure is provided between the cavity spaces of the first and second capacitive portions to equalize the pressure in the first capacitive space to that of the second capacitive space. The different sizes provide different sensitivity for efficient diagnostic. The first and second capacitive portions can be made in one diaphragm, wherein the second capacitive portion is formed around the first capacitive portion. The cavity spaces of the first and second capacitive portions are connected. Moreover, between the first and second capacitive spaces, an insulation portion may be formed in a ring shape to support the diaphragm portion of the first capacitive portion and the diaphragm portion the second capacitive portion with communication portions.

摘要翻译： 在基板上，第一和第二电容部分形成为具有用于压力测量和诊断的不同区域的可移动隔膜，其中在第一和第二电容部分的空腔之间设置有连通结构，以使第一电容空间 到第二电容空间。 不同的尺寸为有效的诊断提供不同的灵敏度。 第一和第二电容部分可以制成在一个隔膜中，其中第二电容部分围绕第一电容部分形成。 连接第一和第二电容部分的空腔。 此外，在第一和第二电容空间之间，绝缘部分可以形成为环形，以将第一电容部分的隔膜部分和隔膜部分支撑为具有连通部分的第二电容部分。

公开(公告)号：US06595067B2

公开(公告)日：2003-07-22

申请号：US10091476

申请日：2002-03-07

申请人： Yasutoshi Suzuki ,  Hiroaki Tanaka

发明人： Yasutoshi Suzuki ,  Hiroaki Tanaka

IPC分类号： G01L916

CPC分类号： G01L19/147 ,  G01L9/0042 ,  G01L9/0055

摘要： In a pressure sensor made by bonding a sensor chip and a metal stem together with a resin adhesive, fluctuation of the sensor output caused by temperature changes are maximally reduced. The resin adhesive for bonding together the sensor element and the metal stem has a creep characteristic defined as CR=A×&sgr;B between its creep rate CR and stress &sgr; upon it with A and B being constants. The resin adhesive is selected to satisfy that the constant B is not greater than 3.5.

公开(公告)号：US06550339B1

公开(公告)日：2003-04-22

申请号：US09562134

申请日：2000-05-01

申请人： Inao Toyoda ,  Yasutoshi Suzuki

发明人： Inao Toyoda ,  Yasutoshi Suzuki

IPC分类号： G01L1500

CPC分类号： G01L19/147 ,  G01L15/00 ,  G01L19/146 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A pressure sensor has two sensor elements respectively disposed in different pressure spaces A and B. Each of the sensor elements has a semiconductor substrate having a pressure reference chamber therein, a diaphragm formed as a wall defining the pressure reference chamber, and gauges for converting deformation of the diaphragm into an electric signal. The two sensor elements overlap with each other at sides opposite to the respective diaphragms, and close a hole formed in a partition member partitioning the two pressure spaces A and B. A differential pressure between the pressure spaces A and B is detected as a relative pressure by a difference between outputs from the two sensor elements.

摘要翻译： 压力传感器具有分别设置在不同的压力空间A和B中的两个传感器元件。每个传感器元件具有其中具有压力参考室的半导体衬底，形成为限定压力参考室的壁的膜片，以及用于转换变形 的隔膜变成电信号。 两个传感器元件在与各个隔膜相对的侧面彼此重叠，并且封闭形成在分隔两个压力空间A和B的分隔件中的孔。压力空间A和B之间的压差被检测为相对压力 通过两个传感器元件的输出之间的差异。

公开(公告)号：US06422088B1

公开(公告)日：2002-07-23

申请号：US09666085

申请日：2000-09-21

申请人： Nobukazu Oba ,  Yoshifumi Murakami ,  Yukihiko Tanizawa ,  Hiroaki Tanaka ,  Seiichiro Ishio ,  Inao Toyoda ,  Yasutoshi Suzuki

发明人： Nobukazu Oba ,  Yoshifumi Murakami ,  Yukihiko Tanizawa ,  Hiroaki Tanaka ,  Seiichiro Ishio ,  Inao Toyoda ,  Yasutoshi Suzuki

IPC分类号： G01L900

CPC分类号： G01L27/007 ,  G01D3/08 ,  G01L9/0054 ,  G01L9/02 ,  G01R17/10

摘要： A reference voltage generating circuit is constituted by resistors RE and RF each having a resistance not influenced by an application of pressure. The reference voltage generating circuit is connected between one and the other ends of a bridge circuit. A failure judgement of the bridge circuit is performed based on a comparison of a voltage difference VBC between two midpoints B and C of the bridge circuit and voltage differences VCE and VBE between a reference voltage level of the reference voltage generating circuit and the voltage levels of two midpoints B and C.

