公开(公告)号：US09604808B2

公开(公告)日：2017-03-28

申请号：US14671152

申请日：2015-03-27

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Gary Edward Merz

IPC: B65H18/28 ,  B32B17/06 ,  B32B3/08 ,  B32B7/12 ,  B32B37/14 ,  B65H18/00

CPC classification number: B65H18/28 ,  B32B3/08 ,  B32B7/12 ,  B32B17/06 ,  B32B17/064 ,  B32B37/142 ,  B32B2250/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/20 ,  B32B2307/546 ,  B32B2405/00 ,  B32B2457/20 ,  B65H18/00 ,  B65H18/145 ,  B65H20/02 ,  B65H20/06 ,  B65H20/20 ,  Y10T156/10 ,  Y10T428/24777

Abstract: A glass ribbon coated with a flexible material, the flexible coating forming a flexible web portion that extends from an edge of the glass ribbon at least one millimeter. The flexible web portion can be used to facilitate handling of the glass ribbon in a manufacturing process, and may include registration markings, or perforations, that further facilitate precise positioning of the ribbon.

公开(公告)号：US20160009068A1

公开(公告)日：2016-01-14

申请号：US14769964

申请日：2014-02-24

Applicant: Sean Matthew GARNER ,  CORNING INCORPORATED

Inventor： Sean Matthew Garner

IPC: B32B38/00 ,  B32B17/06 ,  B32B37/18 ,  B29C53/00 ,  B32B37/14

CPC classification number: B32B38/0012 ,  B29C53/005 ,  B32B1/00 ,  B32B17/064 ,  B32B17/10 ,  B32B37/144 ,  B32B37/182 ,  B32B2307/546 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20

Abstract: A method of forming a flexible glass-polymer laminate structure includes heating a polymer layer to an elevated temperature of greater than 20° C. and below a working temperature of a flexible glass substrate adjacent the polymer layer. The flexible glass substrate has a thickness of no more than about 0.3 mm. The flexible glass substrate is shaped with the polymer layer at the elevated temperature. The polymer layer is cooled below the elevated temperature such that the flexible glass-polymer laminate structure maintains a non-planar formation.

Abstract translation: 形成柔性玻璃 - 聚合物层压结构的方法包括将聚合物层加热到高于20℃的高温并且低于邻近聚合物层的柔性玻璃基板的工作温度。 柔性玻璃基板的厚度不大于约0.3mm。 柔性玻璃基板在聚合物层处于升高的温度下成型。 聚合物层在升高的温度下冷却，使得柔性玻璃 - 聚合物层压结构保持非平面形成。

公开(公告)号：US20150299020A1

公开(公告)日：2015-10-22

申请号：US14646865

申请日：2013-11-21

Applicant: CORNING INCORPORATED

Inventor： Yixing Bao ,  Peter Lawrence Bocko ,  Sean Matthew Garner ,  Yichun Wang

IPC: C03B33/10 ,  B32B3/26 ,  B32B5/18 ,  B32B27/36 ,  B32B27/32

CPC classification number: C03B33/105 ,  B32B3/266 ,  B32B5/18 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/246 ,  B32B2307/51 ,  B32B2307/536 ,  C03B33/10

Abstract: Pads, for cutting thin glass on machines designed for thicker glass, are provided with variable viscoelasticity. In further examples, methods of cutting a thin sheet of glass on a machine designed for thicker glass include the step of placing a pad between a working surface and the sheet of glass. In still further examples, methods of forming a scribing mark on a sheet of glass include the step of placing a compressible pad between a sheet of glass and a working surface.

Abstract translation: 用于在较厚玻璃设计的机器上切割薄玻璃的垫片具有可变的粘弹性。 在另外的实施例中，在设计用于较厚玻璃的机器上切割薄片玻璃的方法包括在工作表面和玻璃板之间放置垫的步骤。 在另外的实例中，在玻璃板上形成划线标记的方法包括将可压缩垫放置在玻璃板和工作表面之间的步骤。

公开(公告)号：US20140342148A1

公开(公告)日：2014-11-20

申请号：US13894999

申请日：2013-05-15

Applicant: CORNING INCORPORATED

Inventor： Dana Craig Bookbinder ,  Gary Stephen Calabrese ,  Theresa Chang ,  Sean Matthew Garner ,  Robert Randall Hancock, JR. ,  Jennifer Lynn Lyon

IPC: B32B17/10 ,  B32B37/02

CPC classification number: B32B17/10036 ,  B32B7/12 ,  B32B17/06 ,  B32B37/02 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/105 ,  B32B2457/20 ,  G02F1/133305 ,  Y10T156/10 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/31623

