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    Mobile device with backside capacitive sensor for thermal management of an exterior housing
    31.
    发明授权
    Mobile device with backside capacitive sensor for thermal management of an exterior housing 有权

    公开(公告)号：US09829941B1

    公开(公告)日：2017-11-28

    申请号：US15242483

    申请日：2016-08-19

    Applicant: QUALCOMM Incorporated

    Inventor： Mehdi Saeidi ,  Melika Roshandell ,  Rajat Mittal ,  Ryan Coutts

    IPC: H04M1/00 ,  G06F1/20 ,  H04M1/02

    CPC classification number: G06F1/206 ,  H04M1/0202 ,  H04M2250/12

    Abstract: A mobile device includes an exterior housing, a display, a capacitive sensor, a temperature sensor, and a controller. The capacitive sensor is coupled to the exterior housing at a backside of the mobile device and the temperature sensor is coupled to one or more components of the mobile device. The controller is coupled to the capacitive sensor and to the temperature sensor. The controller is configured to adjust a temperature threshold of the mobile device in response to detecting the presence of a case installed on the exterior housing. The controller is also configured to adjust one or more operating parameters of the mobile device to control a temperature of the exterior housing to below the temperature threshold based on the output of the capacitive sensor and one or more readings of the temperature sensor.

    ACCURATE HOTSPOT DETECTION THROUGH TEMPERATURE SENSORS
    33.
    发明申请
    ACCURATE HOTSPOT DETECTION THROUGH TEMPERATURE SENSORS 有权

    公开(公告)号：US20170168514A1

    公开(公告)日：2017-06-15

    申请号：US14963790

    申请日：2015-12-09

    Applicant: QUALCOMM Incorporated

    Inventor： Rajat Mittal ,  Mehdi Saeidi ,  Arpit Mittal ,  Emil Rahim

    IPC: G05F1/46 ,  G01K13/00

    CPC classification number: G05F1/463 ,  G01K13/00 ,  G06F1/206 ,  G06F1/3206

    Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.

    THERMAL MANAGEMENT OF ELECTRONIC HEADSETS
    36.
    发明申请
    THERMAL MANAGEMENT OF ELECTRONIC HEADSETS 审中-公开
    电子耳机的热管理

    公开(公告)号：US20170060177A1

    公开(公告)日：2017-03-02

    申请号：US14843973

    申请日：2015-09-02

    Applicant: QUALCOMM Incorporated

    Inventor： Emil RAHIM ,  Mehdi Saeidi ,  Arpit Mittal ,  Rajat Mittal

    IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20 ,  G02B27/01

    CPC classification number: G06F1/163 ,  G02B27/0176 ,  G06F1/203 ,  G06F3/011 ,  H05K7/20127 ,  H05K7/20509

    Abstract: Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.

    Abstract translation: 系统和方法涉及电子耳机的热管理，例如虚拟现实耳机。 电子耳机包括可容纳处理系统的主体。 散热器附接到身体，其中散热器包括烟囱。 烟囱旨在消散处理系统产生的热量。 可以根据能够与用户皮肤接触的电子耳机的外表面感觉到的热量来控制散热器来扩展烟囱。 烟囱包括气隙，并提供被动冷却系统。

    Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power
    37.
    发明授权
    Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power 有权
    优化核心测序的算法可最大限度地提高性能并降低芯片的温度和功率

    公开(公告)号：US09557797B2

    公开(公告)日：2017-01-31

    申请号：US14319393

    申请日：2014-06-30

    Applicant: QUALCOMM Incorporated

    Inventor： Rajat Mittal ,  Mehdi Saeidi ,  Tao Xue ,  Ronald Frank Alton ,  Rajit Chandra ,  Sachin Dasnurkar

    IPC: G06F1/32 ,  G06F9/50

    CPC classification number: G06F1/3234 ,  G06F1/28 ,  G06F1/3203 ,  G06F1/3206 ,  G06F1/329 ,  G06F1/3293 ,  G06F9/5094 ,  Y02D10/122 ,  Y02D10/22 ,  Y02D10/24

    Abstract: Aspects include computing devices, systems, and methods for selecting preferred processor core combinations for a state of a computing device. In an aspect, a state of a computing device containing the multi-core processor may be determined. A number of current leakage ratios may be determined by comparing current leakages of the processor cores to current leakages of the other processor cores. The ratios may be compared to boundaries for the state of the computing device in respective inequalities. A processor core associated with a number of boundaries may be selected in response to determining that the respective inequalities are true. The boundaries may be associated with a set of processor cores deemed preferred for an associated state of the computing device. The processor core present in the set of processor cores for each boundary of a true inequality may be the selected processor core.

