公开(公告)号：US08070970B2

公开(公告)日：2011-12-06

申请号：US12282751

申请日：2007-03-08

Applicant: Clement Saucy

Inventor： Clement Saucy

IPC: B44C1/22

CPC classification number: G03F7/40 ,  C25D1/08 ,  G04B29/022 ,  G04B29/027 ,  G04D3/0069 ,  Y10T428/12486

Abstract: A layer of photoresist is spread on a metal substrate and heated, this layer is exposed through a mask to UV irradiation, the parts not photocured are developed, by dissolving them, so as to obtain a mold, a first layer of metal or of an alloy is galvanically deposited in the open parts of the mold, the metal structure and the mold are leveled by machining so as to obtain a plane upper surface, a metal ply layer is deposited on the entire upper surface, and then the above steps are repeated. A second layer of metal or an alloy is galvanically deposited in the open parts of the mold, the multilayer metal structure obtained is detached from the substrate by delamination and the photoresist is cured, the photoresist is separated so as to free the multilayer metal structure, and then that portion of the metal ply layer or layers which is not inserted between two electrodeposited metal layers is removed.

Abstract translation: 将一层光致抗蚀剂铺展在金属基底上并加热，该层通过掩模暴露于紫外线照射下，通过溶解它们来显影未光固化的部分，以获得模具，第一金属层或 合金在模具的开放部分中电沉积，金属结构和模具通过机械加工平整，以获得平面上表面，金属层层沉积在整个上表面上，然后重复上述步骤 。 金属或合金的第二层电镀沉积在模具的开口部分中，通过分层将所获得的多层金属结构与基板分离，并且光致抗蚀剂被固化，分离光致抗蚀剂以释放多层金属结构， 然后去除不插入在两个电沉积金属层之间的金属层层的那部分。

公开(公告)号：US08025782B2

公开(公告)日：2011-09-27

申请号：US11717773

申请日：2007-03-14

Applicant: Clément Saucy

Inventor： Clément Saucy

IPC: C25D1/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。

公开(公告)号：US20090081476A1

公开(公告)日：2009-03-26

申请号：US12282751

申请日：2007-03-08

Applicant: Clement Saucy

Inventor： Clement Saucy

IPC: B32B15/01 ,  G03F7/26

CPC classification number: G03F7/40 ,  C25D1/08 ,  G04B29/022 ,  G04B29/027 ,  G04D3/0069 ,  Y10T428/12486

Abstract: A layer of photoresist is spread on a metal substrate and heated, this layer is exposed through a mask to UV irradiation, the parts not photocured are developed, by dissolving them, so as to obtain a mould, a first layer of metal or of an alloy is galvanically deposited in the open parts of the mould, the metal structure and the mould are levelled by machining so as to obtain a plane upper surface, a metal ply layer is deposited on the entire upper surface, and then the above steps are repeated. A second layer of metal or an alloy is galvanically deposited in the open parts of the mould, the multilayer metal structure obtained is detached from the substrate by delamination and the photoresist is cured, the photoresist is separated so as to free the multilayer metal structure, and then that portion of the metal ply layer or layers which is not inserted between two electrodeposited metal layers is removed.

Abstract translation: 将一层光致抗蚀剂铺展在金属基底上并加热，该层通过掩模暴露于紫外线照射下，通过溶解它们来显影未光固化的部分，以获得模具，第一金属层或 合金在模具的开放部分中电沉积，金属结构和模具通过机械加工平整，以获得平面上表面，金属层层沉积在整个上表面上，然后重复上述步骤 。 金属或合金的第二层电镀沉积在模具的开口部分中，通过分层将所获得的多层金属结构与基板分离，并且光致抗蚀剂被固化，分离光致抗蚀剂以释放多层金属结构， 然后去除不插入在两个电沉积金属层之间的金属层层的那部分。