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1.发明授权公开(公告)号：US11237325B2
公开(公告)日：2022-02-01
申请号：US16844492
申请日：2020-04-09
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Gregory Alan Fish , Martin A. Spannagel , Antonio Labaro
IPC: G02B6/12 , H01L21/12 , G02B6/122 , H01L21/762 , H01L21/02 , H01L21/306 , G02B6/132 , G02B6/136
Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
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公开(公告)号：US20200008321A1
公开(公告)日：2020-01-02
申请号：US16022924
申请日：2018-06-29
Applicant: Juniper Networks, Inc.
Inventor： Roberto Marcoccia , Brian Robert Koch , Theodore J. Schmidt , Christopher Paul Wyland , Robert S. Guzzon , Gregory Alan Fish
Abstract: Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.
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公开(公告)号：US20190064457A1
公开(公告)日：2019-02-28
申请号：US15685114
申请日：2017-08-24
Applicant: Juniper Networks, Inc.
Inventor： Jonathan Edgar Roth , Jared Bauters , Gregory Alan Fish
IPC: G02B6/42
CPC classification number: G02B6/4213 , G02B6/272 , G02B6/2773 , G02B6/34 , G02B6/4206 , G02B6/4208
Abstract: An optical coupling device can couple incident light from a fiber into waveguides, but can reduce the coupling of return light from the waveguides into the fiber. A Faraday rotator layer can rotate by forty-five degrees, with a first handedness, respective planes of polarization of incident beams, and can rotate by forty-five degrees, with a second handedness opposite the first handedness, respective planes of polarization of return beams. A redirection layer can include at least one grating coupler that can redirect an incident beam of one polarization so that the redirected path extends within the redirection layer toward a first waveguide, and can redirect an incident beam of an opposite polarization so that the redirected path extends within the redirection layer toward a second waveguide. An optional birefringent layer can spatially separate incident beam having different polarizations, so that two single-polarization grating couplers can be used.
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公开(公告)号：US09825429B1
公开(公告)日：2017-11-21
申请号：US15601139
申请日：2017-05-22
Applicant: Juniper Networks, Inc.
Inventor： Erik Norberg , Brian R. Koch , Gregory Alan Fish
CPC classification number: H01S5/1028 , H01S5/021 , H01S5/026 , H01S5/0425 , H01S5/1014 , H01S5/1032 , H01S5/50 , H01S5/5027 , H04B10/25 , H04B10/66 , H04J14/02
Abstract: Described herein are methods, systems, and apparatuses to utilize a semiconductor optical amplifier (SOA) comprising a silicon layer including a silicon waveguide, a non-silicon layer disposed on the silicon layer and including a non-silicon waveguide, first and second mode transition region comprising tapers in the silicon waveguide and/or the non-silicon waveguide for exchanging light between the waveguide, and a plurality of regions disposed between the first and second mode transition regions comprising different cross-sectional areas of the silicon waveguide and the non-silicon waveguide such that confinement factors for the non-silicon waveguide in each of the plurality of regions differ.
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公开(公告)号：US10965369B2
公开(公告)日：2021-03-30
申请号：US16854012
申请日：2020-04-21
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Brian Robert Koch , Gregory Alan Fish , Hyundai Park
IPC: H04B10/077 , G02B6/12 , H01L31/0224 , H01L31/0232 , H01L31/0304 , H01L31/0352 , H01L31/105 , H04B10/40
Abstract: Photonically integrated normal incidence photodetectors (NIPDs) and associated in-plane waveguide structures optically coupled to the NIPDs can be configured to allow for both in-plane and normal-incidence detection. In photonic circuits with light-generation capabilities, such as integrated optical transceivers, the ability of the NIPDs to detect in-plane light is used, in accordance with some embodiments, to provide self-test functionality.
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Patent Agency Ranking
公开(公告)号：US10263390B2
公开(公告)日：2019-04-16
申请号：US15689338
申请日：2017-08-29
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
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7.发明申请公开(公告)号：US20190072715A1
公开(公告)日：2019-03-07
申请号：US16181868
申请日：2018-11-06
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Gregory Alan Fish , Martin A. Spannagel , Antonio Labaro
IPC: G02B6/122 , G02B6/136 , G02B6/132 , H01L21/306 , H01L21/02 , H01L21/762
Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
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公开(公告)号：US20190052053A1
公开(公告)日：2019-02-14
申请号：US16155113
申请日：2018-10-09
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
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9.发明申请公开(公告)号：US20180203188A1
公开(公告)日：2018-07-19
申请号：US15408725
申请日：2017-01-18
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Gregory Alan Fish , Martin A. Spannagel , Antonio Labaro
IPC: G02B6/122 , H01L21/762 , H01L21/02 , H01L21/306 , G02B6/132 , G02B6/136
CPC classification number: G02B6/122 , G02B6/132 , G02B6/136 , H01L21/02164 , H01L21/0217 , H01L21/02178 , H01L21/02181 , H01L21/02186 , H01L21/02189 , H01L21/0228 , H01L21/30617 , H01L21/76251
Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
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公开(公告)号：US20180102627A1
公开(公告)日：2018-04-12
申请号：US15689338
申请日：2017-08-29
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
IPC: H01S5/0687 , H01S5/06 , G02B6/293
CPC classification number: H01S5/06804 , G01J3/02 , G01J9/0246 , G02B6/29353 , G02B6/29395 , G02B6/29398 , H01S5/0607 , H01S5/0612 , H01S5/0617 , H01S5/0687
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
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