公开(公告)号：US20220294179A1

公开(公告)日：2022-09-15

申请号：US17636421

申请日：2020-07-20

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Kiyohisa SAKAI ,  Hirohisa YASUKAWA ,  Nobuaki KAJI

IPC分类号： H01S5/0225 ,  H01S5/042 ,  H01S5/0233 ,  H01S5/02218 ,  H01S5/00 ,  H01S5/024

摘要： An object of the present technique is to improve safety in a semiconductor laser driving apparatus that diffuses laser light by a diffusion plate. A substrate incorporates a laser driver, and a semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A diffusion plate diffuses laser light irradiated by the semiconductor laser. A transparent conductive film is formed on a predetermined surface of the diffusion plate. In addition, the laser driver drives the semiconductor laser to irradiate the laser light on the basis of an electric characteristic value of the conductive film.

公开(公告)号：US20220285911A1

公开(公告)日：2022-09-08

申请号：US17597426

申请日：2020-07-02

申请人： ROHM CO., LTD.

发明人： Atsushi YAMAGUCHI ,  Koki SAKAMOTO

IPC分类号： H01S5/042 ,  H01S5/0233

摘要： This semiconductor laser device comprises: a semiconductor laser element; a switching element connected in series to the semiconductor laser element, the switching element having a gate electrode, a drain electrode, and a source electrode; capacitors connected in parallel to the semiconductor laser element and the switching element; first drive electroconductive parts to which first terminals of the capacitors are connected; a second drive electroconductive part positioned apart from the first drive electroconductive parts; first drive connection members that connect the first drive electroconductive parts and the source electrode; and a second drive connection member that connects the second drive electroconductive part and the source electrode.

公开(公告)号：US11418003B2

公开(公告)日：2022-08-16

申请号：US16533714

申请日：2019-08-06

申请人： FINISAR CORPORATION

发明人： Jianwei Mu ,  Frank Lei Ding ,  Tao Wu ,  Hongyu Deng ,  Maziar Amirkiai

IPC分类号： H01S5/02325 ,  H01L23/498 ,  H01S5/024 ,  H01L23/34 ,  H01L21/48 ,  H01S5/0233 ,  H01S5/0235

摘要： A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.

公开(公告)号：US20220197123A1

公开(公告)日：2022-06-23

申请号：US17129979

申请日：2020-12-22

申请人： OSRAM Opto Semiconductors GmbH

发明人： Jörg Erich SORG ,  Nicole BERNER

IPC分类号： G03B21/20 ,  H01S5/40 ,  F21V8/00 ,  H01S5/0233 ,  H01S5/22 ,  H01S5/0237

摘要： The invention relates to a laser projection arrangement. The arrangement includes a sub-mount carrier with a main surface and at least one edge-emitting laser arranged on the sub-mount. The at least one edge-emitting laser is facing the sub-mount and includes at least one laser facet that is located at a predefined distance from the main surface of the sub-mount. A planar light circuit with at least one light guide has an inlet and is arranged on the sub-mount such that the at least one light guide and the inlet is located at the predefined distance from the main surface of the sub-mount facing the at least one laser facet.

公开(公告)号：US11289875B2

公开(公告)日：2022-03-29

申请号：US16693365

申请日：2019-11-24

申请人： Applied Optoelectronics, Inc.

发明人： Kai-Sheng Lin ,  Hang Xie ,  Ming Qi

IPC分类号： H01S5/0233 ,  H01S5/02212 ,  H04B10/40 ,  H01S5/024 ,  H01S5/023 ,  H01S5/0235 ,  F21V8/00

摘要： In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.

公开(公告)号：US11081858B2

公开(公告)日：2021-08-03

申请号：US15928229

申请日：2018-03-22

申请人： Lumentum Japan, Inc.

