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公开(公告)号：US10234402B2
公开(公告)日：2019-03-19
申请号：US15480206
申请日：2017-04-05
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , J. K. Leong , Michael Kirk
Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.
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公开(公告)号：US20160377412A1
公开(公告)日：2016-12-29
申请号：US15192962
申请日：2016-06-24
Applicant: KLA-Tencor Corporation
Inventor： Shifang Li , Guoheng Zhao
IPC: G01B11/06
CPC classification number: G01B11/0608 , G01B11/0641 , G01B2210/56 , G01N21/9501 , G01N21/956 , H01L22/12
Abstract: Disclosed are apparatus and methods for determining height of a semiconductor structure. The system includes an illumination module for directing one or more source lines or points towards a specimen having multiple surfaces at different relative heights and a collection module for detecting light reflected from the surfaces. The collection module contains at least two detectors with one slit or pinhole in front of each detector that that are positioned to receive light reflected from one of the surfaces. A first detector receives reflected light from a slit or pinhole that is positioned before a focal point, and a second detector receive reflected light from a slit or pinhole that is positioned after the focal point so that the first and second detector receive light having different intensity values unless the surface is at an optimum focus. The system includes a processor system for determining a height based on the detected light received by the detectors from two of the surfaces.
Abstract translation: 公开了用于确定半导体结构的高度的装置和方法。 该系统包括用于将一个或多个源极线或点指向具有不同相对高度的多个表面的样本的照明模块和用于检测从表面反射的光的收集模块。 收集模块包含至少两个检测器，每个检测器前面具有一个狭缝或针孔，其被定位成接收从一个表面反射的光。 第一检测器接收来自位于焦点之前的狭缝或针孔的反射光，并且第二检测器接收来自位于焦点之后的狭缝或针孔的反射光，使得第一和第二检测器接收具有不同强度的光 值，除非表面处于最佳焦点。 该系统包括处理器系统，用于基于来自两个表面的检测器接收到的检测光来确定高度。
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公开(公告)号：US09194811B1
公开(公告)日：2015-11-24
申请号：US14231412
申请日：2014-03-31
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu
CPC classification number: G01N21/9501 , G01N21/8806
Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. The system includes an illumination optics module for simultaneously scanning two or more structured illumination (SI) patterns across the sample in a scan direction. The SI patterns have a phase shift with respect to each other, and the SI patterns are parallel to the scan direction. The system also includes a collection optics module for collecting output light from the sample in response to the SI patterns that are scanned across the sample and two or more detectors for individually detecting the output light collected for individual ones of the SI patterns. The system includes a controller to generate two or more SI images for the SI patterns based on the individually detected output light and detect defects on the sample by performing a comparison type inspection process based on the two or more SI images.
Abstract translation: 公开了用于检测半导体样品中的缺陷的方法和装置。 该系统包括照射光学模块，用于在扫描方向上同时扫描横跨样本的两个或多个结构化照明（SI）图案。 SI图案相对于彼此具有相移，SI图案与扫描方向平行。 该系统还包括收集光学模块，用于响应于在样本上扫描的SI图案和用于单独检测针对各个SI图案收集的输出光的两个或更多个检测器来收集来自样本的输出光。 该系统包括控制器，用于基于单独检测的输出光产生用于SI图案的两个或更多个SI图像，并且通过基于两个或更多个SI图像执行比较类型检查处理来检测样本上的缺陷。
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公开(公告)号：US20150103348A1
公开(公告)日：2015-04-16
申请号：US14530805
申请日：2014-11-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Jenn-Kuen Leong , Mehdi Vaez-Iravani
CPC classification number: G01N21/9501 , G01N21/21 , G01N21/47 , G01N21/8806 , G01N2201/06113 , H01L22/12 , H01L2924/0002 , H01L2924/00
Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
Abstract translation: 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统，被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件，被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离，其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件，被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器，被配置为检测散射光的不同部分中的一个，并且响应于检测到的光而产生输出，所述检测光用于检测晶片上的缺陷。
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公开(公告)号：US08879056B2
公开(公告)日：2014-11-04
申请号：US13898470
申请日：2013-05-21
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Azmi Kadkly
CPC classification number: F21V5/008 , G01N21/8806 , G01N21/9501 , G01N21/9505
Abstract: Illumination subsystems for multi-spot wafer inspection are provided. One illumination subsystem includes a diffractive optical element configured to separate an illumination light beam into multiple light beams and a refractive lens array positioned in the path of the multiple light beams. The refractive lens array is configured to relay the laser beam waist at the diffractive optical element onto a wafer surface and to separately and simultaneously focus each of the multiple light beams to a wafer for inspection.