Abstract: A glass structure and a method for creating the glass structure include a glass carrier layer and a flexible glass substrate. The glass structure includes an intermediate layer at least temporarily bonding the flexible glass substrate to the glass carrier layer. The intermediate layer includes a first debond layer attached to an adhesion layer. The first debond layer is at least partially resistant to a high temperature processing of the glass structure at a temperature of greater than or equal to about 500° C. The first debond layer is configured to enable the flexible glass substrate to be debonded from the glass carrier layer after the high temperature processing of the glass structure. A method for processing the glass structure includes debonding the flexible glass substrate from the glass carrier layer after the high temperature process.

Abstract translation: 玻璃结构和用于制造玻璃结构的方法包括玻璃载体层和柔性玻璃基底。 玻璃结构包括至少将柔性玻璃基板临时粘合到玻璃载体层的中间层。 中间层包括附着在粘合层上的第一脱粘层。 第一脱粘层在大于或等于约500℃的温度下至少部分地抵抗玻璃结构的高温处理。第一剥离层被配置为使得柔性玻璃基板能够从玻璃脱粘 载体层经高温处理后的玻璃结构。 处理玻璃结构的方法包括在高温处理之后从玻璃载体层剥离柔性玻璃基板。

公开(公告)号：US12100729B2

公开(公告)日：2024-09-24

申请号：US18522502

申请日：2023-11-29

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  David Robert Heine

IPC: H01L27/15 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L33/62 ,  H01L2933/0066

Abstract: A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

公开(公告)号：US20230361094A1

公开(公告)日：2023-11-09

申请号：US18026168

申请日：2021-11-17

Applicant: CORNING INCORPORATED

Inventor： Ya-Huei Chang ,  Sean Matthew Garner ,  David Robert Heine

IPC: H01L25/16 ,  C03C17/06 ,  H01L27/12

CPC classification number: H01L25/167 ,  C03C17/06 ,  H01L27/1214

Abstract: A glass substrate with improved microLED transfer characteristics is disclosed, the glass substrate comprising a first major surface, a second major surface opposite the first major surface, and a thickness therebetween. An electrically functional layer may be disposed on the first major surface. The glass wafer exhibits a waviness with a magnitude less than or equal to about 1 μm in a spatial wavelength range from about 0.25 mm to about 50 mm.

公开(公告)号：US11753334B2

公开(公告)日：2023-09-12

申请号：US17010275

申请日：2020-09-02

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Michael Lesley Sorensen

IPC: C03C21/00 ,  B32B17/10 ,  B32B17/06 ,  C03C3/076 ,  C03C3/078 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  C03C4/18

CPC classification number: C03C21/002 ,  B32B17/061 ,  B32B17/10 ,  B32B17/10137 ,  C03C3/076 ,  C03C3/078 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  C03C4/18

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

公开(公告)号：US20230242441A1

公开(公告)日：2023-08-03

申请号：US18119330

申请日：2023-03-09

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Michael Lesley Sorensen

IPC: C03C21/00 ,  B32B17/10 ,  B32B17/06 ,  C03C3/076 ,  C03C3/078 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  C03C4/18

CPC classification number: C03C21/002 ,  B32B17/10 ,  B32B17/10137 ,  B32B17/061 ,  C03C3/076 ,  C03C3/078 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  C03C4/18

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

公开(公告)号：US20230099647A1

公开(公告)日：2023-03-30

申请号：US17905373

申请日：2021-02-25

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  David Andrew Pastel ,  Dean Michael Thelen

IPC: H01L25/16 ,  H01L33/62

Abstract: An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface. The edge surface includes a radius of curvature extending between the first major surface and the second major surface. The electronic apparatus includes an opto-electronic device positioned on the first major surface. The electronic apparatus includes an electrical component positioned on the second major surface. The electronic apparatus includes a first electrically-conductive trace attached to the edge surface. The first electrically-conductive trace electrically connects a first portion of the opto-electronic device to the electrical component and defines a first current path. The electronic apparatus includes a second electrically-conductive trace extending through an opening in the substrate. The second electrically-conductive trace electrically connects a second portion of the opto-electronic device to the electrical component and defines a second current path different than the first current path.

公开(公告)号：US20220319868A1

公开(公告)日：2022-10-06

申请号：US17641540

申请日：2020-09-09

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Robert George Manley ,  Rajesh Vaddi

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H01L21/768 ,  H01L21/306

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.