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公开(公告)号：US08636403B2
公开(公告)日：2014-01-28
申请号：US12522666
申请日：2008-02-15
Applicant: Frédéric Maier , Stéphane Von Gunten , Sylvain Jeanneret
Inventor： Frédéric Maier , Stéphane Von Gunten , Sylvain Jeanneret
CPC classification number: G04D3/00 , B81B2201/035 , B81C99/0085 , B81C99/0095 , G04B5/165 , G04B13/02 , G04B13/022 , G04B13/026 , G04B17/063 , G04D3/0069 , G04F7/08 , Y10T29/49579 , Y10T29/49581
Abstract: A timepiece component, such as a balance, an oscillating mass or a wheel, having a structure made according to a micro-manufacturing technique, such as the DRIE technique. The component has at least one member formed in or at the periphery of the structure and made of a material different from that of the structure. This member is typically metal and is formed by electro-forming using a cavity of the structure as a mold.
Abstract translation: 具有根据微型制造技术制成的结构的诸如平衡物，振动块或轮的钟表部件，例如DRIE技术。 该部件具有至少一个构件，其形成在结构的外周或其周边，并且由与结构不同的材料制成。 该构件通常是金属，并且通过使用结构的空腔作为模具进行电成型而形成。
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公开(公告)号：US08398865B2
公开(公告)日：2013-03-19
申请号：US12501009
申请日：2009-07-10
Applicant: Rudolf Dinger , Thierry Ravenel
Inventor： Rudolf Dinger , Thierry Ravenel
IPC: C23F1/00
CPC classification number: B81C99/008 , B81B2201/035 , B81C1/00674 , B81C2201/112 , G04B13/02 , G04D3/0069 , Y10T29/49579
Abstract: A method of manufacturing a mechanical part includes the steps of providing a micro-machinable substrate; etching a pattern which includes the part through the entire substrate using photolithography; mounting the etched substrate on a support so as to leave the top and bottom surfaces of said substrate accessible for coating; depositing a tribological quality improving coating of on the outer surface of the part; and releasing the part from the substrate.
Abstract translation: 制造机械部件的方法包括提供可微加工的基板的步骤; 使用光刻法蚀刻通过整个基板包括该部分的图案; 将蚀刻的基板安装在支撑件上，以便使所述基板的顶表面和底表面可接近以进行涂覆; 在部件的外表面上沉积摩擦学质量改进涂层; 并从基底释放该部分。
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公开(公告)号：US20130029157A1
公开(公告)日：2013-01-31
申请号：US13386049
申请日：2010-07-20
Applicant: Nakis Karapatis
Inventor： Nakis Karapatis
CPC classification number: B81C1/00682 , B81B2201/035 , B81C1/00674 , B81C2201/0178 , Y10T29/49986
Abstract: A method of fabricating a reinforced silicon micromechanical part includes: micromachining the part, or a batch of parts in a silicon wafer; forming a silicon dioxide layer over the entire surface of the part, in one or plural operations, so as to obtain a thickness of silicon dioxide that is at least five times greater than the thickness of native silicon dioxide; and removing the silicon dioxide layer by etching.
