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31.发明申请ASYMMETRICAL MULTILAYER SUBSTRATE, RF MODULE, AND METHOD FOR MANUFACTURING ASYMMETRICAL MULTILAYER SUBSTRATE 有权非对称多层基板，射频模块和制造非对称多层基板的方法公开(公告)号：US20130106528A1
公开(公告)日：2013-05-02
申请号：US13664358
申请日：2012-10-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Romero Christian , Seung Wook Park , Young Do Kweon , Mi Jin Park
CPC classification number: H05K1/0251 , H05K1/162 , H05K3/4602 , H05K2201/09336
Abstract: Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.
Abstract translation: 本文公开了不对称多层基板，RF模块和用于制造非对称多层基板的方法。 不对称多层基板包括芯层，形成在芯层的一侧上并包括第一信号线图案的第一图案层，形成在另一侧上的第二图案层，并且包括第二金属板和第二布线线图案 ，比形成在第二图案层上的芯层薄且包括第一通孔的第一绝缘层和形成在第一绝缘层上并包括第三信号线图案的第三图案层，其中阻抗变换电路包括阻抗负载 并且形成传输线上的寄生电容负载用于在形成在芯层的上侧和下侧方向上的信号线图案之间的信号传输中的阻抗匹配。
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公开(公告)号：US20130029031A1
公开(公告)日：2013-01-31
申请号：US13632614
申请日：2012-10-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jin Jeon , Jong In Ryu , Seung Wan Shin , Seon Hee Moon , Young Do Kweon , Seung Wook Park
IPC: H05K3/00
CPC classification number: H01L21/486 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L2225/06572 , H01L2924/0002 , H05K3/244 , H05K3/427 , H05K3/4602 , H05K3/4605 , H05K3/4644 , H05K2201/0979 , H05K2201/10378 , H01L2924/00
Abstract: A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.
Abstract translation: 一种用于制造插入件的方法包括在包括树脂或陶瓷的绝缘板中形成通孔; 同时在绝缘板的顶表面上形成用于第一上再分配层的抗蚀剂，以及在绝缘板的底表面上的下再分布层的电阻器; 电镀铜以填充通孔并同时沿着设计的电路图形形成第一上再分配层和下再分布层; 以及形成第一上保护层和下保护层以暴露所述第一上再分布层的一部分和所述下再分布层的一部分。
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公开(公告)号：US09236178B2
公开(公告)日：2016-01-12
申请号：US13794684
申请日：2013-03-11
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hwan Yang , Sung Kwon Wi , Jin Hyuck Yang , Young Do Kweon , Sang Moon Lee
CPC classification number: H01F17/04 , H01F5/00 , H01F17/0006 , H01F17/0013 , H01F27/02 , H01F27/292 , H01F2017/048
Abstract: Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.
Abstract translation: 这里公开了线圈部件及其制造方法。 线圈部件包括：电极体，其包括设置在其中的线圈电极，线圈电极具有沉积在其表面上的绝缘膜; 以及形成在电极体的两侧部分并连接到线圈电极的外部端子，其中电极体由混合有磁粉的绝缘材料制成，以改善阻抗特性。
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公开(公告)号：US09235008B2
公开(公告)日：2016-01-12
申请号：US13708860
申请日：2012-12-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Wook Park , Christian Romero , Young Do Kweon , Chang Bae Lee
CPC classification number: G02B6/38 , G02B6/3608 , G02B6/4214
Abstract: Disclosed herein is an optical module including: an optical element mounted on a substrate; and an optical connector mounted corresponding to the optical element so as to change a path of an optical signal of the optical element and transfer the optical signal having the changed path. The optical module may provide various communication performances using an optical connector in which first and second connector parts are optically coupled stably to each other. Particularly, the optical module does not have a silicon optical bench (SiOB) as a medium, thereby making it possible to reduce a thickness of a product.