发明人： Shunya Yamauchi ,  Yoshihiro Nakai ,  Takayuki Nakajima ,  Masahiro Ebisu

IPC分类号： H01S5/024 ,  H01S5/06 ,  H01S5/068 ,  H01S5/026 ,  H01S5/042 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H04B10/40 ,  H01S5/12 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/02251 ,  H01S5/02325 ,  H01S5/02345

摘要： An optical transmitter module includes optical semiconductor devices including a first optical semiconductor device, a temperature adjustment means for collectively performing temperature adjustment on the optical semiconductor devices, and a first thermal resistor that is disposed between the first optical semiconductor device and the temperature adjustment means, in which, when the temperature adjustment means is driven, the temperature of the first optical semiconductor device is higher than temperatures of other optical semiconductor devices which are different from the first optical semiconductor device.

公开(公告)号：US10992102B2

公开(公告)日：2021-04-27

申请号：US16100722

申请日：2018-08-10

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Ryuichiro Minato ,  Yutaka Ohki

IPC分类号： H01S5/022 ,  H01S5/023 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02325 ,  H01S5/02216 ,  H01S5/02251 ,  H01S5/30

摘要： A submount on which a semiconductor device is mounted and which is mounted on a base made of metal, the submount including: a substrate; a first coating layer formed on a first surface of the substrate and made of a material having a higher coefficient of thermal expansion than that of the substrate; and a second coating layer formed on a second surface, positioned on a side opposite to the first surface, of the substrate and made of a material having a higher coefficient of thermal expansion than that of the substrate, in which a coating area of the second coating layer is smaller than a coating area of the first coating layer.

公开(公告)号：US12107387B2

公开(公告)日：2024-10-01

申请号：US17266926

申请日：2018-08-22

申请人： Shenzhen Raysees AI Technology Co. Ltd.

发明人： Yang Wang

IPC分类号： H01S3/04 ,  H01S5/02234 ,  H01S5/0225 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/02335 ,  H01S5/0234 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/024 ,  H01S5/183 ,  H01S5/42 ,  H01S5/02253

CPC分类号： H01S5/02469 ,  H01S5/02234 ,  H01S5/0225 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/02335 ,  H01S5/0234 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/18305 ,  H01S5/423 ,  H01S5/02253 ,  H01S5/183

摘要： A Vertical Cavity Surface Emitting Laser (VCSEL) array package includes a VCSEL array chip bonded on a substrate, a support structure surrounding the VCSEL array chip, and an optical component mounted on the support structure. The support structure is molded directly on the substrate using a high thermal conductivity molding material. The support structure covers all side surfaces of the VCSEL array chip to facilitate heat transfer through the chip's sides. A transparent layer is deposited on the output surface of the VCSEL array chip, which prevents the support structure from blocking an output beam during molding.

公开(公告)号：US12046868B2

公开(公告)日：2024-07-23

申请号：US16977901

申请日：2019-03-06

申请人： KYOCERA Corporation

发明人： Youji Furukubo ,  Masanori Annoura ,  Takeshi Kawakami

IPC分类号： H01S5/023 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/0235

CPC分类号： H01S5/023 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/0235

摘要： A substrate for mounting a light-emitting element includes a substrate that is composed of a ceramic(s), a terminal for an element that is provided on a front surface of the substrate where a light-emitting element is mounted thereon, a terminal for a power source that is provided on the substrate where an external power source is connected thereto, and a wiring part that is provided inside the substrate and electrically connects the terminal for an element and the terminal for a power source. Furthermore, the wiring part includes a first conductor that extends in a surface direction of the substrate and a second conductor that extends substantially parallel to the first conductor on an opposite side of the front surface and is connected in parallel with the first conductor.

公开(公告)号：US20240222940A1

公开(公告)日：2024-07-04

申请号：US18608437

申请日：2024-03-18

申请人： NICHIA CORPORATION

发明人： Kazuma KOZURU ,  Takuya HASHIMOTO

IPC分类号： H01S5/40 ,  G03B21/20 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

CPC分类号： H01S5/4087 ,  G03B21/2013 ,  G03B21/2033 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/4093 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

摘要： A light emitting module includes two light emitting devices, each including: a package, a plurality of semiconductor laser elements mounted in the package, and one or more light-reflective members, mounted in the package and reflecting laser light emitted from the plurality of laser elements; and a mounting substrate having a mounting surface on which the two light emitting devices are mounted. The two light emitting devices are mounted on the mounting surface of the mounting substrate with an orientation different from each other by 180 degrees.