公开(公告)号：US20180337208A1

公开(公告)日：2018-11-22

申请号：US15596292

申请日：2017-05-16

Applicant: Xerox Corporation

Inventor： Joseph F. Casey ,  Gary D. Redding ,  Craig Alan Zufelt ,  Michael B. Monahan

IPC: H01L27/146 ,  H01L23/544

Abstract: A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.

公开(公告)号：US10134793B1

公开(公告)日：2018-11-20

申请号：US15596292

申请日：2017-05-16

Applicant: Xerox Corporation

Inventor： Joseph F. Casey ,  Gary D. Redding ,  Craig Alan Zufelt ,  Michael B. Monahan

IPC: H04L23/02 ,  H01L27/146 ,  H01L23/544

CPC classification number: H01L27/14632 ,  H01L23/544 ,  H01L27/14634 ,  H01L27/1469 ,  H01L2223/54426

Abstract: A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.