公开(公告)号：US20230345771A1

公开(公告)日：2023-10-26

申请号：US18346059

申请日：2023-06-30

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230061457A1

公开(公告)日：2023-03-02

申请号：US18049868

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230013772A1

公开(公告)日：2023-01-19

申请号：US17935770

申请日：2022-09-27

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Chung-chia CHEN ,  Yu-hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US20220344417A1

公开(公告)日：2022-10-27

申请号：US17389934

申请日：2021-07-30

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Chung-Chia CHEN ,  Yu Hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US20220077252A1

公开(公告)日：2022-03-10

申请号：US17193347

申请日：2021-03-05

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.