Invention Grant
US08025782B2 Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained 有权
在LIGA技术中制造单层或多层金属结构的方法和获得的结构

  • Patent Title: Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
  • Patent Title (中): 在LIGA技术中制造单层或多层金属结构的方法和获得的结构
  • Application No.: US11717773
    Application Date: 2007-03-14
  • Publication No.: US08025782B2
    Publication Date: 2011-09-27
  • Inventor: Clément Saucy
  • Applicant: Clément Saucy
  • Applicant Address: CH Bienne
  • Assignee: Doniar SA
  • Current Assignee: Doniar SA
  • Current Assignee Address: CH Bienne
  • Agency: Westerman, Hattori, Daniels & Adrian, LLP
  • Priority: EP06405114 20060315
  • Main IPC: C25D1/00
  • IPC: C25D1/00
Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
Abstract:
The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
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