-
公开(公告)号：US20210373257A1
公开(公告)日：2021-12-02
申请号：US17400705
申请日：2021-08-12
Applicant: Juniper Networks, Inc.
Inventor： Jonathan Edgar Roth , Jared Bauters , Gregory Alan Fish
Abstract: An optical coupling device can couple incident light from a fiber into waveguides, but can reduce the coupling of return light from the waveguides into the fiber. A Faraday rotator layer can rotate by forty-five degrees, with a first handedness, respective planes of polarization of incident beams, and can rotate by forty-five degrees, with a second handedness opposite the first handedness, respective planes of polarization of return beams. A redirection layer can include at least one grating coupler that can redirect an incident beam of one polarization so that the redirected path extends within the redirection layer toward a first waveguide, and can redirect an incident beam of an opposite polarization so that the redirected path extends within the redirection layer toward a second waveguide. An optional birefringent layer can spatially separate incident beam having different polarizations, so that two single-polarization grating couplers can be used.
-
Patent Agency Ranking
公开(公告)号：US11051431B2
公开(公告)日：2021-06-29
申请号：US16022924
申请日：2018-06-29
Applicant: Juniper Networks, Inc.
Inventor： Roberto Marcoccia , Brian Robert Koch , Theodore J. Schmidt , Christopher Paul Wyland , Robert S. Guzzon , Gregory Alan Fish
Abstract: Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.
-
公开(公告)号：US10998252B2
公开(公告)日：2021-05-04
申请号：US16791315
申请日：2020-02-14
Applicant: Juniper Networks, Inc.
Inventor： Erik Johan Norberg , Naser Dalvand , Gregory Alan Fish
IPC: H01L23/42 , H01L29/868 , H01L27/12 , H01L21/768 , H01L29/66 , H01L23/36
Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
-
公开(公告)号：US20200211923A1
公开(公告)日：2020-07-02
申请号：US16791315
申请日：2020-02-14
Applicant: Juniper Networks, Inc.
Inventor： Erik Johan Norberg , Naser Dalvand , Gregory Alan Fish
IPC: H01L23/42 , H01L23/36 , H01L27/12 , H01L21/768 , H01L29/66 , H01L29/868
Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
-
公开(公告)号：US20190199061A1
公开(公告)日：2019-06-27
申请号：US16286373
申请日：2019-02-26
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
CPC classification number: H01S5/0085 , G01J3/02 , G01J9/0246 , G02B6/12007 , G02B6/29353 , G02B6/29395 , G02B6/29398 , H01S5/0264 , H01S5/0607 , H01S5/0612 , H01S5/0617 , H01S5/06804 , H01S5/0687
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
-
公开(公告)号：US10256607B2
公开(公告)日：2019-04-09
申请号：US16155113
申请日：2018-10-09
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
-
-
-
-
-
Search Results
36
records
(took 0.019 seconds)