Abstract translation: 提供了多点晶圆检查的照明子系统。 一个照明子系统包括被配置为将照明光束分离成多个光束的衍射光学元件和位于多个光束的路径中的折射透镜阵列。 折射透镜阵列被配置为将衍射光学元件处的激光束腰部中继到晶片表面上，并且将多个光束中的每一个分别并且同时聚焦到晶片以进行检查。
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Patent Agency Ranking
公开(公告)号：US20140168774A1
公开(公告)日：2014-06-19
申请号：US13719928
申请日：2012-12-19
Applicant: KLA-TENCOR CORPORATION
Inventor： Guoheng Zhao
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , G02B27/0905 , G02B27/0944 , G02B27/425
Abstract: A system which may be used to generate a plurality of spots on a surface is provided. The spots may be aligned with the incident plane of oblique illumination. The system may include a diffractive optical element configured to split a beam into a plurality of beams by generating a plurality of diffraction orders. The system may also include a focusing lens configured to focus at least some of the plurality of beams on the surface in the plurality of spots. At least some of the plurality of beams may be focused on the surface at an oblique illumination angle. The system may also include an illumination source positioned off-axis relative to an optical axis of the diffractive optical element. Using the system, a plurality of spots may be generated on an inclined surface.
Abstract translation: 提供了可用于在表面上产生多个点的系统。 斑点可以与倾斜照明的入射平面对齐。 该系统可以包括衍射光学元件，其被配置为通过产生多个衍射级将光束分割成多个光束。 该系统还可以包括聚焦透镜，其被配置为将多个光束中的至少一些聚焦在多个光斑中的表面上。 多个光束中的至少一些可以以倾斜照明角度聚焦在表面上。 该系统还可以包括相对于衍射光学元件的光轴离轴设置的照明源。 使用该系统，可以在倾斜表面上产生多个点。
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公开(公告)号：US20140118730A1
公开(公告)日：2014-05-01
申请号：US14062832
申请日：2013-10-24
Applicant: KLA-Tencor Corporation
Inventor： Daniel Ivanov Kavaldjiev , Stephen Biellak , Guoheng Zhao , Mehdi Vaez-Iravani
IPC: G01N21/95 , H01L27/144
CPC classification number: G01N21/9501 , H01L27/1446
Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.
Abstract translation: 介绍了提高高灵敏度检测系统动态范围的方法和系统。 高灵敏度检测系统的动态范围通过将从晶片检查区域的每个像素收集的光的一部分引导到以盖革模式操作的雪崩光电二极管（APD）阵列并且引导从每个 晶片检查区域的像素朝向具有较大范围的另一个光电检测器阵列。 以Geiger模式操作的APD阵列对于检查产生极低光子数的表面是有用的，而其他光电探测器可用于检查产生更大数量的散射光子的较大缺陷。 在一些实施例中，检测到的光场在两个不同的检测器之间被分开。 在一些其他实施例中，单个检测器包括以盖革模式操作的APD和具有较大范围的其它光电探测器。
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公开(公告)号：US10228331B2
公开(公告)日：2019-03-12
申请号：US15847249
申请日：2017-12-19
Applicant: KLA-Tencor Corporation
Inventor： Sheng Liu , Guoheng Zhao
Abstract: This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, and a rotatable analyzer. The system includes a controller for selecting a polarization of the incident beam, obtaining a defect scattering map from the defect, obtaining a surface scattering map from the background surface, and determining a configuration of the polarization components, aperture mask, rotatable waveplate, and analyzer based on analysis of the defect and surface scattering map to maximize a defect signal to noise ratio.
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公开(公告)号：US20180188188A1
公开(公告)日：2018-07-05
申请号：US15480206
申请日：2017-04-05
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , J.K. Leong , Michael Kirk
CPC classification number: G01N21/9505 , G01N21/643 , G01N21/6445 , G01N21/8806 , G01N21/94 , G01N21/9501 , G01N2021/646 , G01N2021/8825 , G01N2021/8854
Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.
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公开(公告)号：US20180073993A1
公开(公告)日：2018-03-15
申请号：US15697386
申请日：2017-09-06
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-ming Benjamin Tsai
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , G01N2021/8825 , G01N2021/8848 , G01N2201/0683 , G06T7/0004 , G06T7/001 , G06T2207/10152 , G06T2207/20212 , G06T2207/30148 , H04N5/2256 , H04N5/23229 , H04N5/2354
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample
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