摘要翻译： 参考电压发生电路由电阻器RE和RF构成，每个电阻器不受施加压力的影响。 参考电压产生电路连接在桥接电路的一端和另一端之间。 基于桥电路的两个中点B和C之间的电压差VBC与参考电压产生电路的参考电压电平之间的电压差VCE和VBE的比较，执行桥电路的故障判断， 两个中点B和C.

公开(公告)号：US06169316A

公开(公告)日：2001-01-02

申请号：US09287012

申请日：1999-04-06

申请人： Minekazu Sakai ,  Yasutoshi Suzuki

发明人： Minekazu Sakai ,  Yasutoshi Suzuki

IPC分类号： H01L2982

CPC分类号： G01L19/146 ,  G01L19/147

摘要： In a semiconductor pressure sensor, adhesive having a Young's modulus of equal to or less than 1×104 Pa such as silicone system gel is disposed between a bottom wall of a casing and a bottom wall of a sensor chip, and a space between side walls of the sensor chip and side walls of the casing is filled with adhesive having a Young's modulus of equal to or larger than 1×104 Pa, such as silicone system adhesive or epoxy system adhesive. Accordingly, temperature characteristics of the sensor chip can be improved without causing pressure leakage.

摘要翻译： 在半导体压力传感器中，在壳体的底壁和传感器芯片的底壁之间设置有等于或小于1×10 4 Pa的杨氏模量的粘合剂，例如硅酮体系凝胶，并且在侧壁之间的空间 传感器芯片和壳体的侧壁填充有杨氏模量等于或大于1×10 4 Pa的粘合剂，例如硅氧烷系粘合剂或环氧树脂体系粘合剂。 因此，可以提高传感器芯片的温度特性，而不会引起压力泄漏。

公开(公告)号：US5864064A

公开(公告)日：1999-01-26

申请号：US717405

申请日：1996-09-20

申请人： Kazuhiko Kano ,  Yoshinori Ohtsuka ,  Norio Kitao ,  Kenichi Ao ,  Yasutoshi Suzuki

发明人： Kazuhiko Kano ,  Yoshinori Ohtsuka ,  Norio Kitao ,  Kenichi Ao ,  Yasutoshi Suzuki

IPC分类号： G01P15/00 ,  G01H1/00 ,  G01P15/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/135 ,  G01P15/18

CPC分类号： G01P15/125 ,  G01P15/0802 ,  G01P15/135 ,  G01P15/18

摘要： An acceleration sensor is constructed by a substrate, a cylindrical dead-weight movable electrode to be displaced by acceleration, a fixed electrode from the inside of which a cylinder is hollowed, a cylindrical anchor arranged on the substrate for supporting the dead-weight movable electrode with elastic transformable structural material and beams. When acceleration is applied from the outside, the cylindrical detecting face of the dead-weight movable electrode and the cylindrical detected face of the fixed electrode are in contact on a two-dimensional plane parallel to the substrate and the acceleration sensor detects the contact. A radial interval between the detecting face of the dead-weight movable electrode and the detected face of the fixed electrode is set in view of the elastic modulus of the beams so that external force can be detected isotropically and the acceleration sensor detects acceleration on a two-dimensional plane nondirectionally.

摘要翻译： 一个加速度传感器是由一个基板，一个被加速移位的一个圆柱形的自重的可移动电极构成的，一个固定的电极从一个圆柱体中空的一个固定的电极，一个设置在基板上的圆柱形的锚固件，用于支撑自重的可动电极 具有弹性可变形结构材料和梁。 当从外部施加加速度时，固定电极的圆柱形检测面和固定电极的圆柱形检测面在与基板平行的二维平面上接触，并且加速度传感器检测接触。 考虑到光束的弹性模量，设定了自重移动电极的检测面与固定电极的检测面之间的径向间隔，从而可以各向异性地检测外力，并且加速度传感器检测到二次加速度 非定向平面。