Abstract:
Nozzles for an additive manufacturing device and methods for improving wettability of the nozzles are disclosed. The method may include subjecting the nozzle to a surface treatment. The surface treatment may include contacting a surface of the nozzle with one or more surface modifying agents. The surface modifying agents may include one or more of an oxidizing agent, an acid, a base, or combinations thereof. The one or more surface modifying agents may increase an oxygen content of the surface of the nozzle. An inner surface of the nozzle may have a water contact angle of greater than 1° and less than about 90°. The inner surface of the nozzle may be free or substantially free of a coating.
Abstract:
An additive manufacturing system includes a heater for converting a filament of extrusion material into thermoplastic material. The heater has a channel configured to change the cross-sectional shape of the filament to a cross-sectional shape that has a greater surface area than the surface area of the filament before the heater receives the filament. The channel of the heater can also be configured to drive the center portion of the filament toward the heated walls of the channel and to mix thermoplastic material in the channel while exposing the center portion of the filament to the heated wall of the channel.
Abstract:
An apparatus includes a heater for converting a filament of extrusion material into thermoplastic material. The heater has a channel configured to change the cross-sectional shape of the filament to a cross-sectional shape that has a greater surface area than the surface area of the filament before the heater receives the filament. The channel of the heater can also be configured to drive the center portion of the filament toward the heated walls of the channel and to mix thermoplastic material in the channel while exposing the center portion of the filament to the heated wall of the channel.
Abstract:
An imaging blanket comprises a base comprising an elastic polymer and sulfur. A barrier layer is on the base and a surface layer is on the barrier layer. The surface layer comprises an elastomer and a platinum catalyst.
Abstract:
A sensor array assembly including a first sensor array, a second sensor array and a mounting substrate. The first sensor array includes a first process direction width and a first photosite, while the second sensor array includes a second process direction width and a second photosite. The first and second sensor arrays are separately secured on the mounting substrate. The first photosite is in precision alignment with the second photosite.
Abstract:
A method of assembling a plurality of linear arrays from a silicon wafer having a first surface and a second surface opposite the first surface, the first surface having at least a first linear array of sensor/emitter elements and a second linear array of sensor/emitter elements, each arranged parallel relative to a first direction, and a sacrificial portion positioned between the first linear array of sensor/emitter elements and the second linear array of sensor/emitter elements. The method includes: forming a first cavity in the second surface positioned opposite the sacrificial portion and parallel relative to the first direction; forming at least a first through cut, a second through cut, a third through cut and a fourth through cut in the silicon wafer, the first and second through cuts are parallel to the first direction, the third and fourth through cuts are perpendicular to the first direction, the first through cut arranged adjacent to the first linear array of sensor/emitter elements opposite the sacrificial portion, the second through cut arranged adjacent to the second linear array of sensor/emitter elements opposite the sacrificial portion, and the third and fourth through cuts form a first end and a second end, respectively, of a multi-row sensor/emitter chip defined by the first, second, third and fourth through cuts; bonding at least a portion of the multi-row sensor/emitter chip formed by the second surface of the silicon wafer to a mounting substrate; and, removing the sacrificial portion.
Abstract:
A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.
Abstract:
A multi-nozzle extrusion printhead includes a chamber with an inlet to receive an extrusion material and a plurality of outlets fluidly coupled to the chamber. The printhead also includes a plurality of valves that control flow of extrusion material through the fluid outlets to nozzles in the printhead. Each valve includes a member and an electromechanical actuator configured to move the member to a first position to block a flow of the extrusion material through one of the fluid outlets and nozzles and to a second position to enable the flow of the extrusion material through the fluid outlet and nozzles.
Abstract:
A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.
Abstract:
A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.