Abstract translation: 制造增强硅微机械部件的方法包括：在硅晶片中微加工所述部件或一批部件; 在一个或多个操作中在整个表面上形成二氧化硅层，以获得比天然二氧化硅的厚度大至少五倍的二氧化硅的厚度; 并通过蚀刻去除二氧化硅层。
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34.发明申请公开(公告)号：US20110303546A1
公开(公告)日：2011-12-15
申请号：US13212636
申请日：2011-08-18
Applicant: Clément SAUCY
Inventor： Clément SAUCY
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
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35.发明授权Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained 有权在LIGA技术中制造单层或多层金属结构的方法和获得的结构公开(公告)号：US08025782B2
公开(公告)日：2011-09-27
申请号：US11717773
申请日：2007-03-14
Applicant: Clément Saucy
Inventor： Clément Saucy
IPC: C25D1/00
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。
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Patent Agency Ranking
36.发明申请PROCESS FOR FABRICATING A MONOLAYER OR MULTILAYER METAL STRUCTURE IN LIGA TECHNOLOGY, AND STRUCTURE OBTAINED 有权在LIGA技术中制造单层或多层金属结构的方法和获得的结构公开(公告)号：US20110062112A1
公开(公告)日：2011-03-17
申请号：US12952825
申请日：2010-11-23
Applicant: Clément SAUCY
Inventor： Clément SAUCY
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。
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37.发明申请Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained 有权在LIGA技术中制造单层或多层金属结构的方法和获得的结构公开(公告)号：US20070227893A1
公开(公告)日：2007-10-04
申请号：US11717773
申请日：2007-03-14
Applicant: Clement Saucy
Inventor： Clement Saucy
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。
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公开(公告)号：US20070065595A1
公开(公告)日：2007-03-22
申请号：US11601780
申请日：2006-11-20
Applicant: Takayuki Yamada , Mutsuya Takahashi , Masaki Nagata
Inventor： Takayuki Yamada , Mutsuya Takahashi , Masaki Nagata
IPC: C23C14/02
CPC classification number: B81C99/008 , B29C64/00 , B33Y10/00 , B33Y30/00 , B81B2201/035 , B81C2201/0197 , Y10T156/12 , Y10T156/13 , Y10T156/14 , Y10T428/24355
Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.
Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。
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公开(公告)号：US20010023010A1
公开(公告)日：2001-09-20
申请号：US09791634
申请日：2001-02-26
Applicant: Fuji Xerox Co. Ltd.
Inventor： Takayuki Yamada , Mutsuya Takahashi , Masaki Nagata
IPC: B44C001/22 , C03C015/00 , B32B001/00
CPC classification number: B81C99/008 , B29C64/00 , B33Y10/00 , B33Y30/00 , B81B2201/035 , B81C2201/0197 , Y10T156/12 , Y10T156/13 , Y10T156/14 , Y10T428/24355
Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.
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40.发明授权
公开(公告)号：US6082208A
公开(公告)日：2000-07-04
申请号：US53569
申请日：1998-04-01
Applicant: M. Steven Rodgers , Jeffry J. Sniegowski , Samuel L. Miller , Paul J. McWhorter
Inventor： M. Steven Rodgers , Jeffry J. Sniegowski , Samuel L. Miller , Paul J. McWhorter
CPC classification number: B81C1/00198 , F16H19/00 , B81B2201/035 , B81B2203/06 , Y10S310/06 , Y10T74/19614 , Y10T74/19619
Abstract: A process for forming complex microelectromechanical (MEM) devices having five layers or levels of polysilicon, including four structural polysilicon layers wherein mechanical elements can be formed, and an underlying polysilicon layer forming a voltage reference plane. A particular type of MEM device that can be formed with the five-level polysilicon process is a MEM transmission for controlling or interlocking mechanical power transfer between an electrostatic motor and a self-assembling structure (e.g. a hinged pop-up mirror for use with an incident laser beam). The MEM transmission is based on an incomplete gear train and a bridging set of gears that can be moved into place to complete the gear train to enable power transfer. The MEM transmission has particular applications as a safety component for surety, and for this purpose can incorporate a pin-in-maze discriminator responsive to a coded input signal.
Abstract translation: 一种用于形成具有五层或多层多晶硅的复合微机电（MEM）器件的方法，包括可形成机械元件的四个结构多晶硅层，以及形成电压参考平面的下层多晶硅层。 可以使用五电平多晶硅工艺形成的特定类型的MEM器件是用于控制或互锁静电电动机和自组装结构之间的机械功率传递的MEM传输（例如，铰链式弹出式反射镜，用于与 入射激光束）。 MEM传动基于不完整的齿轮系和可以移动到位的桥接齿轮组，以完成齿轮系以实现功率传递。 MEM传输具有特定应用作为保证的安全部件，为此，可以根据编码的输入信号结合引入迷宫识别器。
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