公开(公告)号：US20130235374A1

公开(公告)日：2013-09-12

申请号：US13783290

申请日：2013-03-02

Applicant: KLA-TENCOR CORPORATION

Inventor： Stephen Biellak ,  Mehdi Vaez-Iravani

IPC: G01N21/88

CPC classification number: G01N21/8806 ,  G01N21/9501

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate a set of spots on a wafer and a collection subsystem configured to collect light from the set of spots. The collection subsystem separately images the light collected from each of the individual spots onto only a corresponding first detector of a first detection subsystem. The collection subsystem also images the light collected from at least some of the individual spots onto a number of second detectors of a second detection subsystem that is less than a number of spots in the set. Output produced by the first and second detectors can be used to detect defects on the wafer.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为照亮晶片上的一组斑点的照明子系统和被配置为收集该组斑点的光的收集子系统。 收集子系统将从每个单个斑点收集的光分别成像到第一检测子系统的对应的第一检测器上。 收集子系统还将从至少一些单个点收集的光成像到第二检测子系统的多个第二检测器，该第二检测子系统小于集合中的多个点。 由第一和第二检测器产生的输出可用于检测晶片上的缺陷。

公开(公告)号：US10690599B1

公开(公告)日：2020-06-23

申请号：US16170954

申请日：2018-10-25

Applicant: KLA-Tencor Corporation

Inventor： Stephen Biellak ,  Tyler Trytko

IPC: G01N21/88 ,  G01T1/24 ,  G01N21/95

Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample and a liquid-cooling coincidence detector, which includes an illumination detector to detect illumination from the sample, a liquid-cooling device for regulating a temperature of the illumination detector via a liquid, and photodetectors to detect light generated in the liquid in response to particle radiation. The liquid-cooling coincidence detector may also include controllers to identify a set of illumination detection events based on an illumination signal received from the illumination detector, identify a set of radiation detection events based on radiation signals received from the photodetectors, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and exclude the set of coincidence events from the set of illumination detection events to generate a set of identified features on the sample.

公开(公告)号：US09841512B2

公开(公告)日：2017-12-12

申请号：US14946563

申请日：2015-11-19

Applicant: KLA-Tencor Corporation

Inventor： Ximan Jiang ,  Anatoly Romanovsky ,  Christian Wolters ,  Stephen Biellak ,  Mous Tatarkhanov

IPC: G01T1/24 ,  G01N21/95

CPC classification number: G01T1/24 ,  G01N21/9501

Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.

公开(公告)号：US09404873B2

公开(公告)日：2016-08-02

申请号：US13783290

申请日：2013-03-02

Applicant: KLA-Tencor Corporation

Inventor： Stephen Biellak ,  Mehdi Vaez-Iravani

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate a set of spots on a wafer and a collection subsystem configured to collect light from the set of spots. The collection subsystem separately images the light collected from each of the individual spots onto only a corresponding first detector of a first detection subsystem. The collection subsystem also images the light collected from at least some of the individual spots onto a number of second detectors of a second detection subsystem that is less than a number of spots in the set. Output produced by the first and second detectors can be used to detect defects on the wafer.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为照亮晶片上的一组斑点的照明子系统和被配置为收集该组斑点的光的收集子系统。 收集子系统将从每个单个斑点收集的光分别成像到第一检测子系统的对应的第一检测器上。 收集子系统还将从至少一些单个点收集的光成像到第二检测子系统的多个第二检测器，该第二检测子系统小于集合中的多个点。 由第一和第二检测器产生的输出可用于检测晶片上的缺陷。

公开(公告)号：US09182358B2

公开(公告)日：2015-11-10

申请号：US13834662

申请日：2013-03-15

Applicant: KLA-Tencor Corporation

Inventor： Zhiwei Xu ,  Christian Wolters ,  Juergen Reich ,  Bret Whiteside ,  Guoheng Zhao ,  Jijen Vazhaeparambil ,  Stephen Biellak ,  Sam Shamouilian ,  Mehdi Vaez-Iravani

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956

Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.

Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。

公开(公告)号：US20140118729A1

公开(公告)日：2014-05-01

申请号：US13662626

申请日：2012-10-29

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George J. Kren

IPC: G01N21/95

CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。