Abstract translation: 本文公开了一种光学模块，包括：安装在基板上的光学元件; 以及对应于光学元件安装的光学连接器，以便改变光学元件的光学信号的路径并传送具有改变路径的光学信号。 光学模块可以使用其中第一和第二连接器部件彼此稳定地光耦合的光学连接器来提供各种通信性能。 特别地，光学模块不具有硅光学台（SiOB）作为介质，从而可以减小产品的厚度。
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Patent Agency Ranking
公开(公告)号：US09082536B2
公开(公告)日：2015-07-14
申请号：US14137623
申请日：2013-12-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan Yang , Geon Se Chang , Young Do Kweon , Sung Kwon Wi
CPC classification number: H01F5/04 , H01F17/04 , H01F27/29 , H01F2017/0093
Abstract: Disclosed herein is a common mode filter including: a coil part including a conductor coil provided in an insulating part; a plurality of external electrodes provided on the insulating part while being electrically connected to the conductor coil; and a magnetic material part provided in a region between the plurality of external electrodes on the insulating part. By this configuration, impedance characteristics of the common mode filter may be improved.
Abstract translation: 这里公开了一种共模滤波器，包括：线圈部，包括设置在绝缘部中的导体线圈; 多个外部电极，设置在绝缘部分上，同时电连接到导体线圈; 以及设置在绝缘部分上的多个外部电极之间的区域中的磁性材料部分。 通过这种配置，可以提高共模滤波器的阻抗特性。
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公开(公告)号：US20150138741A1
公开(公告)日：2015-05-21
申请号：US14538797
申请日：2014-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seon Hee Moon , Young Do Kweon , Jeong Ho Lee
CPC classification number: H05K1/185 , H01L22/34 , H01L23/14 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H01L2924/3511 , H01L2924/3512 , H05K3/4644 , H05K3/4697
Abstract: There are provided a chip embedded board and a method of manufacturing the same. The chip embedded board includes: a core substrate; a first build-up layer formed on one surface of the core substrate and having a cavity formed therein; a chip disposed in the cavity; and an insulating layer filled in the cavity in which the chip is disposed, wherein one surface of the chip is positioned in a circuit layer positioned at the outermost layer of the first build-up layer.
Abstract translation: 提供了一种芯片嵌入式电路板及其制造方法。 芯片嵌入式板包括：芯基板; 形成在所述芯基板的一个表面上并具有形成在其中的空腔的第一堆积层; 设置在空腔中的芯片; 以及填充在其中设置有芯片的空腔中的绝缘层，其中芯片的一个表面位于位于第一堆积层的最外层的电路层中。
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公开(公告)号：US20140345916A1
公开(公告)日：2014-11-27
申请号：US14169097
申请日：2014-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Wook Park , Young Do Kweon , Jin Gu Kim
IPC: H05K1/11
CPC classification number: H05K3/426 , H05K1/036 , H05K3/108 , H05K3/285 , H05K2201/0959 , H05K2203/1476
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.
Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例的印刷电路板包括基底; 形成为穿透基底基板的贯通孔; 以及形成在基底基板的一侧和另一侧上并形成为比通孔的内壁更薄的电路图案。
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公开(公告)号：US20140166347A1
公开(公告)日：2014-06-19
申请号：US13831720
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yoon Su Kim , Sung Han , Jin Gu Kim , Young Do Kweon
CPC classification number: H05K3/383 , H05K1/097 , H05K3/125 , H05K2201/0215 , H05K2201/0272 , H05K2203/0307 , H05K2203/0773 , H05K2203/1131
Abstract: Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof.
Abstract translation: 本文公开了一种印刷电路板，包括：基底; 以及形成在基底基板上的电路图案，其中包括导电填料，并且在其表面上形成粗糙度。
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39.发明申请公开(公告)号：US20140077896A1
公开(公告)日：2014-03-20
申请号：US14027835
申请日：2013-09-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Dong Hwan LEE , Seung Wook Park , Christian Romero , Young Do Kweon , Jin Gu Kim
IPC: H03H7/01
CPC classification number: H03H7/17 , H05K1/0251 , H05K1/116 , H05K2201/09381
Abstract: The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.
Abstract translation: 本发明涉及具有开口短截线的通孔结构和具有该开口短路的印刷电路板。 根据本发明的实施例，具有开口短截线的通孔结构包括：通过绝缘层的信号传输; 用于连接分别形成在绝缘层上和下面的第一和第二传输线的上和下通孔焊盘和信号传输通孔; 并且提供连接到每个通孔焊盘的外周的至少一个开放短截线以具有形成在绝缘层上和下面的每个接地图案的分流电容。 此外，提供了具有开口短路的通孔的印刷电路板。
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