    Abstract translation: 方面包括用于为计算设备的状态选择优选处理器核心组合的计算设备，系统和方法。 在一方面，可以确定包含多核处理器的计算设备的状态。 可以通过将处理器核心的当前泄漏与其他处理器核心的当前泄漏进行比较来确定多个电流泄漏比。 可以将这些比率与各个不等式中的计算装置的状态的边界进行比较。 响应于确定相应的不等式是真实的，可以选择与多个边界相关联的处理器核心。 边界可以与被认为对于计算设备的相关状态优选的一组处理器核心相关联。 存在于真正不等式的每个边界的处理器核心集合中的处理器核心可以是所选择的处理器核心。

    Algorithm For Preferred Core Sequencing To Maximize Performance And Reduce Chip Temperature And Power
    38.
    发明申请
    Algorithm For Preferred Core Sequencing To Maximize Performance And Reduce Chip Temperature And Power 有权
    优化核心排序的算法以最大限度地提高性能并降低芯片温度和功率

    公开(公告)号：US20150338902A1

    公开(公告)日：2015-11-26

    申请号：US14319393

    申请日：2014-06-30

    Applicant: QUALCOMM Incorporated

    Inventor： Rajat MITTAL ,  Mehdi Saeidi ,  Tao Xue ,  Ronald Frank Alton ,  Rajit Chandra ,  Sachin Dasnurkar

    IPC: G06F1/32

    CPC classification number: G06F1/3234 ,  G06F1/28 ,  G06F1/3203 ,  G06F1/3206 ,  G06F1/329 ,  G06F1/3293 ,  G06F9/5094 ,  Y02D10/122 ,  Y02D10/22 ,  Y02D10/24

    Abstract: Aspects include computing devices, systems, and methods for selecting preferred processor core combinations for a state of a computing device. In an aspect, a state of a computing device containing the multi-core processor may be determined. A number of current leakage ratios may be determined by comparing current leakages of the processor cores to current leakages of the other processor cores. The ratios may be compared to boundaries for the state of the computing device in respective inequalities. A processor core associated with a number of boundaries may be selected in response to determining that the respective inequalities are true. The boundaries may be associated with a set of processor cores deemed preferred for an associated state of the computing device. The processor core present in the set of processor cores for each boundary of a true inequality may be the selected processor core.

    Abstract translation: 方面包括用于为计算设备的状态选择优选处理器核心组合的计算设备，系统和方法。 在一方面，可以确定包含多核处理器的计算设备的状态。 可以通过将处理器核心的当前泄漏与其他处理器核心的当前泄漏进行比较来确定多个电流泄漏比。 可以将这些比率与各个不等式中的计算装置的状态的边界进行比较。 响应于确定相应的不等式是真实的，可以选择与多个边界相关联的处理器核心。 边界可以与被认为对于计算设备的相关状态优选的一组处理器核心相关联。 存在于真正不等式的每个边界的处理器核心集合中的处理器核心可以是所选择的处理器核心。

    DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUITS (ICs) FOR ESTIMATING TEMPERATURE WITHIN THE ICs, AND RELATED SYSTEMS AND METHODS
    39.
    发明申请
    DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUITS (ICs) FOR ESTIMATING TEMPERATURE WITHIN THE ICs, AND RELATED SYSTEMS AND METHODS 审中-公开
    集成电路中用于估算温度的集成电路（IC）中的数字温度估计器（DTE）及相关系统和方法

    公开(公告)号：US20150103866A1

    公开(公告)日：2015-04-16

    申请号：US14091390

    申请日：2013-11-27

    Applicant: QUALCOMM Incorporated

    Inventor： Kambiz Samadi ,  Yang Du ,  Mehdi Saeidi

    IPC: G01K7/42 ,  G01K1/02

    CPC classification number: G01K7/427 ,  G01K1/022 ,  G01K2217/00

    Abstract: Embodiments disclosed in the detailed description include digital temperature estimators (DTEs) disposed in integrated circuits (ICs) for estimating temperature within the ICs. Related systems and methods are also disclosed. In one embodiment, the DTEs can be used to estimate temperatures in an IC by implementing a temperature estimation model (TEM). The TEM can provide an estimated temperature of an IC block disposed in the IC based on activity event(s) associated with the IC block, as opposed to providing temperature sensors in the IC to measure temperature of the IC block directly. The DTEs can be operated in real time so that power and/or thermal regulation systems of the IC can obtain accurate and reliable temperature estimation from the DTEs. In this manner, thermal dissipation in the IC may be regulated more effectively.

    Abstract translation: 在详细描述中公开的实施例包括设置在用于估计IC内的温度的集成电路（IC）中的数字温度估计器（DTE）。 还公开了相关系统和方法。 在一个实施例中，DTE可用于通过实施温度估计模型（TEM）来估计IC中的温度。 与在IC中提供温度传感器以直接测量IC块的温度相反，TEM可以基于与IC块相关联的活动事件来提供设置在IC中的IC块的估计温度。 DTE可以实时操作，使得IC的功率和/或热调节系统可以从DTE获得准确可靠的温度估计。 以这种方式，可以更有效地调节IC中的散热。

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