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    Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them
    31.
    发明授权
    Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them 有权

    公开(公告)号：US12189828B2

    公开(公告)日：2025-01-07

    申请号：US17942773

    申请日：2022-09-12

    Applicant: Frederick A. Flitsch

    Inventor： Frederick A. Flitsch

    IPC: G06F21/72 ,  G06F1/16 ,  G06F21/60 ,  G06F21/87 ,  G09C1/00 ,  H04L9/08 ,  H04L9/12 ,  H04L9/40

    Abstract: The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.

    Method of forming a cleanspace fabricator
    39.
    发明授权
    Method of forming a cleanspace fabricator 有权

    公开(公告)号：US09793146B2

    公开(公告)日：2017-10-17

    申请号：US14024335

    申请日：2013-09-11

    Applicant: Frederick A. Flitsch

    Inventor： Frederick A. Flitsch

    IPC: H01L21/677 ,  B01L1/04 ,  H01L21/67

    CPC classification number: H01L21/67712 ,  B01L1/04 ,  H01L21/67017 ,  H01L21/677 ,  Y10T29/41 ,  Y10T29/49 ,  Y10T29/49826

    Abstract: A fab can be constructed as a round or rectangular annular tube with a primary cleanspace located in-between its inner and outer tubes. The fab can be encircled with levels upon which tools can be densely packed while preserving unidirectional air flow. If only tool ports are inside, and robotics are used, primary cleanspace size can be minimized. Highly simplified robotics can be used. Tools can be removed and repaired centrally. A secondary cleanspace can be added for tool bodies. Multilevel construction enhances use of prefabricated units for fab build or maintenance. Curves or folds, applied to a conventional planar cleanroom, can construct a wide range of fab geometries, including a tubular non-annular fab. A fab can also be constructed according to a curved or non-curved sectional cut of an annular tube. A novel fab, of a non-curved section, can include a non-segmented cleanspace or have its tools vertically stacked.

    METHODS OF PROTOTYPING AND MANUFACTURING WITH CLEANSPACE FABRICATORS
    40.
    发明申请
    METHODS OF PROTOTYPING AND MANUFACTURING WITH CLEANSPACE FABRICATORS 审中-公开
    用清洁布制作的原型和制造方法

    公开(公告)号：US20160358795A1

    公开(公告)日：2016-12-08

    申请号：US15241419

    申请日：2016-08-19

    Applicant: Frederick A. Flitsch

    Inventor： Frederick A. Flitsch

    IPC: H01L21/67

    CPC classification number: H01L21/67178 ,  B08B15/00 ,  G05B19/418 ,  G05B2219/45031 ,  H01L21/67017 ,  H01L21/67276 ,  H01L21/67727 ,  Y10T29/53096

    Abstract: The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form.

    Abstract translation: 本发明提供了在清洁空间制造者内处理多种类型的底物或者用于在多种类型的清洁空间环境中处理多种或单种类型的底物的各个方面。 在一些实施例中，并置复合清洁空间制造者可以能够将半导体器件处理成集成电路，然后执行组装操作以产生封装形式的产品。

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